JPS6094832U - 半導体素子 - Google Patents

半導体素子

Info

Publication number
JPS6094832U
JPS6094832U JP1983186341U JP18634183U JPS6094832U JP S6094832 U JPS6094832 U JP S6094832U JP 1983186341 U JP1983186341 U JP 1983186341U JP 18634183 U JP18634183 U JP 18634183U JP S6094832 U JPS6094832 U JP S6094832U
Authority
JP
Japan
Prior art keywords
recess
contour
support plate
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983186341U
Other languages
English (en)
Inventor
山岸　始男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1983186341U priority Critical patent/JPS6094832U/ja
Publication of JPS6094832U publication Critical patent/JPS6094832U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体素子の要部の平面図、第２図はそ
のＡ−Ａ線断面図、第３図は本考案の一実施例の要部の
平面図、第４図はそのＢ−Ｂ線断面図である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体片が支持板上に固着されるものにおいて、支持板
    が半導体片の輪郭よりやや大きい輪郭をもつくぼみと、
    該くぼみ中に設けられ、大部分は該くぼみの輪郭に平行
    であるが二対の対向する場所に内側に向って突出する部
    分を持つ輪郭を有するより深いくぼみを備えたことを特
    徴とする半導体素子。
JP1983186341U 1983-12-01 1983-12-01 半導体素子 Pending JPS6094832U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983186341U JPS6094832U (ja) 1983-12-01 1983-12-01 半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983186341U JPS6094832U (ja) 1983-12-01 1983-12-01 半導体素子

Publications (1)

Publication Number Publication Date
JPS6094832U true JPS6094832U (ja) 1985-06-28

Family

ID=30402512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983186341U Pending JPS6094832U (ja) 1983-12-01 1983-12-01 半導体素子

Country Status (1)

Country Link
JP (1) JPS6094832U (ja)

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