JPS6112234U - ボンデイング装置の加熱装置 - Google Patents

ボンデイング装置の加熱装置

Info

Publication number
JPS6112234U
JPS6112234U JP1984094956U JP9495684U JPS6112234U JP S6112234 U JPS6112234 U JP S6112234U JP 1984094956 U JP1984094956 U JP 1984094956U JP 9495684 U JP9495684 U JP 9495684U JP S6112234 U JPS6112234 U JP S6112234U
Authority
JP
Japan
Prior art keywords
heating device
cover
bonding equipment
guide groove
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984094956U
Other languages
English (en)
Japanese (ja)
Other versions
JPH023625Y2 (mo
Inventor
十三男 小林
昌司 川本
Original Assignee
株式会社 新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 新川 filed Critical 株式会社 新川
Priority to JP1984094956U priority Critical patent/JPS6112234U/ja
Publication of JPS6112234U publication Critical patent/JPS6112234U/ja
Application granted granted Critical
Publication of JPH023625Y2 publication Critical patent/JPH023625Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1984094956U 1984-06-25 1984-06-25 ボンデイング装置の加熱装置 Granted JPS6112234U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984094956U JPS6112234U (ja) 1984-06-25 1984-06-25 ボンデイング装置の加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984094956U JPS6112234U (ja) 1984-06-25 1984-06-25 ボンデイング装置の加熱装置

Publications (2)

Publication Number Publication Date
JPS6112234U true JPS6112234U (ja) 1986-01-24
JPH023625Y2 JPH023625Y2 (mo) 1990-01-29

Family

ID=30653844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984094956U Granted JPS6112234U (ja) 1984-06-25 1984-06-25 ボンデイング装置の加熱装置

Country Status (1)

Country Link
JP (1) JPS6112234U (mo)

Also Published As

Publication number Publication date
JPH023625Y2 (mo) 1990-01-29

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