JPS61102073U - - Google Patents
Info
- Publication number
- JPS61102073U JPS61102073U JP18758784U JP18758784U JPS61102073U JP S61102073 U JPS61102073 U JP S61102073U JP 18758784 U JP18758784 U JP 18758784U JP 18758784 U JP18758784 U JP 18758784U JP S61102073 U JPS61102073 U JP S61102073U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- circuit board
- utility
- parts
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例による厚膜回路基板
の部分平面図、第２図は従来の厚膜回路基板の部
分平面図である。 １…基板、２…厚膜導体、３…厚膜抵抗、３ａ
，３ｂ…分割した厚膜抵抗体。
の部分平面図、第２図は従来の厚膜回路基板の部
分平面図である。 １…基板、２…厚膜導体、３…厚膜抵抗、３ａ
，３ｂ…分割した厚膜抵抗体。
Claims (1)
- ひとつの厚膜抵抗を２ケあるいはそれ以上に分
割して配置したことを特徴とする厚膜回路基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18758784U JPS61102073U (ja) | 1984-12-11 | 1984-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18758784U JPS61102073U (ja) | 1984-12-11 | 1984-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61102073U true JPS61102073U (ja) | 1986-06-28 |
Family
ID=30745049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18758784U Pending JPS61102073U (ja) | 1984-12-11 | 1984-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61102073U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0569977U (ja) * | 1992-02-27 | 1993-09-21 | 京セラ株式会社 | 多層回路基板 |
-
1984
- 1984-12-11 JP JP18758784U patent/JPS61102073U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0569977U (ja) * | 1992-02-27 | 1993-09-21 | 京セラ株式会社 | 多層回路基板 |