JPS61114893U

JPS61114893U -

Info

Publication number: JPS61114893U
Application number: JP20215784U
Authority: JP
Priority date: 1984-12-27
Filing date: 1984-12-27
Publication date: 1986-07-19

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例の要部斜視、第２図
は平面視、第３図は本考案の異なる一実施例、第
４図は第３図の切起し突起部の詳細で、ａは平面
、ｂは正面視、第５図は従来を示す。全図を通し
て同等部分には同一符号を付して示す。図中、１は半導体装置、２はケース、４，４１
は絶縁シート、５はプリント板、６は鉤形棒状ば
ね、である。 Fig. 1 is a perspective view of the main part of one embodiment of the present invention, Fig. 2 is a plan view, Fig. 3 is a different embodiment of the present invention, and Fig. 4 is a detail of the cut-and-raised protrusion of Fig. 3. , a is a plane, b is a front view, and FIG. 5 shows a conventional device. Equivalent parts are designated by the same reference numerals throughout the figures. In the figure, 1 is a semiconductor device, 2 is a case, 4, 41
5 is an insulating sheet, 5 is a printed board, and 6 is a hook-shaped bar spring.

Claims

[Claims for Utility Model Registration] (1) A semiconductor device having a heat dissipation surface on one side is brought into contact with a heat dissipation surface, and a hook is attached to a wall surface adjacent to the heat dissipation surface so as to be rotatable in a direction parallel to the heat dissipation surface. A mounting structure for a semiconductor device, characterized in that the semiconductor is pressed and fixed by a rod-shaped spring. (2) The mounting structure for a semiconductor device according to claim 1, wherein the hook-shaped portion of the hook-shaped bar spring penetrates and engages with a chevron-shaped cut-and-raised receiving portion formed in a wall plate. (3) The semiconductor according to claim 1, wherein the hook-shaped part of the hook-shaped rod-shaped spring is inserted into and engaged with a cut-and-raised receiving part formed on the wall surface from the open side, which opens one side. Equipment mounting structure.