JPS6112941B2 - - Google Patents
Info
- Publication number
- JPS6112941B2 JPS6112941B2 JP10025178A JP10025178A JPS6112941B2 JP S6112941 B2 JPS6112941 B2 JP S6112941B2 JP 10025178 A JP10025178 A JP 10025178A JP 10025178 A JP10025178 A JP 10025178A JP S6112941 B2 JPS6112941 B2 JP S6112941B2
- Authority
- JP
- Japan
- Prior art keywords
- vinyl acetate
- temperature
- acetate copolymer
- sintered body
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 claims description 45
- 230000008018 melting Effects 0.000 claims description 45
- 239000002245 particle Substances 0.000 claims description 43
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 33
- 238000005245 sintering Methods 0.000 claims description 31
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000011256 inorganic filler Substances 0.000 claims description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 12
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 11
- 239000005977 Ethylene Substances 0.000 claims description 11
- 238000007127 saponification reaction Methods 0.000 claims description 10
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000155 melt Substances 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000011148 porous material Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000003350 kerosene Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 235000012438 extruded product Nutrition 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000010446 mirabilite Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadecene Natural products CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- RSIJVJUOQBWMIM-UHFFFAOYSA-L sodium sulfate decahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].[O-]S([O-])(=O)=O RSIJVJUOQBWMIM-UHFFFAOYSA-L 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Description
本発明はエチレン−酢酸ビニル共重合体ケン化
物を用いた焼結体とその製造法に関するものであ
る。
従来高分子多孔材としてポリエチレン、ポリプ
ロピレン、ポリ四フツ化エチレン、ポリフツ化ビ
ニリデン、ポリメチルメタクリレート、ナイロ
ン、アクリロニトリル−スチレン共重合体、
ABS樹脂、ポリ塩化ビニルなど各種の樹脂を原
料とするものが開発されているが、親水性と耐
油・耐溶剤性とを合せ有する多孔材は少ない。し
かして親水性を有する多孔材としてポリビニルア
ルコルをホルマール化したいわゆるホルマールス
ポンジが知られているが、このものは弾力に富む
スポンジ物質であつて、その用途は化粧用スポン
ジなど強度を余り必要としない用途に制限されて
いる。
本発明は焼結成形により親水性で耐油性、耐溶
剤性を有しかつ強度のある多孔材を提供するもの
である。
本発明の焼結体は、エチレン含量10〜60モル
%、酢酸ビニル成分のケン化度80モル%以上のエ
チレン−酢酸ビニル共重合体ケン化物であつて差
動走査熱量計による融解ピークの半値巾が5℃以
上のもの100〜40重量%及び無機フイラー0〜60
重量%よりなる空隙率25〜95%の焼結体であり、
かかる焼結体は上記エチレン−酢酸ビニル共重合
体ケン化物(又は該共重合体ケン化物と無機フイ
ラー)からなる粒子を予備加熱した金型内に充填
し、ついで加圧下に昇温し、粒子の表面のみが溶
融する温度に保つて焼結した後冷却することによ
り得られる。
かくして得られた焼結体は親水性を有すると同
時に耐水性、耐溶剤性、耐オイル性、耐グリース
性を有し、美麗で表面状態も好ましく、硬度も半
硬質のものから硬質のものまで選ぶことができ、
強度も高いので、灯油フイルター、ガソリンスト
レーナー、レントゲンフイルム現像用水切りロー
ラー、インクローラ等の用途にはなはだ重要であ
る。このような性質を有する焼結体は一般の熱可
塑性樹脂を用いたのでは得がたく、又ポリビニル
アルコールの如き親水性樹脂によつては焼結時に
樹脂が熱分解を起すので到底満足なものは得られ
ないし、仮に得られても上記のような用途には耐
水性がないので使用不可能である。
本発明においてはエチレン含量10〜60モル%、
酢酸ビニル成分のケン化度80モル%以上の組成を
有するエチレン−酢酸ビニル共重合体ケン化物が
原料樹脂として用いられる。エチレン含量が10モ
ル%未満では焼結時の温度において溶融のみなら
ず熱分解が起り、エチレン含量が60モル%を越え
るときは耐オイル性、耐溶剤性を欠くようにな
る。又ケン化度が80モル%未満では耐オイル性、
耐溶剤性が不充分な上、耐水性が劣るために寸法
変化、空隙率の変化を起しやすい。
なお上記エチレン−酢酸ビニル共重合体ケン化
物はエチレンと酢酸ビニル(或いはそれをケン化
したビニルアルコール)の各成分のほかに他の共
重合可能なモノマー成分、たとえばプロピレン、
イソブテン、α−オクテン、α−ドデセン、α−
オクタデセンなどのα−オレフイン、アクリル
酸、メタクリル酸、クロトン酸、マレイン酸など
の不飽和酸或いはこれらの部分又は完全アルキル
エステル・アミド・ニトリル・塩・無水物、オレ
フインスルホン酸又はその塩、ビニルエーテル、
酢酸ビニル以外のビニルエステルなどを少量含ん
でいてもよい。
そして上記組成のエチレン−酢酸ビニル共重合
体ケン化物であつても、本発明の目的には該樹脂
の差動走査熱量計による昇温溶融曲線の融解ピー
クの半値巾が5℃以上であることが要求される。
融解ピークの半値巾は主として結晶の大きさの分
布によるものと考えられ、結晶の大きさはエチレ
ン含量、ケン化度、エチレンと酢酸ビニルの共重
合体中におけるランダム性、重合度分布、ケン化
度分布などの要件によつて種々の値をとりうる
が、この半値巾が5℃未満であると焼結温度と圧
力のコントロールが非常にむづかしくなる。たと
えば焼結時粒子全体が融解して空隙率が非常に小
さくなつたり、逆に粒子間の融着が不足して強度
が出なくなつたりすることがある。
第1図にエチレン−酢酸ビニル共重合体ケン化
物の差動走査熱量計による昇温溶融曲線のモデル
を示す。横軸が温度(℃)、縦軸が比熱(cal/g・
℃)を表わす。本発明においてはピーク温度mを
融点、図のx点とy点とのちようど中間の点zか
らベースラインに平行に線を引いたときに曲線と
交わる2点間の温度差n−lを半値巾と定義する
ことにする。ただしパーキンエルマー社の差動走
査熱量計を用い、試料10mg、昇温速度20℃/min
にて測定するものとする。
本発明においてはエチレン−酢酸ビニル共重合
体ケン化物として単一のエチレン−酢酸ビニル共
重合体ケン化物を使用してもよいが、エチレン含
量が10〜60モル%、酢酸ビニル成分のケン化度が
80モル%以上のものであれば2種以上のエチレン
−酢酸ビニル共重合体ケン化物を併用することが
より好ましい。2種以上併用するときの各樹脂の
融点は同一又はごく接近していてもよいが、望ま
しくはその融点が3℃以上離れ、又第2図に示す
l1−n2間の温度差(これを2以上の融解ピークが
現われる場合の半値巾と称することにする)が5
℃以上、なかんずく8℃以上である方がよい。
2種のエチレン−酢酸ビニル共重合体ケン化物
を併用するときの配合比は任意に定めうるが、重
量比で5:95〜95:5、なかんずく10:90〜90:
10とすることが好ましい。3種以上配合する場合
はその最も多い配合割合の樹脂が樹脂全体の95重
量%以下、好ましくは90重量%下を占めることが
好ましい。
エチレン−酢酸ビニル共重合体ケン化物には必
要に応じて無機フイラーが配合される。無機フイ
ラーとしてはガラス繊維、炭素繊維、カーボンブ
ラツク、炭酸カルシウム、タルク、アスベスト、
ケイソウ土、クレー、カオリナイト、ガラスビー
ズ、シラスバルーン、ザクロ石、シリカ、焼石
膏、珪酸カルシウム、酸化アルミニウム、酸化チ
タン、酸化亜鉛、酸化マグネシウム、硫酸バリウ
ム、炭酸マグネシウム、水酸化アルミニウム、窒
化ホウ素、金属粉、芒硝、硫酸アンモニウムなど
があげられる。
無機フイラーの配合により機械的強度及び剛性
の向上、変形に対する耐性の向上、耐水・耐溶剤
性の向上が図られ、コストダウンの点でも有利と
なり、又フイラーとして濡れ性の良いものや導電
性のものを用いれば表面張力の減少、導電性の付
与も達成できる。
無機フイラーの配合量は樹脂100〜40重量%に
対し0〜60重量%にとどめるべきであり、無機フ
イラーの割合がこの範囲を越えると得られる焼結
体の強度が不足してもろくなる。
エチレン−酢酸ビニル共重合体ケン化物に対す
る無機フイラーの配合は、単に両者を粉体同志で
混合するだけでは均一性を欠く恐れがあるので、
両者を混合した後押出機に供給し、吐出物をペレ
ツト化又は粉砕して両者が均一に混合した組成物
を得ることがより好ましい。
焼結成形に供するエチレン−酢酸ビニル共重合
体ケン化物粒子又は該樹脂と無機フイラーとより
なる粒子の大きさは任意に定めうるが、粒子のう
ちの少なくとも80重量%が6メツシユ篩下ないし
250メツシユ篩上の範囲に入る粒度をもつもので
あることが製品用途上望ましい。
粒子は予備加熱した金型内に充填される。この
際粒子の方も予め加熱しておいてもよい。金型の
予備加熱の温度はエチレン−酢酸ビニル共重合体
ケン化物の融点の1/2〜3/4の範囲の温度に設定す
ることが望ましい。たとえば共重合体ケン化物の
融点が178℃であれば、178×1/2〜178×3/4、即
ち89〜133.5℃の範囲の温度に設定するわけであ
る。予備加熱の温度が上記範囲より低いときは作
業に長い時間がかかり、熱量的にも不利で工業生
産に不適当となり、一方上記範囲より高いときは
温度と圧力のバランスがとりにくく、空隙率がコ
ントロールしにくくなる。
なおエチレン−酢酸ビニル共重合体ケン化物を
1種用いたときは融解ピークは1つしかなく融点
も一義的に決まるが、エチレン−酢酸ビニル共重
合体ケン化物を2種以上併用したときはピークが
重なる場合を除き融点が複数存在することにな
る。この場合は予備加熱温度が少なくとも一つの
融点の1/2〜3/4に該当すればよい。ただしある種
の共重合体ケン化物の配合量が小さく溶解ピーク
の面積が余りに小さいときは、それを無視して残
りの共重合体ケン化物の融点を基準にとればよ
い。
粒子を金型に充填した後はおよそ0.1〜10Kg/cm2
の圧力を加え、この範囲の圧力下に所定温度まで
昇温していく。圧力は昇温中徐々に上げていくこ
ともできる。昇温速度は0.5〜20℃/minとするの
が適当である。圧力が低すぎると粒子間の接着力
が得られず、強度が出なくなり、高すぎると空隙
率が下がりすぎるようになる。昇温速度が余りに
遅いと粒子全体が融解して焼結体としての空隙が
できなくなり、一方余りに速いと温度のコントロ
ール、特に昇温を止める温度のコントロールがし
にくくなる。
昇温により温度を粒子の表面のみが融解する温
度にまで上げ、目的物の大きさ、厚みに応じてこ
の温度に通常約1〜30分程度保つて焼結成形を行
なう。粒子の表面のみが溶融する温度とはエチレ
ン−酢酸ビニル共重合体ケン化物の融点より30℃
低い温度ないし融点より30℃高い温度を言う。融
解ピークが2以上あるときは焼結温度がそのうち
の少なくとも一つの融点の±30℃の範囲にあれば
よい。ただし融解ピークの面積の余りに小さいも
のは無視して残りの共重合体ケン化物の融点を基
準にとる。焼結温度が上記範囲より低いときは焼
結不充分となつて成形物の強度が著しく劣り、一
方温度が高すぎるときは空隙率が低下して連続気
孔とならない恐れがある。
かかる方法により焼結体が得られるが、その空
隙率は25〜95%となるように焼結条件を選ぶべき
であり、空隙率が25%未満では連続気孔となら
ず、過性や濡れ性が悪くなり、空隙率が95%を
越えるときは焼結体の強度が不足するようにな
る。
空隙率(%)は焼結により得られた多孔体の密
度をd(g/c.c.)、多孔体と同一組成のポリマー又
は組成物の真の密度をdo(g/c.c.)とするとき、
(1−d/do)×100の式によつて算出できる。
焼結体の気孔径は0.1mμから500μ程度までに
調節しうる。
焼結体の形状は金型に応じて任意に選択するこ
とができる。たとえば円筒状、円盤状、円柱状、
角筒状、板状、角柱状、凹形、波形などのほか複
雑な形状のものも容易に製作することができ、さ
らにはこれを曲げ、切削など二次加工することも
できる。
本発明の焼結体は気体の過、液体の過、廃
油捕集、油大分離、電界隔膜、ローラーなど多種
の用途に使用しうる。具体例をあげれば灯油フイ
ルター、ガソリンストレーナー、食品関係フイル
ター、、レントゲンフイルム現像用水切りローラ
ー、インクローラー、プリンター用インク供給
部、筆記具のペン先、機械部品、軸受けなどであ
る。又無機フイラーとして炭素繊維、カーボンブ
ラツク、金属粉など導電性物質を用いたときは電
波暗室用壁材にも用いることができる。
次に例をあげて本発明の焼結体及びその製造法
をさらに説明する。
例 1
エチレン含量32モル%、酢酸ビニル成分のケン
化度98.5モル%のエチレン−酢酸ビニル共重合体
ケン化物であつて融点178℃、融解ピークの半値
巾7℃の樹脂のペレツトを粉砕機で粉砕して125
〜297μ(48メツシユ篩下ないし120メツシユ篩
上)の粒子を篩分けした。
この粒子を予め120℃に加熱した外径40mm、内
径20mmのパイプ型金型に充填し、2Kg/cm2で加圧
しながら2℃/minの速度で175℃まで昇温し、こ
の温度に18分間保つた後金型を冷却して、型から
長さ40mmのパイプ状焼結製品を取り出した。この
焼結体の空隙率は45%であつた。
かくして得られた焼結体の性質を第1表に示す
が、親水性を有するにもかかわらず耐水性、耐ト
リクレン性、耐ガソリン性がすぐれており、機械
的強度も良好であつた。
対照例 1
ポリビニルアルコール(重合度1700、ケン化度
99.0モル%)の125〜297μの粒子を用いて例1と
同様にして焼結成形を試みたが、焼結温度175℃
では粒子間の融着が起らず、185℃、195℃、205
℃でも融着の程度は乏しく、215℃、225℃では融
着と同時に熱分解が起り、得られる焼結体は黄な
いし褐色に着色し、劣化のため強度は著しく小さ
かつた。
対照例 2
例1と同じ組成を有するが、融点165℃、半値
巾4℃のエチレン−酢酸ビニル共重合体ケン化物
粒子(125〜297μ)を用いて例1と同様の焼結成
形を試みた。しかしながら粒子間の融着を充分に
達成するほど焼結温度を高めると粒子全体が溶融
して空隙率が非常に小さくなり、一方焼結温度を
低目にすると今度は粒子間の接着力が著しく不足
し、極めてもろいものしか得られなかつた。
対照例 3
密度0.960、メルトインデツクス0.2、粒度70〜
100μの高密度ポリエチレン流子を用い、金型予
熱温度100℃、昇温速度5℃/min、圧力4Kg/
cm2、焼結温度160℃、焼結時間12分の条件で焼結
成形を行なつた。得られた空隙率37%の焼結体の
性質を第1表に示すが、耐トリクレン性、耐ガソ
リン性、親水性が劣つていた。
対照例 4
粘度150〜220μのポリメチルメタクリレートの
粒子を用い、金型予熱温度60℃、昇温速度1℃/
min、圧力2Kg/cm2、焼結温度110℃、焼結時間15
分の条件で焼結成形を行なつた。得られた空隙率
35%の焼結体の性質を第1表に示すが、耐トリク
レン性、耐ガソリン性、親水性が劣つていた。
例 2
例1で用いたエチレン−酢酸ビニル共重合体ケ
ン化物の粒子65重量部とタルク粉末35重量部とを
ヘンシルミキサーにて混合後押出機に供給してペ
レツト化し、ついでこのペレツトを粉砕して125
〜297μ(48メツシユ篩下ないし120メツシユ篩
上)の粒子を篩分けした。この粒子の融点、半値
巾は例1の場合と同じであつた。
この粒子を用いて例1の場合と同様の条件で焼
結成形を行なつた。焼結体の空隙率は48%であつ
た。
かくして得られた焼結体の性質を第1表に示
す。
The present invention relates to a sintered body using a saponified ethylene-vinyl acetate copolymer and a method for producing the same. Conventional polymeric porous materials include polyethylene, polypropylene, polytetrafluoroethylene, polyvinylidene fluoride, polymethyl methacrylate, nylon, acrylonitrile-styrene copolymer,
Although materials made from various resins such as ABS resin and polyvinyl chloride have been developed, there are few porous materials that have both hydrophilicity and oil/solvent resistance. However, so-called formal sponge, which is made by formalizing polyvinyl alcohol, is known as a hydrophilic porous material, but this material is a sponge material with high elasticity, and its uses do not require much strength, such as cosmetic sponges. limited in use. The present invention provides a porous material that is hydrophilic, oil resistant, solvent resistant, and strong by sintering. The sintered body of the present invention is a saponified ethylene-vinyl acetate copolymer having an ethylene content of 10 to 60 mol% and a saponification degree of vinyl acetate component of 80 mol% or more, which is half the melting peak measured by a differential scanning calorimeter. Width of 5℃ or more 100-40% by weight and inorganic filler 0-60
It is a sintered body with a porosity of 25 to 95% by weight,
Such a sintered body is produced by filling particles made of the saponified ethylene-vinyl acetate copolymer (or the saponified copolymer and an inorganic filler) into a preheated mold, and then raising the temperature under pressure to form the particles. It is obtained by sintering at a temperature at which only the surface of the material melts, followed by cooling. The sintered body thus obtained has hydrophilicity, as well as water resistance, solvent resistance, oil resistance, and grease resistance, is beautiful, has a favorable surface condition, and has a hardness ranging from semi-hard to hard. you can choose,
Because of its high strength, it is extremely important for applications such as kerosene filters, gasoline strainers, drain rollers for X-ray film development, and ink rollers. A sintered body with such properties is difficult to obtain by using general thermoplastic resins, and with hydrophilic resins such as polyvinyl alcohol, the resin undergoes thermal decomposition during sintering, so it is completely unsatisfactory. cannot be obtained, and even if it were obtained, it cannot be used for the above-mentioned purposes because it lacks water resistance. In the present invention, the ethylene content is 10 to 60 mol%,
A saponified ethylene-vinyl acetate copolymer having a saponification degree of vinyl acetate component of 80 mol% or more is used as the raw material resin. If the ethylene content is less than 10 mol%, not only melting but also thermal decomposition will occur at the sintering temperature, and if the ethylene content exceeds 60 mol%, oil resistance and solvent resistance will be lacking. Also, if the degree of saponification is less than 80 mol%, oil resistance,
Due to insufficient solvent resistance and poor water resistance, dimensional changes and porosity changes are likely to occur. The saponified ethylene-vinyl acetate copolymer contains, in addition to each component of ethylene and vinyl acetate (or vinyl alcohol obtained by saponifying it), other copolymerizable monomer components, such as propylene,
Isobutene, α-octene, α-dodecene, α-
α-olefins such as octadecene, unsaturated acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, or parts thereof, fully alkyl esters, amides, nitriles, salts, anhydrides, olefinsulfonic acid or its salts, vinyl ethers,
It may also contain a small amount of vinyl ester other than vinyl acetate. Even if the saponified ethylene-vinyl acetate copolymer has the above composition, for the purpose of the present invention, the half width of the melting peak of the temperature rising melting curve measured by the differential scanning calorimeter of the resin is 5°C or more. is required.
The half width of the melting peak is thought to be mainly due to the distribution of crystal size, and the crystal size is influenced by the ethylene content, degree of saponification, randomness in the copolymer of ethylene and vinyl acetate, distribution of degree of polymerization, and saponification. Various values can be taken depending on requirements such as temperature distribution, but if this half width is less than 5°C, it becomes very difficult to control the sintering temperature and pressure. For example, during sintering, the entire particle may melt and the porosity becomes extremely small, or conversely, the fusion between the particles may be insufficient, resulting in a lack of strength. FIG. 1 shows a model of the heating melting curve of a saponified ethylene-vinyl acetate copolymer measured by a differential scanning calorimeter. The horizontal axis is temperature (℃), and the vertical axis is specific heat (cal/g・
℃). In the present invention, the peak temperature m is the melting point, and the temperature difference n-l between the two points that intersect the curve when a line is drawn parallel to the baseline from the intermediate point z after the x and y points in the figure is defined as the melting point. Let's define it as half width. However, a PerkinElmer differential scanning calorimeter was used, the sample was 10 mg, and the heating rate was 20°C/min.
shall be measured at In the present invention, a single saponified ethylene-vinyl acetate copolymer may be used as the saponified ethylene-vinyl acetate copolymer. but
It is more preferable to use two or more saponified ethylene-vinyl acetate copolymers together if the content is 80 mol% or more. When two or more resins are used together, the melting points of each resin may be the same or very close to each other, but preferably the melting points are 3°C or more apart, and the melting points are as shown in Figure 2.
The temperature difference between l 1 - n 2 (this is called the half-width when two or more melting peaks appear) is 5
The temperature should preferably be 8°C or higher, especially 8°C or higher. The blending ratio when two types of saponified ethylene-vinyl acetate copolymers are used together can be determined arbitrarily, but the weight ratio is 5:95 to 95:5, especially 10:90 to 90:
It is preferable to set it to 10. When three or more types are blended, it is preferable that the resin having the largest proportion accounts for 95% by weight or less, preferably 90% by weight or less of the entire resin. If necessary, an inorganic filler is added to the saponified ethylene-vinyl acetate copolymer. Inorganic fillers include glass fiber, carbon fiber, carbon black, calcium carbonate, talc, asbestos,
Diatomaceous earth, clay, kaolinite, glass beads, shirasu balloons, garnet, silica, calcined gypsum, calcium silicate, aluminum oxide, titanium oxide, zinc oxide, magnesium oxide, barium sulfate, magnesium carbonate, aluminum hydroxide, boron nitride, Examples include metal powder, Glauber's salt, and ammonium sulfate. The blending of inorganic fillers improves mechanical strength and rigidity, improves resistance to deformation, and improves water and solvent resistance, which is advantageous in terms of cost reduction. By using these materials, it is possible to reduce surface tension and impart electrical conductivity. The content of the inorganic filler should be limited to 0 to 60% by weight based on 100 to 40% by weight of the resin; if the proportion of the inorganic filler exceeds this range, the resulting sintered body will lack strength and become brittle. When blending an inorganic filler with a saponified ethylene-vinyl acetate copolymer, simply mixing the two powders together may result in lack of uniformity.
It is more preferable to mix the two and then supply it to an extruder, and pelletize or crush the extruded product to obtain a composition in which both are uniformly mixed. The size of the saponified ethylene-vinyl acetate copolymer particles or particles made of the resin and inorganic filler to be subjected to sintering may be determined arbitrarily, but at least 80% by weight of the particles should be 6 mesh sieve or below.
It is desirable for the product to have a particle size that falls within the range of 250 mesh sieve or higher. The particles are filled into a preheated mold. At this time, the particles may also be heated in advance. The temperature for preheating the mold is desirably set to a temperature in the range of 1/2 to 3/4 of the melting point of the saponified ethylene-vinyl acetate copolymer. For example, if the melting point of the saponified copolymer is 178°C, the temperature is set in the range of 178×1/2 to 178×3/4, that is, 89 to 133.5°C. When the preheating temperature is lower than the above range, the work takes a long time and is disadvantageous in terms of calorific value, making it unsuitable for industrial production.On the other hand, when it is higher than the above range, it is difficult to balance the temperature and pressure, and the porosity decreases. becomes difficult to control. Note that when one type of saponified ethylene-vinyl acetate copolymer is used, there is only one melting peak and the melting point is uniquely determined, but when two or more types of saponified ethylene-vinyl acetate copolymer are used together, there is a peak. There will be multiple melting points unless they overlap. In this case, it is sufficient that the preheating temperature corresponds to 1/2 to 3/4 of the melting point of at least one. However, if the amount of a certain type of saponified copolymer is small and the area of the dissolution peak is too small, it may be ignored and the melting point of the remaining saponified copolymer taken as the standard. Approximately 0.1~10Kg/cm 2 after filling the particles into the mold
The temperature is increased to a predetermined temperature under this pressure range. The pressure can also be increased gradually during heating. It is appropriate that the temperature increase rate be 0.5 to 20°C/min. If the pressure is too low, no adhesion between the particles can be obtained, resulting in no strength, while if the pressure is too high, the porosity will be too low. If the heating rate is too slow, the entire particle will melt and no voids will be formed in the sintered body, while if it is too fast, it will be difficult to control the temperature, especially the temperature that stops the heating. The temperature is raised to a temperature at which only the surface of the particles melts, and sintering is carried out by maintaining this temperature for about 1 to 30 minutes, depending on the size and thickness of the object. The temperature at which only the surface of the particles melts is 30°C above the melting point of the saponified ethylene-vinyl acetate copolymer.
It refers to a temperature that is low or 30°C higher than the melting point. When there are two or more melting peaks, the sintering temperature should be within ±30°C of the melting point of at least one of them. However, if the area of the melting peak is too small, it is ignored and the melting point of the remaining saponified copolymer is taken as the standard. If the sintering temperature is lower than the above range, sintering will be insufficient and the strength of the molded product will be significantly inferior, while if the temperature is too high, the porosity may decrease and continuous pores may not be formed. A sintered body can be obtained by this method, but the sintering conditions should be selected so that the porosity is 25 to 95%. If the porosity is less than 25%, continuous pores will not be obtained, and porosity and wettability will occur. When the porosity exceeds 95%, the strength of the sintered body becomes insufficient. The porosity (%) is when the density of the porous body obtained by sintering is d (g/cc), and the true density of the polymer or composition having the same composition as the porous body is do (g/cc).
It can be calculated using the formula (1-d/do)×100. The pore diameter of the sintered body can be adjusted from 0.1 mμ to about 500μ. The shape of the sintered body can be arbitrarily selected depending on the mold. For example, cylindrical, disk-shaped, cylindrical,
In addition to rectangular tube shapes, plate shapes, prismatic shapes, concave shapes, wave shapes, etc., complex shapes can also be easily manufactured, and furthermore, these can be subjected to secondary processing such as bending and cutting. The sintered body of the present invention can be used for various purposes such as gas filtration, liquid filtration, waste oil collection, large oil separation, electric field diaphragm, and rollers. Specific examples include kerosene filters, gasoline strainers, food-related filters, drain rollers for X-ray film development, ink rollers, ink supply units for printers, pen nibs for writing instruments, mechanical parts, and bearings. Furthermore, when a conductive substance such as carbon fiber, carbon black, or metal powder is used as the inorganic filler, it can also be used as a wall material for an anechoic chamber. Next, the sintered body of the present invention and its manufacturing method will be further explained by giving examples. Example 1 A saponified ethylene-vinyl acetate copolymer with an ethylene content of 32 mol% and a degree of saponification of the vinyl acetate component of 98.5 mol%, with a melting point of 178°C and a melting peak half width of 7°C, was crushed into pellets using a crusher. Shattered to 125
Particles of ~297μ (48 mesh below to 120 mesh above) were sieved. These particles were filled into a pipe-shaped mold with an outer diameter of 40 mm and an inner diameter of 20 mm that had been preheated to 120°C, and the temperature was increased to 175°C at a rate of 2°C/min while pressurizing at 2 kg/ cm2 . After holding for a minute, the mold was cooled and a 40 mm long pipe-shaped sintered product was taken out from the mold. The porosity of this sintered body was 45%. The properties of the sintered body thus obtained are shown in Table 1. Despite being hydrophilic, it had excellent water resistance, trichlene resistance, and gasoline resistance, as well as good mechanical strength. Control example 1 Polyvinyl alcohol (polymerization degree 1700, saponification degree
Sintering was attempted in the same manner as in Example 1 using particles of 125 to 297μ (99.0 mol%), but the sintering temperature was 175°C.
At 185℃, 195℃, 205℃, no fusion occurred between particles.
The degree of fusion was poor even at 215°C and 225°C, and thermal decomposition occurred simultaneously with fusion, and the resulting sintered body was colored yellow or brown, and its strength was extremely low due to deterioration. Control Example 2 Sintering molding was attempted in the same manner as in Example 1 using saponified ethylene-vinyl acetate copolymer particles (125-297μ) having the same composition as Example 1, but with a melting point of 165°C and a half-width of 4°C. . However, if the sintering temperature is raised enough to achieve sufficient fusion between the particles, the entire particle will melt and the porosity will become extremely small, whereas if the sintering temperature is lowered, the adhesion between the particles will be significantly reduced. They were in short supply and could only obtain extremely fragile materials. Control example 3 Density 0.960, melt index 0.2, particle size 70~
Using 100μ high-density polyethylene fluid, mold preheating temperature 100℃, heating rate 5℃/min, pressure 4Kg/
cm 2 , sintering temperature of 160° C., and sintering time of 12 minutes. The properties of the obtained sintered body with a porosity of 37% are shown in Table 1, and it was found to be poor in trichlene resistance, gasoline resistance, and hydrophilicity. Control example 4 Using polymethyl methacrylate particles with a viscosity of 150 to 220μ, mold preheating temperature 60℃, temperature increase rate 1℃/
min, pressure 2Kg/cm 2 , sintering temperature 110℃, sintering time 15
The sintering process was carried out under the following conditions. Obtained porosity
The properties of the 35% sintered body are shown in Table 1, and it was found that the trichlene resistance, gasoline resistance, and hydrophilicity were poor. Example 2 65 parts by weight of the saponified ethylene-vinyl acetate copolymer particles used in Example 1 and 35 parts by weight of talc powder were mixed in a Henshil mixer, fed into an extruder to form pellets, and then the pellets were crushed. and 125
Particles of ~297μ (48 mesh below to 120 mesh above) were sieved. The melting point and half width of the particles were the same as in Example 1. Using these particles, sintering was carried out under the same conditions as in Example 1. The porosity of the sintered body was 48%. The properties of the sintered body thus obtained are shown in Table 1.
【表】【table】
【表】
例 3
エチレン含量42モル%、酢酸ビニル成分のケン
化度99.0モル%のエチレン−酢酸ビニル共重合体
ケン化物であつて融点165℃、融解ピークの半値
巾8℃の樹脂粉末の55メツシユ篩下ないし170メ
ツシユ篩上の篩分け品を予め約90℃に予熱し、こ
の粒子を予め100℃に加熱した外径30mm、内径20
mmのパイプ型金型に充填し、4Kg/cm2で加圧しな
がら3℃/minの速度で160℃まで昇温し、この温
度に12分間保つて焼結を行なつた後金型を冷却し
て、型から長さ300mmのパイプ状焼結体を取り出
した。この焼結体の空隙率は43%であつた。
かくして得られた焼結体の性質を第2表に示
す。
例 4
例3で用いたエチレン−酢酸ビニル共重合体ケ
ン化物の粉末80重量部と炭酸カルシウム微粉末20
重量部とをヘンシエルミキサーにて混合後押出機
に供給してペレツト化し、ついいでこのペレツト
を粉砕して125〜297μ(48メツシユ篩下ないし
120メツシユ篩上)の粒子を篩分けした。この粒
子の融点、半値巾は例3の場合と同じであつた。
この粒子を用いて例1の場合と同様の条件で焼
結成形を行なつた。焼結体の空隙率は47%であつ
た。
結果を第3表に示す。
例 5
例1で用いたエチレン−酢酸ビニル共重合体ケ
ン化物ペレツトの粉砕品と例3で用いたエチレン
−酢酸ビニル共重合体ケン化物の粉末とを重量で
80:20の割合でヘンシエルミキサーにて混合後押
出機に供給してペレツト化し、ついでこのペレツ
トを粉砕して125〜297μの粒子を篩分けした。こ
の粒子は融解ピークが178℃と165℃とにあり、第
2図のl1−n2間の温度差に相当する半値巾は20℃
であつた。
この粒子を用いて粒子予熱温度110℃、金型予
熱温度120℃、昇温速度2℃/min、圧力5Kg/
cm2、焼結温度190℃、焼結時間13分の条件で焼結
成形を行なつた。焼結体の空隙率は47%であつ
た。
結果を第2表に示す。
例 6
例5の樹脂混合物70重量部にさらにガラス繊維
30重量部を混合し、ペレツト化、粉砕、篩分けを
行なつた。融解ピーク、半値巾は例5の場合と同
じであつた。
この粒子を用いて粒子予熱温度125℃、金型予
熱温度135℃、昇温速度4℃/min、圧力6Kg/
cm2、焼結温度200℃、焼結時間14分の条件で焼結
形成を行なつた。焼結体の空隙率は46%であつ
た。
結果を第2表に示す。[Table] Example 3 55 of a saponified ethylene-vinyl acetate copolymer with an ethylene content of 42 mol% and a degree of saponification of the vinyl acetate component of 99.0 mol%, a melting point of 165°C, and a half-width of the melting peak of 8°C. The sieved product under the mesh sieve or on the 170 mesh sieve is preheated to approximately 90°C, and the particles are preheated to 100°C with an outer diameter of 30 mm and an inner diameter of 20 mm.
The material was filled into a pipe-shaped mold with a diameter of 1.5 mm, and the temperature was raised to 160 °C at a rate of 3 °C/min while pressurizing at 4 kg/cm 2. After sintering by keeping at this temperature for 12 minutes, the mold was cooled. Then, a pipe-shaped sintered body with a length of 300 mm was taken out from the mold. The porosity of this sintered body was 43%. The properties of the sintered body thus obtained are shown in Table 2. Example 4 80 parts by weight of the saponified ethylene-vinyl acetate copolymer powder used in Example 3 and 20 parts by weight of calcium carbonate fine powder
After mixing parts by weight in a Henschel mixer, the pellets are fed to an extruder to form pellets, and then the pellets are crushed to a size of 125 to 297μ (under a 48 mesh sieve).
The particles were sieved (on a 120 mesh sieve). The melting point and half width of this particle were the same as in Example 3. Using these particles, sintering was carried out under the same conditions as in Example 1. The porosity of the sintered body was 47%. The results are shown in Table 3. Example 5 The pulverized pellets of saponified ethylene-vinyl acetate copolymer used in Example 1 and the saponified ethylene-vinyl acetate copolymer powder used in Example 3 were calculated by weight.
After mixing in a Henschel mixer at a ratio of 80:20, the mixture was fed to an extruder to form pellets, and the pellets were then ground and sieved to obtain particles of 125-297μ. These particles have melting peaks at 178°C and 165°C, and the half-width corresponding to the temperature difference between l 1 - n 2 in Figure 2 is 20°C.
It was hot. Using these particles, the particle preheating temperature was 110℃, the mold preheating temperature was 120℃, the heating rate was 2℃/min, and the pressure was 5Kg/min.
cm 2 , sintering temperature of 190° C., and sintering time of 13 minutes. The porosity of the sintered body was 47%. The results are shown in Table 2. Example 6 Add glass fiber to 70 parts by weight of the resin mixture of Example 5.
30 parts by weight were mixed, pelletized, crushed, and sieved. The melting peak and half width were the same as in Example 5. Using these particles, the particle preheating temperature was 125℃, the mold preheating temperature was 135℃, the heating rate was 4℃/min, and the pressure was 6Kg/min.
cm 2 , sintering temperature of 200° C., and sintering time of 14 minutes. The porosity of the sintered body was 46%. The results are shown in Table 2.
【表】【table】
第1図はエチレン−酢酸ビニル共重合体ケン化
物の差動走査熱量計による昇温溶融曲線の1例を
示した関係図、第2図は2種のエチレン−酢酸ビ
ニル共重合体ケン化物をブレンドしたときの昇温
溶融曲線の1例を示した関係図である。
Figure 1 is a relational diagram showing an example of the temperature rise melting curve measured by a differential scanning calorimeter for a saponified ethylene-vinyl acetate copolymer, and Figure 2 is a diagram showing an example of the temperature rise melting curve of a saponified ethylene-vinyl acetate copolymer. It is a relationship diagram showing an example of a temperature rise melting curve when blended.
Claims (1)
のケン化度80モル%以上のエチレン−酢酸ビニル
共重合体ケン化物であつて差動走査熱量計による
融解ピークの半値巾が5℃以上のもの100〜40重
量%及び無機フイラー0〜60重量%よりなる空隙
率25〜95%の焼結体。 2 エチレン−酢酸ビニル共重合体ケン化物が、
融点(融解ピーク温度)が3℃以上離れた2種以
上のエチレン−酢酸ビニル共重合体ケン化物の混
合物である特許請求の範囲第1項記載の焼結体。 3 エチレン含量10〜60モル%、酢酸ビニル成分
のケン化度80モル%以上のエチレン−酢酸ビニル
共重合体ケン化物100〜40重量%及び無機フイラ
ー0〜60重量%よりなる粒子を予備加熱した金型
内に充填し、ついで加圧下に昇温し、粒子の表面
のみが溶融する温度に保つて焼結した後冷却する
ことにより空隙率25〜95%の焼結体を取得するこ
とを特徴とする焼結体の製造法。 4 粒子として、6メツシユ篩下ないし250メツ
シユ篩上の範囲に80重量%以上含まれるような粒
度を有する粒子を用いることを特徴とする特許請
求の範囲第3項記載の製造法。 5 金型の予備加熱温度を、樹脂の融点の1/2〜
3/4の範囲の温度に設定することを特徴とする特
許請求の範囲第3項記載の製造法。 6 表面のみ溶融する温度が、樹脂の融点より30
℃低い温度ないし融点より30℃高い温度である特
許請求の範囲第3項記載の製造法。 7 エチレン−酢酸ビニル共重合体ケン化物とし
て、融点が3℃以上離れた2種以上のエチレン−
酢酸ビニル共重合体ケン化物を併用することを特
徴とする特許請求の範囲第3項記載の製造法。[Scope of Claims] 1 A saponified ethylene-vinyl acetate copolymer having an ethylene content of 10 to 60 mol% and a degree of saponification of the vinyl acetate component of 80 mol% or more, the half width of the melting peak measured by a differential scanning calorimeter. A sintered body with a porosity of 25 to 95%, consisting of 100 to 40% by weight of a filler with a temperature of 5°C or higher and 0 to 60% by weight of an inorganic filler. 2 The saponified ethylene-vinyl acetate copolymer is
The sintered body according to claim 1, which is a mixture of two or more saponified ethylene-vinyl acetate copolymers whose melting points (melting peak temperatures) are 3° C. or more apart. 3. Particles consisting of a saponified ethylene-vinyl acetate copolymer with an ethylene content of 10 to 60 mol%, a degree of saponification of the vinyl acetate component of 80 mol% or more and 100 to 40% by weight, and an inorganic filler of 0 to 60% by weight were preheated. A sintered body with a porosity of 25 to 95% is obtained by filling it into a mold, raising the temperature under pressure, sintering at a temperature that melts only the surface of the particles, and then cooling. A method for manufacturing a sintered body. 4. The manufacturing method according to claim 3, characterized in that the particles have a particle size such that 80% by weight or more is contained in the range from below a 6-mesh sieve to above a 250-mesh sieve. 5 Set the preheating temperature of the mold to 1/2 to 1/2 of the melting point of the resin.
The manufacturing method according to claim 3, characterized in that the temperature is set in a range of 3/4. 6 The temperature at which only the surface melts is 30° below the melting point of the resin.
The manufacturing method according to claim 3, wherein the temperature is 30°C lower than the melting point or 30°C higher than the melting point. 7 As a saponified ethylene-vinyl acetate copolymer, two or more types of ethylene-vinyl acetate copolymer having melting points separated by 3°C or more are used.
The manufacturing method according to claim 3, characterized in that a saponified vinyl acetate copolymer is used in combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10025178A JPS5527239A (en) | 1978-08-16 | 1978-08-16 | Sintered material and process of production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10025178A JPS5527239A (en) | 1978-08-16 | 1978-08-16 | Sintered material and process of production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5527239A JPS5527239A (en) | 1980-02-27 |
| JPS6112941B2 true JPS6112941B2 (en) | 1986-04-10 |
Family
ID=14268998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10025178A Granted JPS5527239A (en) | 1978-08-16 | 1978-08-16 | Sintered material and process of production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5527239A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210316566A1 (en) * | 2018-08-07 | 2021-10-14 | Mitsubishi Pencil Company, Limited | Pen tip and writing tool equipped with the pen tip |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4554775B2 (en) * | 2000-07-11 | 2010-09-29 | 日本合成化学工業株式会社 | Ferrite magnet manufacturing method |
-
1978
- 1978-08-16 JP JP10025178A patent/JPS5527239A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210316566A1 (en) * | 2018-08-07 | 2021-10-14 | Mitsubishi Pencil Company, Limited | Pen tip and writing tool equipped with the pen tip |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5527239A (en) | 1980-02-27 |
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