JPS6092406A - Production of bond dresser - Google Patents
Production of bond dresserInfo
- Publication number
- JPS6092406A JPS6092406A JP20121283A JP20121283A JPS6092406A JP S6092406 A JPS6092406 A JP S6092406A JP 20121283 A JP20121283 A JP 20121283A JP 20121283 A JP20121283 A JP 20121283A JP S6092406 A JPS6092406 A JP S6092406A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- diamond grains
- sintered
- dresser
- bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000010432 diamond Substances 0.000 claims description 45
- 229910003460 diamond Inorganic materials 0.000 claims description 44
- 239000000843 powder Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 239000002390 adhesive tape Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 238000009826 distribution Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005056 compaction Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000003340 mental effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Powder Metallurgy (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
研削砥石ドレッシング用のダイヤモンド工具には大粒の
ダイヤモンド結晶を用いる単石ドレッサの他に、ｍ粒の
ダイヤモンドを焼結金属中に分散させたいわゆるインプ
リドレッサがある。用途に合わせてダイヤモンドの粒度
と密度、焼結金属（以下ボンドという）の処方などを調
節することができ、一般に切れ味がよく寿命が長く経済
的などの特長がある。DETAILED DESCRIPTION OF THE INVENTION Diamond tools for dressing a grinding wheel include a single-stone dresser using large diamond crystals and a so-called implied dresser in which m-grain diamonds are dispersed in a sintered metal. The grain size and density of the diamond, the formulation of the sintered metal (hereinafter referred to as bond), etc. can be adjusted to suit the application, and it generally has features such as sharpness, long life, and economy.
本発明はこの種のドレッサで、２５メツシュ前後の比較
的に粗粒のダイヤモンドを硬質のボンドに混ぜたボンド
ドレッサと称される工具に関するものである。The present invention relates to this type of dresser, a tool called a bond dresser, in which relatively coarse diamond of about 25 mesh is mixed with hard bond.
第１図はボンドドレッサの１例で、ダイヤモンドを含む
焼結片１′を鋼製のシャンク２に取付けた構成からな９
、焼結片１の先端面３ｔ−回転する砥石に押し当ててド
レッシングを行９゜第２図紘頭部の断面を示し、焼結片
１は焼結金属４の中にダイヤモンド粒５が分散した構造
で、使用により先端３が減耗すれば内部のダイヤモンド
粒が遂次表面に露出し、焼結片が消尽するまで使用でき
る。Figure 1 shows an example of a bonded dresser, which has a structure in which a sintered piece 1' containing diamond is attached to a steel shank 2.
, Tip surface 3t of sintered piece 1 - Dressed by pressing it against a rotating grindstone 9゜ Figure 2 shows a cross section of the head of the sintered piece 1. Diamond grains 5 are dispersed in the sintered metal 4 of the sintered piece 1. With this structure, when the tip 3 wears down with use, the diamond grains inside are gradually exposed to the surface, and it can be used until the sintered pieces are exhausted.
焼結片１はダイヤモンド粒５を含む部６Ｏ基部にシャン
クに取付けるためのダイヤモンド粒を含まぬ部７を設け
、両者を１体に焼結成形することが多い。The sintered piece 1 is often provided with a part 7 not containing diamond grains for attachment to the shank at the base of the part 6O containing the diamond grains 5, and the two parts are sintered into one body.
なお第３図は焼結片１′が円柱状のボンドドレッサで、
この他にも各種形状があるが、いずれも構造は基本的に
は上述と等しい。In addition, Fig. 3 shows a bond dresser in which the sintered piece 1' is cylindrical.
There are various other shapes, but the structures of all of them are basically the same as those described above.
ダイヤモンド部６は、ボンド原料の金属粉末にダイヤモ
ンドを混合した粉体を加圧、加熱して焼結成形さＪ’Ｌ
る。ダイヤモンドを含まぬ部７も同時に一体に焼結して
焼結片１が成形される。従来のこの製法においてはダイ
ヤモンド部６の中のダイヤモンド粒の分布の均一性が確
保し難い欠点があった。すなわちダイヤモンド粒が密に
集中した部位と粗に分散した部位とが生じ、その分布状
態り予ｏ１１」できない。ドレッシングに使用して減耗
するに従い上述の分布の断面が遂次表面に表われる。The diamond part 6 is sintered and formed by pressurizing and heating a powder obtained by mixing diamond with metal powder as a bond raw material.
Ru. The diamond-free portion 7 is also sintered together at the same time to form the sintered piece 1. This conventional manufacturing method has the disadvantage that it is difficult to ensure uniformity of the distribution of diamond grains in the diamond portion 6. In other words, there are areas where the diamond grains are densely concentrated and areas where they are loosely dispersed, and the distribution state cannot be predicted. As the material is used for dressing and wears down, the above-mentioned cross-section of the distribution gradually appears on the surface.
表面とはすなわちドレッシング作用を行う面であって、
面上に存在するダイヤモンド粒の密度が変化するのでド
レッシング性能が一定しナイ。The surface is the surface that performs the dressing action,
Dressing performance is not constant because the density of diamond grains on the surface changes.
本発明の目的はボンドドレッサの、ダイヤモンド粒を均
一に分布させる製造法を提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing a bond dresser in which diamond grains are uniformly distributed.
本発明においては、平面的に規則的に配列したダイヤモ
ンド粒の１層と、相当する量のボンド材料粉末とからな
る圧粉体または半焼結体を複数個重ねてホットプレスす
ることにより一体化して焼結片金製作するものである。In the present invention, a plurality of green compacts or semi-sintered compacts each consisting of one layer of diamond grains regularly arranged in a plane and a corresponding amount of bonding material powder are stacked and hot-pressed to integrate them. It is manufactured from a sintered piece of metal.
以下実施例について詳述する。Examples will be described in detail below.
第４図は金属の薄板８に、ダイヤモンド粒に相当する大
きさの円穴９を多数あけたもので、この穴あき板１０の
下面に接着テープを貼付け、上面にダイヤモンド粒を撒
布すれば穴に陥入したダイヤモンド粒は接着テープに粘
着してその位置に留まり、余剰のダイヤモンド粒は容易
に除かれて、規則正しい一層配列を得る。第６図はこの
状態の断面図でｌＯは穴あき板、１１は接着テープ、５
はダイヤモンド粒である。これを第７図のように圧粉用
の金型１２ 、１３の中に置き、ボンド材料粉体１５に
−盛ってバンチ１４により加圧成形する。第８図の成形
体から穴あき板ＩＯおよび接着テープ１１を離脱すれば
、第９図のように圧粉体１６の一面に規則正しく配列す
るダイヤモンド粒５を保持する成形体１７ｔ−得る。Figure 4 shows a thin metal plate 8 with many circular holes 9 of a size corresponding to diamond grains.Adhesive tape is pasted on the bottom surface of this perforated plate 10, and diamond grains are sprinkled on the top surface to make the holes. The invaginated diamond grains stick to the adhesive tape and remain in place, and the excess diamond grains are easily removed to obtain a regular, single-layer arrangement. Figure 6 is a cross-sectional view of this state, where IO is a perforated plate, 11 is an adhesive tape, and 5
is a diamond grain. This is placed in molds 12 and 13 for powder compaction as shown in FIG. When the perforated plate IO and the adhesive tape 11 are removed from the molded body shown in FIG. 8, a molded body 17t holding the diamond grains 5 regularly arranged on one surface of the powder compact 16 as shown in FIG. 9 is obtained.
この成形体を第１Ｏ図のように複数個重ねて、ホットプ
レス用の黒鉛型に装填し加圧、加熱して第１１図の焼結
片Ｉとする。焼結片頭の内部り焼結金属４の中にダイヤ
モンド粒５が規則正しく配列する。なお第１０図１９は
ダイヤモンド粒を含まない圧粉体で、１７等と等しく第
７図の金型により成形する。焼結片２０ｔ−シャンクに
ろう付した上で、先端面をＧＯ砥石などで加工し表層部
を覆う焼結金属を削り落してダイヤモンド粒を露出させ
てボンドドレッサを完成する工程は従来に等しい。A plurality of the molded bodies are stacked as shown in FIG. 1O, loaded into a hot press graphite mold, pressed and heated to form a sintered piece I shown in FIG. 11. Diamond grains 5 are regularly arranged in the sintered metal 4 inside the single sintered head. Note that FIG. 10 and 19 are green compacts that do not contain diamond particles, and are molded using the mold shown in FIG. 7, which is the same as No. 17 and the like. The process of completing a bond dresser by brazing a 20t sintered piece to a shank, processing the tip surface with a GO grindstone, scraping off the sintered metal covering the surface layer, and exposing the diamond grains is the same as the conventional process.
第１θ図において、圧粉体１７のダイヤモンド粒の間の
空所に次層１８のダイヤモンド粒が位置するように遂次
重ねる。このために穴あき板は第４図のものと、穴の配
置を変えた第５図のものとを交互に使用する。In FIG. 1θ, the diamond grains of the next layer 18 are stacked one after another so that the diamond grains of the green compact 17 are located in the spaces between the diamond grains. For this purpose, the perforated plates shown in Fig. 4 and those shown in Fig. 5 with different hole arrangements are used alternately.
第１図のように焼結片１は偏平な矩形状のものが多い。As shown in FIG. 1, the sintered piece 1 is often flat and rectangular.
これを製するには圧粉成形体１７ 、１８の面を焼結片
ｌの偏平の面とするのがよい。第４，５図の例では辺２
１ｔ−ドレッサの先端とすれば辺長りは第１図の寸法り
に相当し、辺ｎの辺長Ｈは焼結片１の高さすなわち第１
図のＨに相当する。また第１１図の焼結片頭の厚さは第
１，２図の寸法Ｗとなる。第２図のダイヤモンド金倉ま
ぬ部７ｔ−設けるには第４，５図のように板８のＦ万に
穴のない部を残す。圧粉成形用の金型１２ 、１３ 、
１４およびホットプレス用の黒鉛型は以上の穴あき板の
寸法に適合するものとする。ドレッシング作用面は第４
゜５図の辺２１に平行であるが、一層のダイヤモンド粒
が摩耗し尽す前に次層のダイヤモンド粒が作用面に露出
し始めるよう、穴の縦方向のピッチＰは穴径よりも小さ
く取っである。In order to manufacture this, it is preferable that the surfaces of the powder compacts 17 and 18 be the flat surfaces of the sintered piece l. In the example of Figures 4 and 5, side 2
1t - If it is the tip of the dresser, the side length corresponds to the dimension in Fig. 1, and the side length H of side n is the height of the sintered piece 1, that is, the first
Corresponds to H in the figure. Further, the thickness of the sintered single head shown in FIG. 11 is the dimension W shown in FIGS. 1 and 2. To provide the diamond gold plated hole 7t shown in FIG. 2, leave a portion without a hole in F of the plate 8 as shown in FIGS. 4 and 5. Molds 12, 13, for powder compaction
14 and the graphite mold for hot press shall be compatible with the dimensions of the above perforated plate. The dressing action surface is the fourth
Although parallel to side 21 in Figure 5, the vertical pitch P of the holes is set smaller than the hole diameter so that the next layer of diamond grains begins to be exposed on the working surface before one layer of diamond grains is worn out. It is.
第３図の、ダイヤモンド部が円柱状ヲ７ヨすポンドドレ
ツサの製作には、円柱の径に相当する円板状の穴あき板
を使用する。この場合はドレッサの先端面は穴あき板の
面に平行となる。To manufacture the pond dresser in which the diamond part is cylindrical in shape as shown in FIG. 3, a disk-shaped perforated plate corresponding to the diameter of the cylinder is used. In this case, the end surface of the dresser will be parallel to the surface of the perforated plate.
以上の製法における穴あき板の材料はステンレス鋼板が
よい。また鋼または銅合金（以下たんに銅と称して代表
する）の板を用いる久遠の方法も推奨される。The perforated plate in the above manufacturing method is preferably made of stainless steel. Also recommended is the traditional method using a plate of steel or copper alloy (hereinafter simply referred to as copper).
穴あき板でダイヤモンド粒を整列させた上に粉体全圧粉
して第８図の成形体を作る過程は上述に等しい１゜この
成形体を水素雰囲気中焼結温度よシも低い温度で予備焼
結すると、銅の穴あき板冴が固着した半焼結体るが得ら
れ、接着テープ１１は炭化して容易に掃拭することがで
きる。第１２図５がこの状態で、これを単位として第１
３図のように重ねて所定の焼結温度でホットプレスする
。穴あき板別の銅は溶融して粉体ｎ中に浸入拡散して合
金化し、第１１回加と等しい焼結片となる。粉本の処方
は銅および合金成分が追加されることを考慮した組成と
する。The process of forming the compact shown in Fig. 8 by arranging the diamond grains on a perforated plate and then pressing the entire powder into powder is the same as described above.This compact is 1° lower than the sintering temperature in a hydrogen atmosphere. When pre-sintered, a semi-sintered body is obtained in which the perforated copper plate is fixed, and the adhesive tape 11 is carbonized and can be easily wiped off. Figure 12 5 shows this state, and this is the unit of the first
As shown in Figure 3, they are stacked and hot pressed at a predetermined sintering temperature. The copper in the perforated plate is melted, penetrates into the powder n, diffuses and becomes alloyed, and becomes a sintered piece equivalent to the 11th application. The powder formulation takes into account the addition of copper and alloy components.
以上２種の本発明の製法によるボンドドレッサは、ダイ
ヤモンド部内部のダイヤモンド粒の分布が均一に保たれ
、ドレッシング作用を働く作用面にはつねにダイヤモン
ド粒が一定の面密度をもって均一に分布するので、高度
なドレッシング性能を安定に保つ。In the bond dresser manufactured by the above two methods of the present invention, the distribution of diamond grains inside the diamond part is maintained uniformly, and the diamond grains are always uniformly distributed with a constant surface density on the working surface where the dressing action is performed. Maintains stable and advanced dressing performance.
本発明の製法は、従来の製法に比し工程は若干多いが、
圧粉ｆ＊１７．１８または予備焼結体５．２６を製作す
る工程は以後の工程とは分離して量産的に進めることが
でき、またホットプレス工程においては型込めの作業が
単りＵで特殊の技能、熟練を要せず、また作業者の心身
状態に影響されることなく極めて短時間に終るので、総
合製作費は低減し、納期も短縮される。Although the manufacturing method of the present invention has slightly more steps than conventional manufacturing methods,
The process of producing compacted powder f*17.18 or pre-sintered body 5.26 can be separated from subsequent processes and carried out in mass production, and in the hot press process, the mold filling work is simple Since this process does not require any special skills or expertise, and is not affected by the mental and physical condition of the worker, it can be completed in an extremely short time, reducing overall production costs and shortening delivery times.
第１図はボンドドレッサの一例を示す斜視図、第２図は
同上の縦断面図、第３図は円柱状のボンドドレッサを示
す斜視図、第４図及び第５図は本発明に係るボンドドレ
ッサの製造法に用いる一対の有孔金属板の平面図、第６
図は有孔金属板の下面に接着テープを貼シ付け、ダイヤ
モンド粒を穴に入れて装着した状態を示す断面図、第７
図は第６図の有孔金属板に焼結金属材料粉末を加えて圧
縮成形する状態を示す断面図、第８図は圧縮成形済の断
面図、第９図は第８図のものから有孔金属板及び接着テ
ープを取外した断面図、第１０図は第９図の成形物を多
数積重ねた断面図、第１１図はホットプレスした焼結物
の断面図、第ｎ図は他の実施例を示す予備焼結物の断面
図、第１３図は第ｎ図の成形物を積重ねた断面図である
。
特許出願人 旭ダイヤモンド工業株式会社代理人 土
橋 秀 夫
同 江 藤 剛
第２図
第３図
第６図FIG. 1 is a perspective view showing an example of a bond dresser, FIG. 2 is a vertical cross-sectional view of the same as above, FIG. 3 is a perspective view showing a cylindrical bond dresser, and FIGS. 4 and 5 are bonds according to the present invention. Plan view of a pair of perforated metal plates used in the method of manufacturing a dresser, No. 6
The figure is a cross-sectional view showing the state in which adhesive tape is pasted on the bottom surface of a perforated metal plate and diamond grains are inserted into the holes.
The figure is a sectional view showing the state in which sintered metal material powder is added to the perforated metal plate shown in Fig. 6 and compression molded, Fig. 8 is a sectional view of the perforated metal plate after compression molding, and Fig. 9 is a modification of the one shown in Fig. 8. Figure 10 is a cross-sectional view of a stack of many molded products in Figure 9, Figure 11 is a cross-sectional view of a hot-pressed sintered product, and Figure n is a cross-sectional view of a hot-pressed sintered product. FIG. 13 is a cross-sectional view of the pre-sintered product showing an example, and FIG. 13 is a cross-sectional view of the molded products of FIG. Patent applicant Asahi Diamond Industries Co., Ltd. Agent Sat
Hideo Hashi Tsuyoshi Eto Figure 2 Figure 3 Figure 6
Claims (3)
イヤモンド粒を撒布し穴の部分のダイヤモンド粒を接着
テープにより接着し、残余の部分を除去することにより
穴の配列に一致して整列したダイヤモンド粒の層を設け
、該層に焼結金属材料粉末を加えて圧縮成形して板状の
圧粉体を形成し、この板状圧粉体を複数個重ねてホット
プレスしたボンドドレッサの製造法。(1) Scatter diamond grains on a perforated metal plate with adhesive tape attached to the bottom surface, adhere the diamond grains in the holes with adhesive tape, and align them according to the hole arrangement by removing the remaining part. A layer of diamond grains is provided, and sintered metal material powder is added to the layer and compression molded to form a plate-shaped green compact, and a plurality of plate-shaped green compacts are stacked and hot pressed to create a bond dresser. Manufacturing method.
後これを剥して板状圧粉体全分離することを特徴とする
特許請求の範囲第１項記載のボンドドレッサの製造法。(2) The method for manufacturing a bond dresser according to claim 1, wherein the perforated metal plate is made of stainless steel, and the plate-shaped powder compact is completely separated by peeling it off after compressing the powder.
穴あき板上にダイヤモンド粒を撒布することにより穴の
配列に一致してダイヤモンド粒を整列させ、これに焼結
金属材料粉末を加えて圧縮した成形体を、還元雰囲気中
で加熱して板状の予備焼結体を形成し、該板状予備焼結
体を銅板の耐着したまま複数個重ねてホットプレスした
特許請求の範囲第１項記載のボンドドレッサの製造法。(3) Arrange the diamond grains in accordance with the arrangement of the holes by scattering diamond grains on a perforated plate made of copper or prepared alloy with adhesive tape attached to the bottom surface, and add sintered metal material powder to this. A compacted compact is heated in a reducing atmosphere to form a plate-shaped pre-sintered body, and a plurality of the plate-shaped pre-sintered bodies are stacked and hot-pressed while the copper plate remains resistant to adhesion. A method for manufacturing a bond dresser according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20121283A JPS6092406A (en) | 1983-10-27 | 1983-10-27 | Production of bond dresser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20121283A JPS6092406A (en) | 1983-10-27 | 1983-10-27 | Production of bond dresser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6092406A true JPS6092406A (en) | 1985-05-24 |
Family
ID=16437203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20121283A Pending JPS6092406A (en) | 1983-10-27 | 1983-10-27 | Production of bond dresser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6092406A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62178063U (en) * | 1986-05-02 | 1987-11-12 | ||
| JPS62264867A (en) * | 1986-03-28 | 1987-11-17 | Tokyo Met Gov | Metal sintered dressing stick |
| JPH04506634A (en) * | 1990-01-22 | 1992-11-19 | アルティメート アブレイシィブ システムズ エル．エル．シー． | composite material |
| US6273082B1 (en) | 1991-06-10 | 2001-08-14 | Ultimate Abrasive Systems, L.L.C. | Abrasive cutting tool |
| US6306025B1 (en) | 1997-06-13 | 2001-10-23 | Nec Corporation | Dressing tool for the surface of an abrasive cloth and its production process |
| KR20020024741A (en) * | 2000-09-26 | 2002-04-01 | 김세광 | Method for Manufacturing a grinding Wheel and the tips thereof |
| US6478831B2 (en) | 1995-06-07 | 2002-11-12 | Ultimate Abrasive Systems, L.L.C. | Abrasive surface and article and methods for making them |
| US6482244B2 (en) | 1995-06-07 | 2002-11-19 | Ultimate Abrasive Systems, L.L.C. | Process for making an abrasive sintered product |
| EP1312446A3 (en) * | 2001-11-17 | 2004-07-14 | SAINT-GOBAIN Diamantwerkzeuge GmbH & Co. KG | Diamond form dressing roller and manufacturing method |
| KR100446981B1 (en) * | 2002-07-12 | 2004-09-01 | 신한다이야몬드공업 주식회사 | Segment of cutting tool |
| KR100623304B1 (en) | 2005-04-14 | 2006-09-13 | 이화다이아몬드공업 주식회사 | Cutting tip, manufacturing method and cutting tool |
| KR100820181B1 (en) | 2007-01-26 | 2008-04-07 | 신한다이아몬드공업 주식회사 | Diamond tool and its manufacturing method |
| CN102672188A (en) * | 2012-06-05 | 2012-09-19 | 安泰科技股份有限公司 | Method for positioning and distributing diamonds in tool bit and distributing device |
| US20160271714A1 (en) * | 2015-03-20 | 2016-09-22 | Jiaxiang Hou | Method for producing a segment for a diamond tool and segment for a diamond tool |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56163879A (en) * | 1980-05-21 | 1981-12-16 | Toyoda Mach Works Ltd | Production of rotary diamond dresser |
-
1983
- 1983-10-27 JP JP20121283A patent/JPS6092406A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56163879A (en) * | 1980-05-21 | 1981-12-16 | Toyoda Mach Works Ltd | Production of rotary diamond dresser |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62264867A (en) * | 1986-03-28 | 1987-11-17 | Tokyo Met Gov | Metal sintered dressing stick |
| JPS62178063U (en) * | 1986-05-02 | 1987-11-12 | ||
| JPH04506634A (en) * | 1990-01-22 | 1992-11-19 | アルティメート アブレイシィブ システムズ エル．エル．シー． | composite material |
| US6273082B1 (en) | 1991-06-10 | 2001-08-14 | Ultimate Abrasive Systems, L.L.C. | Abrasive cutting tool |
| US6478831B2 (en) | 1995-06-07 | 2002-11-12 | Ultimate Abrasive Systems, L.L.C. | Abrasive surface and article and methods for making them |
| US6482244B2 (en) | 1995-06-07 | 2002-11-19 | Ultimate Abrasive Systems, L.L.C. | Process for making an abrasive sintered product |
| US6306025B1 (en) | 1997-06-13 | 2001-10-23 | Nec Corporation | Dressing tool for the surface of an abrasive cloth and its production process |
| KR20020024741A (en) * | 2000-09-26 | 2002-04-01 | 김세광 | Method for Manufacturing a grinding Wheel and the tips thereof |
| EP1312446A3 (en) * | 2001-11-17 | 2004-07-14 | SAINT-GOBAIN Diamantwerkzeuge GmbH & Co. KG | Diamond form dressing roller and manufacturing method |
| KR100446981B1 (en) * | 2002-07-12 | 2004-09-01 | 신한다이야몬드공업 주식회사 | Segment of cutting tool |
| KR100623304B1 (en) | 2005-04-14 | 2006-09-13 | 이화다이아몬드공업 주식회사 | Cutting tip, manufacturing method and cutting tool |
| WO2006110010A1 (en) * | 2005-04-14 | 2006-10-19 | Ehwa Diamond Industrial Co., Ltd. | Cutting segment, method for manufacturing cutting segment, and cutting tool comprising the same |
| AU2006234736B2 (en) * | 2005-04-14 | 2011-03-24 | Ehwa Diamond Industrial Co., Ltd. | Cutting segment, method for manufacturing cutting segment, and cutting tool comprising the same |
| US8002858B2 (en) | 2005-04-14 | 2011-08-23 | Ehwa Diamond Industrial Co., Ltd. | Cutting segment, method for manufacturing cutting segment, and cutting tool comprising the same |
| KR100820181B1 (en) | 2007-01-26 | 2008-04-07 | 신한다이아몬드공업 주식회사 | Diamond tool and its manufacturing method |
| WO2008091040A1 (en) * | 2007-01-26 | 2008-07-31 | Shinhan Diamond Ind. Co., Ltd. | Diamond tool and method of manufacturing the same |
| CN102672188A (en) * | 2012-06-05 | 2012-09-19 | 安泰科技股份有限公司 | Method for positioning and distributing diamonds in tool bit and distributing device |
| US20160271714A1 (en) * | 2015-03-20 | 2016-09-22 | Jiaxiang Hou | Method for producing a segment for a diamond tool and segment for a diamond tool |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6092406A (en) | Production of bond dresser | |
| JP3294277B2 (en) | Powder preform and method for producing abrasive article made therefrom | |
| CA1336543C (en) | Method of making a composite abrasive compact | |
| KR100340851B1 (en) | Patterned abrasive material and its manufacturing method | |
| KR100265392B1 (en) | Saw Blade Manufacturing Method | |
| DE69011555D1 (en) | Process for the production of tool blanks from polycrystalline composite material with flat carbide carrier / diamond or CBN interfaces. | |
| JPS5915788B2 (en) | Manufacturing method of rotary diamond dresser | |
| CN107262824A (en) | The radial positioning distribution superthin layer composite saw blade of diamond and its manufacture craft | |
| CN107262822B (en) | The equidistant shape positioning of diamond is distributed the manufacture craft of full working lining ultrathin saw bit | |
| JPS58143958A (en) | Grindstone | |
| JPH0532194B2 (en) | ||
| JPH07504619A (en) | Method for manufacturing abrasive tools and tools manufactured using this method | |
| CN107127398B (en) | Diamond helical positioning is distributed the manufacture craft of full working lining ultrathin saw bit | |
| JPH02237759A (en) | Cutter and manufacture thereof | |
| JP3965422B2 (en) | Diamond pellet, manufacturing method thereof, and surface plate for grinding machine | |
| CN107269225A (en) | The radial positioning distribution superthin layer composite drill bit of diamond and its manufacture craft | |
| JPS63501800A (en) | Compression sintering method for producing metal-bonded diamond tools and apparatus for carrying out this method | |
| JP2523075B2 (en) | Diamond grindstone and manufacturing method thereof | |
| CN107262821B (en) | The radial positioning of diamond is distributed the manufacture craft of full working lining ultrathin saw bit | |
| RU2218265C2 (en) | Method of manufacture of face composite grinding disk on bakelite binder | |
| TWI756822B (en) | Abrasive diamond particles having at least four surfaces of different directions and method of manufacturing the same | |
| EP0357378B1 (en) | Manufacture of two-component products | |
| JP2000108038A (en) | Wheel dresser and manufacture thereof | |
| JPS6013789B2 (en) | Composite plate polishing tool | |
| RU2309816C2 (en) | Cutting member of super-hard materials manufacturing method |