JPS61119601A - Alloy powder for metallizing - Google Patents
Alloy powder for metallizingInfo
- Publication number
- JPS61119601A JPS61119601A JP59241087A JP24108784A JPS61119601A JP S61119601 A JPS61119601 A JP S61119601A JP 59241087 A JP59241087 A JP 59241087A JP 24108784 A JP24108784 A JP 24108784A JP S61119601 A JPS61119601 A JP S61119601A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metallizing
- alloy powder
- metallization
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 29
- 239000000956 alloy Substances 0.000 title claims abstract description 29
- 239000000843 powder Substances 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 44
- 239000000919 ceramic Substances 0.000 claims abstract description 35
- 238000005304 joining Methods 0.000 claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000011261 inert gas Substances 0.000 claims abstract description 8
- 239000011230 binding agent Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 25
- 238000001465 metallisation Methods 0.000 claims description 24
- 238000005219 brazing Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 6
- 229910052719 titanium Inorganic materials 0.000 abstract description 6
- 229910017770 Cu—Ag Inorganic materials 0.000 abstract 1
- 238000010298 pulverizing process Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- 229910017309 Mo—Mn Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 240000005343 Azadirachta indica Species 0.000 description 1
- 239000001293 FEMA 3089 Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 235000013500 Melia azadirachta Nutrition 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000002934 lysing effect Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
【発明の詳細な説明】
（Ａ） 〔産業上の利用分野〕
本発明は、セラミックスとセラミックス、あるいはセラ
ミックスと金属を接合するためのメタライズ用合金粉末
と、そのメタライズ接合法に係るもので、複雑な形状の
セラミックスと接合金属の、超気密接合を比較的低温で
容易になすことのできる、メタライズ用合金粉末ならび
に接合法に関するものである。[Detailed Description of the Invention] (A) [Field of Industrial Application] The present invention relates to an alloy powder for metallization for joining ceramics to ceramics or ceramics to metals, and a method for joining the metallization, which is complicated. The present invention relates to an alloy powder for metallization and a bonding method that can easily form a super-hermetic bond between a ceramic having a shape and a bonding metal at a relatively low temperature.
（Ｂ） 〔従来の技術〕
セラミックスと金属を接合するには、従来、活性金属法
や高融点金属法等が実用化されており、活性金属法は、
Ｔｉ、Ｚｒ等の活性金属粉末と、これと比較的低融点合
金をつくるＣｕ、Ｎｉ、Ａｇとを共晶組成になるようセ
ラミックスと非接合材料との間に挿入し、真空中または
不活性ガス中で、−回の加熱操作により接合する方法で
あるが、共晶組成となる混合粉末を、セラミックスと接
合金属の間に挿入する際に、Ｔｉ、Ｚｒ等の活性金属は
酸化しやすく、その酸化物がメタライズ層に残留してメ
タライズ強度を低下したり、粉末を完全に均一に混合す
ることは非常に困難であり、その為のメタライズ層の不
均一性に基づく、メタライズ強度の低下や、気密性の低
下を招く不都合があった、また、セラミックス管に７ラ
ンノ等の丸物を嵌合接合する場合、セラミックス管と金
属７ランジの接合面に、混合粉末を挿入して直接加熱メ
タライズ接合した場合は、セラミックス管と金属７ラン
ジ間のクリアランスを、各部均一にすることがほとんど
不可能で、ろう材が片寄ったり、流出して、接合部分に
ろう材が満遍無く充填されて、高気密性を持たすことは
不可能であった。(B) [Prior art] To join ceramics and metals, active metal methods, high melting point metal methods, etc. have been put into practical use.
Active metal powders such as Ti and Zr, and Cu, Ni, and Ag, which form alloys with relatively low melting points, are inserted between the ceramic and the non-bonding material to form a eutectic composition, and then heated in a vacuum or in an inert gas. In this method, active metals such as Ti and Zr are easily oxidized when a mixed powder having a eutectic composition is inserted between the ceramic and the bonding metal. Oxides may remain in the metallized layer and reduce the metallized strength, and it is very difficult to mix the powder completely uniformly, resulting in a reduction in the metallized strength due to the non-uniformity of the metallized layer. In addition, when fitting and joining a round object such as a 7 runge to a ceramic tube, it is necessary to insert a mixed powder into the joint surface of the ceramic tube and metal 7 runge and directly heat metallization bonding. In this case, it is almost impossible to make the clearance between the ceramic tube and the metal 7 flange uniform in each part, and the solder metal may be unevenly distributed or flow out, causing the joint to be evenly filled with the solder metal, resulting in high It was impossible to maintain airtightness.
従って、セラミックス管に金属７ランジを接合する方法
としては、高融点金属法例えばＭｏ−Ｍｎ法が使用され
ているが、このＭｏ−Ｍｎ法はＭｏとＭｎの微粉末を有
機バインダでペイント状にしたものを、セラミックスの
表面に塗布して、加湿水素または加湿７ｔ−ミングガス
（Ｈ２／ Ｎ ２）中において、１３００〜１７００
’Ｃでメタライジングし、Ｎｉメッキを施した後、ろう
材を使用して接合金属とろう付けする方法であるが、こ
の方法は活性ガスである水素を使用する為、危険性を伴
ない製造設備や製造方法が容易でなく、また、非常な高
温処理を伴なう為、高温炉を必要とし、設備前が高くな
り、製造フ又トが高くなる。Therefore, high-melting point metal methods such as the Mo-Mn method are used to join the metal 7-lunge to the ceramic tube, but this Mo-Mn method uses fine powders of Mo and Mn in the form of paint with an organic binder. The mixture was applied to the surface of ceramics and heated at 1300 to 1700 in humidified hydrogen or humidified 7t-ming gas (H2/N2).
After metallizing with 'C and Ni plating, it is brazed to the joining metal using a brazing filler metal, but since this method uses hydrogen, which is an active gas, there is no danger in manufacturing. The equipment and manufacturing method are not easy, and since it involves very high temperature processing, a high temperature furnace is required, which increases the height of the front of the equipment and the manufacturing height.
更に、セラミックスも高温に良く耐えるものの使用に限
定される等、多くの制約があり、決して使いかっての良
いものではなかった。Furthermore, although ceramics can withstand high temperatures well, they have many restrictions, such as being limited in their use, so they have never been good to use.
また、活性金属法と同様に微粉末を混合して、使用する
が、均一な混合は困難であり、従って均一なメタライズ
には困難性を伴なった。Further, like the active metal method, fine powders are mixed and used, but it is difficult to mix them uniformly, and therefore it is difficult to achieve uniform metallization.
（Ｃ） 〔発明が解決しようとする問題点〕本発明は、
上記したような活性金属法や高融点金属法等、従来のろ
う材や接合法の欠点を解消し、作業性に優れ、複雑な形
状にもメタライχが容易で、かつ酸化等の変質を防止し
、常に均一な成分を保持し、メタライズした場合も、常
に均一で強固なメタライズ強度を得ることのできるメタ
ライズろう材、ならびにそのろう材によるメタライズ法
を提供するものである。(C) [Problems to be solved by the invention] The present invention:
Eliminates the drawbacks of conventional brazing materials and bonding methods such as the active metal method and high melting point metal method mentioned above, has excellent workability, allows easy metallization even in complex shapes, and prevents deterioration such as oxidation. However, the present invention provides a metallized brazing material that always maintains uniform components and can always obtain uniform and strong metallized strength even when metalized, and a metallization method using the brazing material.
（Ｄ） 〔問題点を解決するための手段〕
１重量比でＴｉ、１５−２５％、Ｃｕ、６０−４０
％、Ａｇ、２５〜３５％からなる合金を、微粉にしてな
るメタライズ用合金粉末である。(D) [Means to solve the problem]
Ti, 15-25%, Cu, 60-40% by weight
This is an alloy powder for metallization made by finely powdering an alloy consisting of 25% to 35% Ag.
即ち、上記混合比率のＴｉ、Ｃｕ、Ａｇを真空中または
不活性ガス中において合金とした後、粉砕して微粉末と
するものである。That is, Ti, Cu, and Ag in the above-mentioned mixing ratio are made into an alloy in a vacuum or an inert gas, and then pulverized to form a fine powder.
なお、微粉末の粒度は、セラミックスへの塗布方法に応
じて使用しやすい粒度とすることができる。Note that the particle size of the fine powder can be adjusted to a particle size that is easy to use depending on the method of coating the ceramics.
このメタライズ用合金粉末によるメタライズ法は、メタ
ライズ合金粉末にバインダを加えてペーストとし、セラ
ミックスに塗布後、真空中または不活性ガス中で加熱し
てメタライズし、そのメタライズ層に金属メッキを施し
た後、接合金属とろう付けするものである。This metallization method using alloy powder for metallization involves adding a binder to the metallizing alloy powder to make a paste, applying it to ceramics, heating it in a vacuum or inert gas to metalize it, and applying metal plating to the metallized layer. , which is to be brazed with the joining metal.
例えば、本発明の所要粒度のメタライズ用合金粉末を、
メタクリレート、ニドミセルローズあるいはテレピン油
等のいずれかの有機バイングーを加えてペースト状とし
、図面に示すようなＡ１□Ｏ１等のセラミックス管１の
金属７ランジ２の接合個所に帯状にスクリーン印刷また
は刷毛塗り等により塗布後、真空中または不活性ガス中
で９００℃前後に加熱すれば、メタライズ用合金粉末中
のＴｉがセラミックス中に拡散して強固なメタライズ層
３が形成される。For example, the alloy powder for metallization of the required particle size of the present invention,
Add any organic binder such as methacrylate, nidomicellulose or turpentine oil to form a paste, and screen print or brush it in a band shape at the joint of metal 7 flange 2 of ceramic tube 1 such as A1□O1 as shown in the drawing. After coating by coating or the like, if heated to around 900° C. in a vacuum or in an inert gas, Ti in the metallizing alloy powder diffuses into the ceramic and a strong metallized layer 3 is formed.
この場合メタライズ用合金粉末中のＣｕとＡｇはメタラ
イズ温度を引き下げるとともに１．Ａｇは活性をよくし
て各部均一で緻密なメタライズ層を形成する。In this case, Cu and Ag in the metallizing alloy powder lower the metallizing temperature and 1. Ag has good activity and forms a uniform and dense metallized layer in each part.
次にメタライズ層３にＮｉ、 Ｃｕ、 Ａｇ等の金属メ
ッキを施した後、金属７ラン：）２を図面に示すように
密に嵌合し、その嵌合部分に銀ろう４を介在せしめて、
真空中または不活性ガス中にて加熱ろう付けすれば、銀
ろう４はセラミックス管１と金属７ランジ２の間に満遍
無く拡散して、完全な高気密で、かつ強固に接合される
。Next, after plating metal such as Ni, Cu, Ag, etc. on the metallized layer 3, the 7 metal runs 2 are tightly fitted as shown in the drawing, and a silver solder 4 is interposed in the fitted part. ,
By heating and brazing in a vacuum or an inert gas, the silver solder 4 is evenly diffused between the ceramic tube 1 and the metal 7 flange 2, resulting in a completely airtight and strong bond.
（Ｅ） 〔発明の効果〕
従来の活性金属法では、活性金属のＴｉやＺｒと、低融
点合金を作るＣｕやＮｉあるいはＡｇ等の粉末混合が均
一にならないためと、活性金属の酸化等による変質や、
メタライズ部に酸化物の残留等により、各部均一な接合
が困難で、接合製品にばらつきを生じたり、均一強固な
接合ができながっすこリ、接合部に高気密性等を付与す
ることが困難であった。(E) [Effect of the invention] In the conventional active metal method, the active metals such as Ti and Zr and the powders of Cu, Ni, Ag, etc. that make the low melting point alloys are not mixed uniformly, and due to oxidation of the active metals, etc. Alteration,
Due to residual oxides in the metallized parts, it is difficult to bond each part uniformly, resulting in variations in the bonded product, making it impossible to achieve uniform and strong bonding, and making it difficult to provide high airtightness to the bonded parts. It was difficult.
また、高融点金属法においても、例えばＭ ｏ、Ｍ ｎ
等の混合において、同様に均一な混合が困難という問題
がある上、活性ガスを使用したり、高温処理を必要とす
るため、製造が容易で・なく、装造設備費も高く、メタ
ライズするセラミックスも高温によく耐えるものに限定
される等の制約かあ、た。Also, in the refractory metal method, for example, M o, M n
There is also the problem that it is difficult to mix uniformly, and it also requires the use of active gas and high-temperature treatment, which makes it difficult to manufacture and requires high equipment costs. Also, there are restrictions such as being limited to those that can withstand high temperatures well.
本発明のメタライズ用合金粉末においては、Ｔｉ、Ｃｕ
、Ａｇを真空中または不活性ガス中で、合金化して混合
の不均一性をなくし、かつ、合金化したことにより、活
性金属であるＴｉの酸化を防止して、常に均一性を保持
できるようにした。In the metallizing alloy powder of the present invention, Ti, Cu
, Ag is alloyed in vacuum or in an inert gas to eliminate non-uniformity of the mixture, and by alloying, the oxidation of Ti, an active metal, is prevented and uniformity can be maintained at all times. I made it.
また、本発明のメタライズ用合金粉末の組成において、
Ｔｉを１５〜２５％としたことによりメタライス゛のと
きのセラミックス内への拡散をよくして、メタライズ強
度をあげるととも１こ、Ｃｕ６０〜４０％、ＡＥ２Ｓ〜
３５％ととして、メタライズ温度をこの種のろう材とし
ては低温の９００℃前後に低くし、更にＡｇにより、ろ
う材の温性をよくしてメタライズ層の気密性を大きく向
上するとともに、メタライズを容易にし、メタライズの
コスト低減を可能にするものである。Furthermore, in the composition of the alloy powder for metallization of the present invention,
By setting Ti to 15-25%, it improves diffusion into the ceramic during metallization and increases metallization strength.
35%, the metallization temperature is lowered to around 900℃, which is the lowest temperature for this type of brazing material, and Ag improves the thermal properties of the brazing material and greatly improves the airtightness of the metallized layer. This makes it possible to reduce the cost of metallization.
更に本発明のメタライズ合金粉末の特徴は、前記したよ
うにメタライズ層がセラミックスに強固かつ均一に、し
かも緻密で常に製品にばらつき無コ く均一に形成さ
れることである。Furthermore, a feature of the metallized alloy powder of the present invention is that, as described above, the metallized layer is formed firmly and uniformly on the ceramic, and is dense and always uniform with no variation in the product.
しかも、接合方法も高融点金属法の１３００〜１７００
’Ｃに比較して大幅に低温の９００°Ｃ前後でのメタ
ライソングを可能にし、水素等の活性ガスを使用しない
ので作業が安全であり、低温の為設備費も安く経済的で
ある。Moreover, the joining method is 1300~1700 using high melting point metal method.
It is possible to perform metal lysing at a temperature of around 900°C, which is significantly lower than that of 'C', and since it does not use active gases such as hydrogen, the work is safe, and the equipment cost is low and economical due to the low temperature.
次に本発明による接合強度並びに気密度は、図面に示す
ように、例えばＡ１□０．のセラミックス管１に、本発
明のメタライズ用合金粉末を帯状に塗布後、真空中にで
約９００℃でメタライズ後、メッキして、図面に示すよ
うな形状のＫｏｖａｌの金属７ランジ２を銀ろう付けし
たものについて、その接合部のへりニームデテクタによ
るリークテストを行なった結果は、Ｉ Ｘ Ｉ ＰＪ
Ｔｏｒｒ−”／ｓ）以上という高い気密度を示した。Next, as shown in the drawings, the bonding strength and airtightness according to the present invention are, for example, A1□0. After applying the metallizing alloy powder of the present invention in a band shape to a ceramic tube 1, metallizing it in a vacuum at about 900°C, plating it, and attaching a Koval metal 7 flange 2 having a shape as shown in the drawing with silver solder. The results of a leak test using a neem detector on the edge of the joint were as follows:
It exhibited a high airtightness of more than 1.5 Torr-''/s).
更に金属７ランシ゛２を固定して、セラミックス管１に
回転トルクを与え、あるいはセラミックス管１に曲トル
クをあたえた場合も、セラミックス管１が破損するか、
金属フランジ２か変形するに至っても、接合部には何等
の異常をも生じなかった。Furthermore, if the metal 7 lance 2 is fixed and a rotating torque is applied to the ceramic tube 1 or a bending torque is applied to the ceramic tube 1, the ceramic tube 1 may be damaged or
Even if the metal flange 2 was deformed, no abnormality occurred in the joint.
また、破損または変形寸前までのトルクを与えた後のリ
ークテストにおいても、接合部の気密低下は蕉り、高い
気密性を保持した。Furthermore, even in a leak test after applying torque to the point of breaking or deforming the joint, the reduction in airtightness at the joint was maintained, and high airtightness was maintained.
以上のように本発明のメタライズ用合金粉末、並びに接
合法はは、化学的に安定で、メタライズ温度も比較的に
１氏温で、メタライズ作業も容易であｌ）、メタライズ
層も強固で、緻密かつ均一である。As mentioned above, the alloy powder for metallization and the joining method of the present invention are chemically stable, the metallization temperature is relatively 1 degree Celsius, the metallization work is easy (1), the metallization layer is strong, Dense and uniform.
そしてセラミ、７クス管に金属７ランノを接合した場合
、−各問題となる接合部の高気密性付与について、製品
間にばらつきなく、一様に容易に付与できるという、非
常に大きな効果を発揮する等活性金属法や高融点金属法
の欠点を補完し、その長所を併せ持たせたことをＩ徴と
するメタライズ用合金粉末並びに接合法である。When joining ceramic and 7X pipes with metal 7Ranno, it is extremely effective in providing high airtightness to the joints, which is a problem, because it can be easily and uniformly applied without variation between products. This alloy powder and bonding method for metallization is characterized by complementing the shortcomings of the active metal method and the high melting point metal method, and combining the advantages thereof.
（Ｆ） 〔池の実施例〕
本発明の実施例を、主としてセラミックス管に金属７ラ
ンノを接合する場合について記したが、板状のセラミッ
クスと金属板の接合は勿論、セラミックス同士の接合に
おいても、それぞれのセラミックスをメタライズ用合金
粉末でメタライズ後ろう付けすれば容易に接合できる。(F) [Example of Ike] The embodiment of the present invention has been described mainly for the case of joining metal 7 runno to a ceramic tube, but it can also be used not only for joining a plate-shaped ceramic and a metal plate but also for joining ceramics to each other. , each ceramic can be easily joined by metallizing with metallizing alloy powder and then brazing.
更にセラミックス上に本メタライズ合金粉末を所要形状
に印刷等してメタライズすることに上り、強固な導電膜
や導電回路等を容易に設けることもできる。Furthermore, by printing the present metallized alloy powder onto ceramics in a desired shape and metallizing it, it is also possible to easily provide a strong conductive film, conductive circuit, etc.
図面は本発明の説明用一部断面例示図。
１はセラミックス管、２は金属７ランノ、３はメタライ
ズ層、４は銀ろう。The drawing is a partially sectional illustrative diagram for explaining the present invention. 1 is a ceramic tube, 2 is a metal 7 run, 3 is a metallized layer, and 4 is a silver solder.
Claims (2)
０％、Ａｇ、２５〜３５％からなる合金を、微粉にして
なるメタライズ用合金粉末。(1), Ti, 15-25%, Cu, 60-4% by weight
An alloy powder for metallization made by finely powdering an alloy consisting of 0% Ag and 25 to 35% Ag.
０％、Ａｇ、２５〜３５％からなる合金を、微粉にして
なるメタライズ用合金粉末に、バインダを加えてペース
ト状とし、セラミックスに塗布後、真空中または不活性
ガス中で加熱してメタライズし、そのメタライズ層に、
金属メッキを施した後、接合金属と、ろう付けすること
を特徴とする、セラミックスのメタライズ接合法。(2), Ti, 15-25%, Cu, 60-4% by weight
A binder is added to the metallizing alloy powder, which is made by finely powdering an alloy consisting of 0% Ag, 25-35% Ag, and a paste, which is applied to ceramics and then heated in a vacuum or in an inert gas for metallization. , in its metallized layer,
A metallization joining method for ceramics, which involves applying metal plating and then brazing the joining metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59241087A JPS61119601A (en) | 1984-11-15 | 1984-11-15 | Alloy powder for metallizing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59241087A JPS61119601A (en) | 1984-11-15 | 1984-11-15 | Alloy powder for metallizing |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4089289A Division JPH01258379A (en) | 1989-02-21 | 1989-02-21 | Metalizing connection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61119601A true JPS61119601A (en) | 1986-06-06 |
| JPH022921B2 JPH022921B2 (en) | 1990-01-19 |
Family
ID=17069090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59241087A Granted JPS61119601A (en) | 1984-11-15 | 1984-11-15 | Alloy powder for metallizing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61119601A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0618309A4 (en) * | 1992-10-21 | 1995-03-29 | Tokin Corp | METAL POWDER COMPOSITION FOR METALLIZATION, AND METALLIC SUBSTRATE. |
| EP1782912A1 (en) * | 2005-10-28 | 2007-05-09 | General Electric Company | Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB735929A (en) * |
-
1984
- 1984-11-15 JP JP59241087A patent/JPS61119601A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB735929A (en) * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0618309A4 (en) * | 1992-10-21 | 1995-03-29 | Tokin Corp | METAL POWDER COMPOSITION FOR METALLIZATION, AND METALLIC SUBSTRATE. |
| EP1782912A1 (en) * | 2005-10-28 | 2007-05-09 | General Electric Company | Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys |
| US7461772B2 (en) | 2005-10-28 | 2008-12-09 | General Electric Company | Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH022921B2 (en) | 1990-01-19 |
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| EXPY | Cancellation because of completion of term |