JPS61174776U - - Google Patents
Info
- Publication number
- JPS61174776U JPS61174776U JP5817585U JP5817585U JPS61174776U JP S61174776 U JPS61174776 U JP S61174776U JP 5817585 U JP5817585 U JP 5817585U JP 5817585 U JP5817585 U JP 5817585U JP S61174776 U JPS61174776 U JP S61174776U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- bearing electronic
- lead wire
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5817585U JPS61174776U (2) | 1985-04-18 | 1985-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5817585U JPS61174776U (2) | 1985-04-18 | 1985-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61174776U true JPS61174776U (2) | 1986-10-30 |
Family
ID=30583430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5817585U Pending JPS61174776U (2) | 1985-04-18 | 1985-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61174776U (2) |
-
1985
- 1985-04-18 JP JP5817585U patent/JPS61174776U/ja active Pending
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