JPS6088564U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6088564U JPS6088564U JP18158883U JP18158883U JPS6088564U JP S6088564 U JPS6088564 U JP S6088564U JP 18158883 U JP18158883 U JP 18158883U JP 18158883 U JP18158883 U JP 18158883U JP S6088564 U JPS6088564 U JP S6088564U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- leads
- tips
- semiconductor equipment
- led out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のフラットパッケージ形半導体装置を示す
平面図および正面図、第２図は従来のフラットパッケー
ジの取付の模様を示す斜視図、第３図はその側面図、第
４図は取付時の位置ずれを示す側面図、第５図は本考案
にかかる半導体装置の外部接続用リードの構造を示す斜
視図、第６図は本考案にかかる半導体装置を取付けるプ
リント基板の配線パターンを示す図、第７図は本考案に
かかる半導体装置の製造工程を示す工程図である。
１．１１・・・本体、１ａ、１１ａ・・・主平面、２゜
１２・・・・・・外部接続用リード、２１．２２・・・
接続用パッド。Figure 1 is a plan view and front view showing a conventional flat package type semiconductor device, Figure 2 is a perspective view showing how a conventional flat package is mounted, Figure 3 is a side view thereof, and Figure 4 is when it is installed. FIG. 5 is a perspective view showing the structure of the external connection lead of the semiconductor device according to the present invention, and FIG. 6 is a diagram showing the wiring pattern of the printed circuit board on which the semiconductor device according to the present invention is attached. , FIG. 7 is a process diagram showing the manufacturing process of the semiconductor device according to the present invention. 1.11...Main body, 1a, 11a...Main plane, 2゜12...External connection lead, 21.22...
Connection pad.
Claims (1)
行に導出されたフラットパッケージ形の半導体装置にお
いて、 前記導出された各リードは下方折曲げ部を有するととも
に隣り合った各リードの先端部が互いに逆方向を向きか
つこれらの先端部の下面が同一平面をなすような取付部
を備えたことを特徴とする半導体装置。[Claims for Utility Model Registration] In a flat package type semiconductor device in which a plurality of external connection leads are led out parallel to each other from an end face of a main body, each of the led out leads has a downwardly bent portion and an adjacent lead. What is claimed is: 1. A semiconductor device comprising a mounting portion such that the tips of the leads facing in opposite directions and the lower surfaces of these tips are flush with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18158883U JPS6088564U (en) | 1983-11-25 | 1983-11-25 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18158883U JPS6088564U (en) | 1983-11-25 | 1983-11-25 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6088564U true JPS6088564U (en) | 1985-06-18 |
Family
ID=30393455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18158883U Pending JPS6088564U (en) | 1983-11-25 | 1983-11-25 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6088564U (en) |
-
1983
- 1983-11-25 JP JP18158883U patent/JPS6088564U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6088564U (en) | semiconductor equipment | |
| JPS6059561U (en) | semiconductor equipment | |
| JPS6139952U (en) | semiconductor equipment | |
| JPS6081659U (en) | semiconductor equipment | |
| JPS5844871U (en) | wiring board | |
| JPS5942982U (en) | Semiconductor package test substrate | |
| JPS60166149U (en) | Semiconductor device mounting structure | |
| JPS6096846U (en) | Semiconductor integrated circuit device | |
| JPS5920675U (en) | Laminated structure of printed wiring board | |
| JPS5965563U (en) | printed wiring board | |
| JPS58124977U (en) | Circuit element mounting structure | |
| JPS5832657U (en) | semiconductor equipment | |
| JPS59180449U (en) | semiconductor equipment | |
| JPS5978650U (en) | Printed board | |
| JPS5984858U (en) | Electronic component mounting structure | |
| JPS5958967U (en) | Printed wiring board component mounting structure | |
| JPS60192475U (en) | printed wiring board equipment | |
| JPS60183468U (en) | Conductor pattern shape of board | |
| JPS59154788U (en) | integrated circuit socket | |
| JPS6096860U (en) | Flexible circuit board for small equipment | |
| JPS60119757U (en) | integrated circuit device | |
| JPS606237U (en) | printed wiring board | |
| JPS6094864U (en) | Hybrid integrated circuit device | |
| JPS59143093U (en) | Electronic component mounting board | |
| JPS60130672U (en) | printed wiring board |