JPS61176185A - Printed circuit board with print resistance - Google Patents
Printed circuit board with print resistanceInfo
- Publication number
- JPS61176185A JPS61176185A JP60017362A JP1736285A JPS61176185A JP S61176185 A JPS61176185 A JP S61176185A JP 60017362 A JP60017362 A JP 60017362A JP 1736285 A JP1736285 A JP 1736285A JP S61176185 A JPS61176185 A JP S61176185A
- Authority
- JP
- Japan
- Prior art keywords
- printed
- circuit board
- printed circuit
- resist
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 5
- 235000014121 butter Nutrition 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は印刷抵抗を有するグリッド基板に関し、特に、
パターツメツキ後抵抗を印刷し九構造のグリッド基板に
関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a grid substrate with printed resistors, in particular:
After pattern plating, resistors are printed on a nine-structure grid substrate.
従来、パターンメッキ後抵抗を印刷したプリ７ト基板は
、第２図および第３図に示すように、パターン９上のメ
ッキ部ｌＯと基板６との段差のため印刷抵抗７に段切れ
、あるいはボイド穴１１が多く発生してい光。尚、第２
図では印刷抵抗７Ｆｉレジスト８上に形成し、第３図で
はレジスト８は配線パターン９上に形成している。Conventionally, a printed circuit board on which a resistor is printed after pattern plating has a difference in level between the plated part 10 on the pattern 9 and the substrate 6, as shown in FIGS. 2 and 3. Light with many void holes 11 generated. Furthermore, the second
In the figure, the printed resistor 7 is formed on a Fi resist 8, and in FIG. 3, the resist 8 is formed on a wiring pattern 9.
上述し九従来構造のプリント基板では、印刷抵抗に段切
れやボイド穴の発生が多く、製造歩留りが悪く又抵抗値
のバラツキも大きいという欠点があっ九。The above-mentioned conventional printed circuit boards have disadvantages in that the printed resistors often have gaps and voids, resulting in poor manufacturing yields and large variations in resistance values.
本発明の印刷抵抗は基材上に銅パターンを有し、との銅
パターン上に絶縁材を介して抵抗が印刷されている。The printed resistor of the present invention has a copper pattern on a base material, and the resistor is printed on the copper pattern via an insulating material.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.
１は印刷抵抗、２はレジスト、３は配線パターン、４は
配線バター７メツキ部分、５は印刷抵抗下に残した銅パ
ター７．６はグリッド基板の基材である。すなわち、印
刷抵抗りは基材６上にレジスト２を介して形成されてい
る。このため、印刷抵抗ｌｔ−形成すべき部分に段差が
ほとんどなく、印刷抵抗ｌに段切れやボイド穴の発生が
ない。尚、銅パターン５と配線バター７３との間隔は現
在のエッチノブ技術でＱ、 ｌ ｍｍ程度の間隔までつ
めることができ印刷レジスト２でも、間が埋まり、段差
となる心配はない。1 is a printed resistor, 2 is a resist, 3 is a wiring pattern, 4 is a plating portion of the wiring butter 7, and 5 is a copper pattern 7 left under the printed resistor.6 is the base material of the grid board. That is, the printed resistance is formed on the base material 6 via the resist 2. Therefore, there is almost no step difference in the portion where the printed resistor lt- is to be formed, and no step breaks or void holes occur in the printed resistor l. It should be noted that the distance between the copper pattern 5 and the wiring butter 73 can be reduced to about Q1 mm using the current etch knob technology, and there is no fear that the printed resist 2 will fill the gap and create a step.
尚、第２図のようにレジスト８を基材６上に残しても配
線バター７９との間隔はレジスト８のバター７誤差によ
り十分には埋まらない。ま几配線バターノ９上までレジ
スト８ｔ−広げても段差は残り、印刷抵抗７０段切れや
ボイド穴１１等の原因となる。Incidentally, even if the resist 8 is left on the base material 6 as shown in FIG. 2, the gap between the resist 8 and the wiring butter 79 will not be sufficiently filled due to the error of the resist 8 and the butter 7. Even if the resist 8t is expanded to the top of the wiring pattern 9, a level difference remains, which causes the printed resistor 70 to break, void holes 11, etc.
以上説明し九ように、本発明は印刷抵抗下に鋼パターン
を残すことにより印刷抵抗形成部の段差がなくなり段切
れ、ボイドをなくすことができる。As explained above, in the present invention, by leaving a steel pattern under the printed resistor, the level difference in the printed resistor forming part is eliminated, and step breakage and voids can be eliminated.
第１図は本発明の一実施例の縦断面図で、第２図および
第３図はそれぞれ従来の印刷抵抗付グリッド基板の断面
図である。
ｌ・・・・・・印刷抵抗、２・・・・・・レジスト、３
・・・・・・配線パターン、４・・・・・・配線パター
ンメッキ、５・・・・・・印刷抵抗下に残した銅パター
ン、６・・・・・・プリント基板の基材、７・・・・・
・印刷抵抗、８・・・・・・レジスト、９・・・・・・
配線パターン、１０・・・・・・配線パターンメッキ部
分、１１・・・・・・ボイド穴。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention, and FIGS. 2 and 3 are sectional views of a conventional grid substrate with printed resistors, respectively. l...Printed resistance, 2...Resist, 3
...Wiring pattern, 4...Wiring pattern plating, 5...Copper pattern left under printed resistor, 6...Base material of printed circuit board, 7・・・・・・
・Print resistance, 8...Resist, 9...
Wiring pattern, 10... Wiring pattern plating part, 11... Void hole.
Claims (1)
ン上に絶縁物を介して抵抗を印刷したことを特徴とする
印刷抵抗付プリント基板。1. A printed circuit board with a printed resistor, comprising a copper pattern on a base material of the printed circuit board, and a resistor printed on the copper pattern via an insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60017362A JPS61176185A (en) | 1985-01-31 | 1985-01-31 | Printed circuit board with print resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60017362A JPS61176185A (en) | 1985-01-31 | 1985-01-31 | Printed circuit board with print resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61176185A true JPS61176185A (en) | 1986-08-07 |
Family
ID=11941920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60017362A Pending JPS61176185A (en) | 1985-01-31 | 1985-01-31 | Printed circuit board with print resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61176185A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582935A (en) * | 1987-06-17 | 1993-04-02 | Cmk Corp | Printed wiring board |
-
1985
- 1985-01-31 JP JP60017362A patent/JPS61176185A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582935A (en) * | 1987-06-17 | 1993-04-02 | Cmk Corp | Printed wiring board |
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