JPS61134006U - - Google Patents
Info
- Publication number
- JPS61134006U JPS61134006U JP1985016887U JP1688785U JPS61134006U JP S61134006 U JPS61134006 U JP S61134006U JP 1985016887 U JP1985016887 U JP 1985016887U JP 1688785 U JP1688785 U JP 1688785U JP S61134006 U JPS61134006 U JP S61134006U
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- light
- trimming device
- control section
- monitors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009966 trimming Methods 0.000 claims description 3
- 239000000284 extract Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
第１図は本考案によるＹＡＧレーザトリミング
装置の構成図、第２図は従来のレーザトリミング
装置の構成図である。
１……電源部、２……反射ミラー、３……出力
ミラー、４……ハーフミラー（ダイクロイツクミ
ラー）、５……集光レンズ、６……加工物、７…
…載物台、８……ハーフミラー、９……ハーフミ
ラー、１０……フオトダイオード、１１……フオ
トダイオード、１２……透過光制御部、１３……
ＹＡＧレーザ。
FIG. 1 is a block diagram of a YAG laser trimming device according to the present invention, and FIG. 2 is a block diagram of a conventional laser trimming device. DESCRIPTION OF SYMBOLS 1... Power supply part, 2... Reflection mirror, 3... Output mirror, 4... Half mirror (dichroic mirror), 5... Condensing lens, 6... Workpiece, 7...
... Stage, 8 ... Half mirror, 9 ... Half mirror, 10 ... Photo diode, 11 ... Photo diode, 12 ... Transmitted light control section, 13 ...
YAG laser.
Claims (1)
部をとり出し、光の強度をモニタするモニタ部と
、レーザ光の光路に光の透過量をコントロールす
る制御部とを有することを特徴とするレーザトリ
ミング装置。 What is claimed is: 1. A laser trimming device comprising: a monitor section that extracts a portion of the laser beam and monitors the intensity of the light; and a control section that controls the amount of light transmitted through the optical path of the laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985016887U JPS61134006U (en) | 1985-02-08 | 1985-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985016887U JPS61134006U (en) | 1985-02-08 | 1985-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61134006U true JPS61134006U (en) | 1986-08-21 |
Family
ID=30504077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985016887U Pending JPS61134006U (en) | 1985-02-08 | 1985-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61134006U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0259187A (en) * | 1988-08-25 | 1990-02-28 | Matsushita Electric Ind Co Ltd | Laser trimming device and trimming method |
| JPH02205281A (en) * | 1989-02-03 | 1990-08-15 | Nec Corp | Wafer marking device |
-
1985
- 1985-02-08 JP JP1985016887U patent/JPS61134006U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0259187A (en) * | 1988-08-25 | 1990-02-28 | Matsushita Electric Ind Co Ltd | Laser trimming device and trimming method |
| JPH02205281A (en) * | 1989-02-03 | 1990-08-15 | Nec Corp | Wafer marking device |