JPS61171237U - - Google Patents
Info
- Publication number
- JPS61171237U JPS61171237U JP5403785U JP5403785U JPS61171237U JP S61171237 U JPS61171237 U JP S61171237U JP 5403785 U JP5403785 U JP 5403785U JP 5403785 U JP5403785 U JP 5403785U JP S61171237 U JPS61171237 U JP S61171237U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- utility
- model registration
- electronic component
- lead member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案の一実施例を示す側断面図、第
２図は要部拡大断面図、第３図〜第４図は本案の
他のそれぞれ異つた実施例を示す側断面図、第５
図は従来例の側断面図である。
図中、１は部品本体（コンデンサエレメント）
、２は外部電極、３は外部リード部材、３ａは凹
部、４は半田部材、５は樹脂材である。
Fig. 1 is a side sectional view showing one embodiment of the present invention, Fig. 2 is an enlarged sectional view of main parts, and Figs. 3 and 4 are side sectional views showing other different embodiments of the invention. 5
The figure is a side sectional view of a conventional example. In the diagram, 1 is the component body (capacitor element)
, 2 is an external electrode, 3 is an external lead member, 3a is a recess, 4 is a solder member, and 5 is a resin material.
Claims (1)
材を、同一方向に導出されるように半田付けする
と共に、部品本体の全周面を樹脂材にて被覆した
ものにおいて、上記外部リード部材の樹脂材から
露呈する境界部分に凹部を形成したことを特徴と
する電子部品。 (2) 凹部の深さを外部リード部材の線径の５０
％以下に設定したことを特徴とする実用新案登録
請求の範囲第１項に記載の電子部品。 (3) 外部リード部材の凹部をＶ形状に形成した
ことを特徴とする実用新案登録請求の範囲第１項
に記載の電子部品。[Claims for Utility Model Registration] (1) A plurality of external lead members are soldered to the external electrodes of the component body so that they lead out in the same direction, and the entire circumference of the component body is covered with a resin material. An electronic component characterized in that a recess is formed in a boundary portion exposed from the resin material of the external lead member. (2) The depth of the recess is 50% of the wire diameter of the external lead member.
% or less, the electronic component according to claim 1 of the utility model registration claim. (3) The electronic component according to claim 1 of the utility model registration claim, characterized in that the concave portion of the external lead member is formed in a V-shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5403785U JPS61171237U (en) | 1985-04-10 | 1985-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5403785U JPS61171237U (en) | 1985-04-10 | 1985-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61171237U true JPS61171237U (en) | 1986-10-24 |
Family
ID=30575442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5403785U Pending JPS61171237U (en) | 1985-04-10 | 1985-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171237U (en) |
-
1985
- 1985-04-10 JP JP5403785U patent/JPS61171237U/ja active Pending
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