JPS61123553U - - Google Patents

Info

Publication number
JPS61123553U
JPS61123553U JP1985005843U JP584385U JPS61123553U JP S61123553 U JPS61123553 U JP S61123553U JP 1985005843 U JP1985005843 U JP 1985005843U JP 584385 U JP584385 U JP 584385U JP S61123553 U JPS61123553 U JP S61123553U
Authority
JP
Japan
Prior art keywords
layer
plating layer
conductive
printer head
copper plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985005843U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985005843U priority Critical patent/JPS61123553U/ja
Publication of JPS61123553U publication Critical patent/JPS61123553U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
JP1985005843U 1985-01-19 1985-01-19 Pending JPS61123553U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985005843U JPS61123553U (cs) 1985-01-19 1985-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985005843U JPS61123553U (cs) 1985-01-19 1985-01-19

Publications (1)

Publication Number Publication Date
JPS61123553U true JPS61123553U (cs) 1986-08-04

Family

ID=30482730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985005843U Pending JPS61123553U (cs) 1985-01-19 1985-01-19

Country Status (1)

Country Link
JP (1) JPS61123553U (cs)

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