JPS60954U - Copper foil pattern for printed circuit board - Google Patents
Copper foil pattern for printed circuit boardInfo
- Publication number
- JPS60954U JPS60954U JP9270383U JP9270383U JPS60954U JP S60954 U JPS60954 U JP S60954U JP 9270383 U JP9270383 U JP 9270383U JP 9270383 U JP9270383 U JP 9270383U JP S60954 U JPS60954 U JP S60954U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- foil pattern
- soldering land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント基板の平面図、第２図は箔浮き
状態における同断面図、第３図は箔切れ状態における同
断面図、第４図は本考案の一実施例におけるプリント基
板の平面図、第５図は箔浮き状態における同側面図であ
る。
主な図番の説明、１・・・・・・プリント基板、２，６
・・・・・・銅箔パターン、３．７・・・・・・半田付
ランド、４゜８・・・・・・レジスト膜。Figure 1 is a plan view of a conventional printed circuit board, Figure 2 is a sectional view of the same in a foil floating state, Figure 3 is a sectional view of the same in a foil broken state, and Figure 4 is a diagram of a printed circuit board in an embodiment of the present invention. The plan view and FIG. 5 are side views of the foil in a floating state. Explanation of main drawing numbers, 1... Printed circuit board, 2, 6
......Copper foil pattern, 3.7...Soldering land, 4°8...Resist film.
Claims (1)
品挿入口を含む所定部分を半田付ランドとし、該半田付
ランド以外の部分にレジスト膜を形成してなるプリント
基板において、半田付ランドの巾を、前記部品挿入口付
近から遠ざかるにつれて順次狭く、所定位置より更に遠
ざかると順次広く形成してなるプリント基板の銅箔パタ
ーン。In a printed circuit board in which a predetermined portion of a copper foil pattern formed in a predetermined shape, including at least a component insertion opening is used as a soldering land, and a resist film is formed on a portion other than the soldering land, the width of the soldering land is The copper foil pattern of the printed circuit board is formed such that the copper foil pattern becomes narrower as it goes away from the vicinity of the component insertion opening, and becomes wider as it goes further away from the predetermined position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9270383U JPS60954U (en) | 1983-06-15 | 1983-06-15 | Copper foil pattern for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9270383U JPS60954U (en) | 1983-06-15 | 1983-06-15 | Copper foil pattern for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60954U true JPS60954U (en) | 1985-01-07 |
Family
ID=30223047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9270383U Pending JPS60954U (en) | 1983-06-15 | 1983-06-15 | Copper foil pattern for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60954U (en) |
-
1983
- 1983-06-15 JP JP9270383U patent/JPS60954U/en active Pending
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