JPS6116079Y2 - - Google Patents
Info
- Publication number
- JPS6116079Y2 JPS6116079Y2 JP1980097785U JP9778580U JPS6116079Y2 JP S6116079 Y2 JPS6116079 Y2 JP S6116079Y2 JP 1980097785 U JP1980097785 U JP 1980097785U JP 9778580 U JP9778580 U JP 9778580U JP S6116079 Y2 JPS6116079 Y2 JP S6116079Y2
- Authority
- JP
- Japan
- Prior art keywords
- needle
- blade cutter
- thin material
- cutting
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Details Of Cutting Devices (AREA)
- Nonmetal Cutting Devices (AREA)
- Shearing Machines (AREA)
- Accessories And Tools For Shearing Machines (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980097785U JPS6116079Y2 (mo) | 1980-07-10 | 1980-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980097785U JPS6116079Y2 (mo) | 1980-07-10 | 1980-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5723926U JPS5723926U (mo) | 1982-02-06 |
| JPS6116079Y2 true JPS6116079Y2 (mo) | 1986-05-17 |
Family
ID=29459543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980097785U Expired JPS6116079Y2 (mo) | 1980-07-10 | 1980-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116079Y2 (mo) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2666391B2 (ja) * | 1988-07-14 | 1997-10-22 | 日本電気株式会社 | 遅延線路 |
| DE102006051349A1 (de) * | 2006-10-31 | 2008-05-08 | Sms Demag Ag | Verfahren und Vorrichtung zum Teilen von Metallband |
-
1980
- 1980-07-10 JP JP1980097785U patent/JPS6116079Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5723926U (mo) | 1982-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3400279B2 (ja) | バンプ形成方法 | |
| US3650454A (en) | Device for bonding with a compliant medium | |
| US3533155A (en) | Bonding with a compliant medium | |
| US3026603A (en) | Method of making electrical contacts and the like | |
| JP3005786B2 (ja) | チップボンデイング方法及び装置 | |
| US3563443A (en) | Pneumatic force-exerting system | |
| JPS5937913A (ja) | 調理器具およびその製造方法 | |
| JPS6116079Y2 (mo) | ||
| US2492162A (en) | Method and apparatus for sealing electrodes in envelopes of electron discharge tubes | |
| JPH0793305B2 (ja) | バンプ形成方法およびバンプ形成装置 | |
| US5799771A (en) | Contact with a silver contact base and process for making the same | |
| US3657789A (en) | Apparatus for preparing a microelement for soldering | |
| CN114193158B (zh) | 一种电触头组件自动焊接机头 | |
| JP2014147945A (ja) | ろう材供給装置 | |
| JPH054597U (ja) | リード成形装置 | |
| US4152172A (en) | Method for cleaning raised terminal pads of semiconductor elements | |
| JPS6320118Y2 (mo) | ||
| JPS6136378B2 (mo) | ||
| JPH0126174B2 (mo) | ||
| US3911569A (en) | Method and apparatus for bonding miniature semiconductor pill-type components to a circuit board | |
| CN115194370B (zh) | 镍铬丝压装单元、镍铬丝压装设备及镍铬丝压装方法 | |
| JPH0452897Y2 (mo) | ||
| JPH10107074A (ja) | バンプボンダー | |
| JPS586633Y2 (ja) | プロジエクシヨン溶接用溶接片 | |
| IE32507B1 (en) | Improvements in and relating to contact bonding and lead attachment to an electrical device |