JPS6119032B2 - - Google Patents
Info
- Publication number
- JPS6119032B2 JPS6119032B2 JP16355078A JP16355078A JPS6119032B2 JP S6119032 B2 JPS6119032 B2 JP S6119032B2 JP 16355078 A JP16355078 A JP 16355078A JP 16355078 A JP16355078 A JP 16355078A JP S6119032 B2 JPS6119032 B2 JP S6119032B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- photoreceptor
- transfer
- image
- electrophotographic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 108091008695 photoreceptors Proteins 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 4
- 239000007789 gas Substances 0.000 description 14
- 238000000151 deposition Methods 0.000 description 13
- -1 silicon hydrogen compounds Chemical class 0.000 description 13
- 230000008021 deposition Effects 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 239000012535 impurity Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000000737 periodic effect Effects 0.000 description 4
- 150000003377 silicon compounds Chemical class 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 150000002483 hydrogen compounds Chemical class 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 description 2
- 229910052990 silicon hydride Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- MWWATHDPGQKSAR-UHFFFAOYSA-N propyne Chemical group CC#C MWWATHDPGQKSAR-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- IAQRGUVFOMOMEM-ONEGZZNKSA-N trans-but-2-ene Chemical compound C\C=C\C IAQRGUVFOMOMEM-ONEGZZNKSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Fixing For Electrophotography (AREA)
- Photoreceptors In Electrophotography (AREA)
- Combination Of More Than One Step In Electrophotography (AREA)
- Electrophotography Using Other Than Carlson'S Method (AREA)
Description
【発明の詳細な説明】 本発明は電子写真法に関する。[Detailed description of the invention] The present invention relates to electrophotography.
電子写真法には多くの種類がある。例えば代表
的なものとして、支持体と光導電層から構成され
る感光体を用いる電子写真法としては、帯電、画
像露光、現像および転写の各工程からなる方法が
あり、支持体、光導電層および絶縁層から構成さ
れる電子写真感光体を用いる電子写真法として
は、例えば、米国特許第2860048号公報、特公昭
41−16429号公報、特公昭38−15446号公報、特公
昭46−3713号公報、特公昭42−23910号公報、特
公昭43−24748号公報、特公昭42−19747号公報、
特公昭36−4121号公報、などに記載されている。 There are many types of electrophotography. For example, as a typical electrophotographic method using a photoreceptor consisting of a support and a photoconductive layer, there is a method consisting of charging, image exposure, development, and transfer steps. As an electrophotographic method using an electrophotographic photoreceptor composed of an insulating layer and an insulating layer, for example, US Pat.
41-16429, 1974-15446, 1971-3713, 1972-23910, 43-24748, 19747,
It is described in Japanese Patent Publication No. 36-4121, etc.
ところで電子写真複写機が汎用されている今日
複写装置の簡易化を可能にする電子写真法の提供
は極めて有益である。 Nowadays, when electrophotographic copying machines are widely used, it would be extremely useful to provide an electrophotographic method that allows for the simplification of copying devices.
その中で、例えば特開昭48−90241号公報、特
開昭48−90240号公報等に記載されている様に電
子写真用感光体の表面上に形成されたトナー画像
を、該感光体上で紙等の転写材に転写同時熱定着
をする方法がある。この感光体表面上に形成され
たトナー画像を転写材に転写同時熱定着を行う方
法に於いては、感光体自体が熱的に安定であるこ
と、感光体表面が高温時に於いて離型性に優れて
いること、電荷吸着しているトナー画像が、転写
同時熱定着する際に熱による電荷の乱れが生じ、
転写画像を乱れを起さないこと等が感光体に要求
される。 Among them, for example, as described in JP-A-48-90241, JP-A-48-90240, etc., a toner image formed on the surface of an electrophotographic photoreceptor is transferred onto the photoreceptor. There is a method of simultaneously transferring and thermally fixing the image onto a transfer material such as paper. In this method of simultaneously transferring and thermally fixing the toner image formed on the surface of the photoreceptor to a transfer material, it is necessary to ensure that the photoreceptor itself is thermally stable and that the surface of the photoreceptor has good releasability at high temperatures. When a toner image that attracts charge is thermally fixed at the same time as transfer, charge disturbance occurs due to heat.
The photoreceptor is required not to cause any disturbance in the transferred image.
ところが、上記の公報に記載されている感光体
も含めて、従来の感光体は上記の要求を全て満た
すものではなく、この点が技術思想として感光体
表面上での転写同時熱定着法が提案されているに
もかかわらず、これまで実用化されなかつたこと
である。 However, conventional photoconductors, including the photoconductor described in the above publication, do not meet all of the above requirements, and this point has led to the proposal of a simultaneous transfer and heat fixing method on the surface of the photoconductor as a technical concept. Despite this, it has not been put into practical use until now.
本発明は、上記の諸点に鑑み成されたものであ
り、思想的に提案されていた感光体表面上での転
写同時熱定着を実用化レベルで実現し得る感光体
として、特定の感光体を開発した点にある。 The present invention has been made in view of the above-mentioned points, and uses a specific photoreceptor as a photoreceptor that can realize the conceptually proposed simultaneous transfer and heat fixing on the surface of a photoreceptor at a practical level. The point is that it was developed.
本発明は水素を10〜40原子%含有するアモルフ
アスシリコンからなる光導電層を有する電子写真
感光体表面に形成されたトナー画像を転写材に転
写同時加熱定着することを特徴とする電子写真法
である。 The present invention is an electrophotographic method characterized in that a toner image formed on the surface of an electrophotographic photoreceptor having a photoconductive layer made of amorphous silicon containing 10 to 40 at % of hydrogen is transferred to a transfer material and simultaneously heated and fixed. It is.
感光体表面に形成されたトナー画像を転写材に
転写同時加熱定着をすることは、転写後加熱定着
と較べて処理工程が物理的に短縮され、装置が簡
素化される利益がある。加えて、上記の特定の感
光体の使用により従来に較べ、高温にすることが
出来ると同時に高温時の離型性が良いので転写材
へのトナーの転写率が高画質を維持したまま顕著
に改善される。 Transferring and heat-fixing the toner image formed on the surface of the photoreceptor to a transfer material at the same time has the advantage of physically shortening the processing steps and simplifying the apparatus, compared to post-transfer heat-fixing. In addition, by using the above-mentioned specific photoconductor, it is possible to raise the temperature to a higher temperature than before, and at the same time, the release property at high temperatures is good, so the transfer rate of toner to the transfer material is significantly improved while maintaining high image quality. Improved.
本発明においては、上記した様に光導電層とし
て水素を10〜40原子%含有するアモルフアスシリ
コン層(以後「A−Si:H層と記す)を採用する
ことによつて、転写同時加熱が円滑に実現できた
ものである。 In the present invention, as described above, by employing an amorphous silicon layer (hereinafter referred to as "A-Si:H layer") containing 10 to 40 atomic percent hydrogen as the photoconductive layer, simultaneous transfer heating is possible. This was accomplished smoothly.
本発明に用いる感光体の基本的な構成は支持体
とその上に形成されたものである。 The basic structure of the photoreceptor used in the present invention is a support and a support formed thereon.
支持体としては、例えばスチレン、Al、Cr、
Mo、Au、Ir、Nb、Ta、V、Ti、Pt、Pd等の金
属又はこれ等の合金等の導電性支持体、或いは、
合成樹脂のフイルム又はシート、又はガラス、セ
ラミツク等の電気絶縁性支持体であり、支持体上
にA−Si層が堆積される前に、必要に応じて一連
の清浄処理が施される。この様な清浄処理に於い
て、一般的には、例えば金属性支持体であれば、
エツチングによつて表面を効果的に清浄化するア
ルカリ性又は酸性の溶液と接触される。その後、
支持体は清浄雰囲気中で乾燥され、次いでA−Si
が支持体上に堆積される。 Examples of the support include styrene, Al, Cr,
A conductive support such as a metal such as Mo, Au, Ir, Nb, Ta, V, Ti, Pt, Pd or an alloy thereof, or
An electrically insulating support such as a film or sheet of synthetic resin, glass, ceramic, etc., which is optionally subjected to a series of cleaning treatments before the A-Si layer is deposited on the support. In such a cleaning treatment, generally, for example, if the support is made of metal,
Contact with an alkaline or acidic solution effectively cleans the surface by etching. after that,
The support is dried in a clean atmosphere and then A-Si
is deposited on the support.
なお、電気絶縁性支持体の場合には、必要に応
じて、その表面を導電処理される。 In addition, in the case of an electrically insulating support, its surface is subjected to conductive treatment, if necessary.
例えば、ガラスであれば、In2O3、SnO2等でそ
の表面が導電処理され、或いはポリイミドフイル
ム等の合成樹脂フイルムであれば、Al、Ag、
Pb、Zn、Ni、Au、Cr、Mo、Ir、Nb、Ta、V、
Ti、Pt等の金属を以つて真空蒸着、電子ビーム
蒸着、スパツタリング等で処理し、又は前記金属
でラミネート処理して、その表面が導電処理され
る。支持体の形状としては、円筒状、ベルト状、
板状等、任意の形状とし得、所望によつてその形
状は決定されるが、連続高速複写の場合には、無
端ベルト状又は円筒状とするのが望ましい。 For example, in the case of glass, its surface is conductively treated with In 2 O 3 or SnO 2 , or in the case of a synthetic resin film such as polyimide film, it is treated with Al, Ag,
Pb, Zn, Ni, Au, Cr, Mo, Ir, Nb, Ta, V,
The surface is treated with a metal such as Ti or Pt by vacuum evaporation, electron beam evaporation, sputtering, etc., or laminated with the metal, so that the surface thereof is conductive. The shape of the support body is cylindrical, belt-shaped,
It may have any shape, such as a plate shape, and the shape is determined as desired, but in the case of continuous high-speed copying, it is preferably an endless belt shape or a cylindrical shape.
支持体の厚さは適宜決められるが、可撓性が要
求される場合には、支持体としての機能が充分発
揮される範囲内であれば、可能な限り薄くされ
る。 The thickness of the support is determined as appropriate, but if flexibility is required, it is made as thin as possible within a range that allows the support to function satisfactorily.
而乍ら、この様な場合、支持体の製造上及び取
扱い上、機械的強度等の点から、通常は、10μ以
上とされる。 However, in such a case, the thickness is usually set to 10μ or more in view of manufacturing and handling of the support, mechanical strength, etc.
A−Si:H層は通常、グロー放電法、スパツタ
リング法、イオンプレーテイング法、真空蒸着法
等の堆積法によつて支持体上に形成される。グロ
ー放電法、スパツタリング法およびイオンプレー
テイング法は放電現象を利用する堆積法であり、
堆積室内においてガスプラズマ雰囲気を所定時間
維持して必要な厚さのA−Si:H層を形成する方
法であり、特に有効である。 The A-Si:H layer is usually formed on a support by a deposition method such as a glow discharge method, a sputtering method, an ion plating method, or a vacuum evaporation method. Glow discharge method, sputtering method and ion plating method are deposition methods that utilize discharge phenomenon.
This is a particularly effective method of forming an A-Si:H layer of a required thickness by maintaining a gas plasma atmosphere in a deposition chamber for a predetermined period of time.
A−Si:H層の形成用物質としては、シリコン
単体の外、堆積中に分解してシリコンを生ずるケ
イ素化合物が用いられる。このようなシリコン化
合物として代表的なのはSiH4、Si2H6などのシリ
コン水素化合物である。A−Si:H層の形成につ
いては、a−Si:H層の暗抵抗及び光電利得の制
御のために、必要に応じて酸素、窒素および炭素
の中の少なくとも一種を加えることも有効であ
る。 As the material for forming the A-Si:H layer, in addition to silicon alone, a silicon compound that decomposes during deposition to produce silicon is used. Typical examples of such silicon compounds are silicon hydrogen compounds such as SiH 4 and Si 2 H 6 . Regarding the formation of the A-Si:H layer, it is also effective to add at least one of oxygen, nitrogen, and carbon as necessary to control the dark resistance and photoelectric gain of the a-Si:H layer. .
A−Si:H層への水素(H)の含有の代表的な
方法は、層を形成する際、堆積装置系内に
SiH4、Si2H6等の化合物および/又はH2の形で導
入し、気体放電によつて、それらの化合物又は
H2を分解して、A−Si:H層中に、層の成長に
併せて含有させてやることが出来る。A−Si:H
層形成材料としてSiH4、Si2H6などのシリコン水
素化合物を用いる場合には、この化合物中のシリ
コンがA−Si:H層の形成主成分として利用でき
るので、通常、シリコン単体又は他のシリコン化
合物を併用しなくてよいが、必要に応じてこれら
のシリコン単体又は他のシリコン化合物を併用し
てもよい。 A typical method for incorporating hydrogen (H) into the A-Si:H layer is to
It is introduced in the form of compounds such as SiH 4 , Si 2 H 6 and/or H 2 , and those compounds or
H 2 can be decomposed and incorporated into the A-Si:H layer as the layer grows. A-Si:H
When using a silicon hydride compound such as SiH 4 or Si 2 H 6 as a layer forming material, silicon in this compound can be used as the main component for forming the A-Si:H layer, so silicon alone or other Although it is not necessary to use a silicon compound in combination, these silicons alone or other silicon compounds may be used in combination as necessary.
A−Si:H層中に含有されるHの量は通常の場
合前記した様に10〜40原子%であるが、好適には
15〜30原子%とされるのが望ましい。A−Si:H
層中へのHの含有は、例えば、グロー放電法で
は、A−Si:Hを形成する出発物質がSiH4、
Si2H6等の水素化合物を使用するので条件の選択
によつてSiH4、Si2H6等の水素化合物が分解して
A−Si:H層が形成される際Hは自動的に層中に
含有されるが、更にHの層中への含有を一層効率
良く行なうには、A−Si:H層を形成する際に、
グロー放電を行なう装置系内にH2ガスを導入し
てやれば良い。 The amount of H contained in the A-Si:H layer is usually 10 to 40 atomic% as described above, but preferably
The content is preferably 15 to 30 at%. A-Si:H
The inclusion of H in the layer is, for example, in the glow discharge method, when the starting material for forming A-Si:H is SiH 4 ,
Since hydrogen compounds such as Si 2 H 6 are used, depending on the selection of conditions, when hydrogen compounds such as SiH 4 and Si 2 H 6 are decomposed to form an A-Si:H layer, H is automatically removed from the layer. However, in order to more efficiently incorporate H into the layer, when forming the A-Si:H layer,
It is sufficient to introduce H 2 gas into the apparatus system that performs glow discharge.
スパツタリング法による場合にはAr等の不活
性ガス又はこのガスをベースとした混合ガス雰囲
気中で、シリコンをターゲツトとしてスパツタリ
ングを行なう際に、H2ガスを導入してやるか又
はSiH4、Si2H6等のシリコン水素化合物ガス、或
いは、不純物のドーピングも兼ねてB2H6、PH3等
のガスを導入してやれば良い。 When using the sputtering method, H 2 gas is introduced when performing sputtering with silicon as a target in an inert gas such as Ar or a mixed gas atmosphere based on this gas, or SiH 4 , Si 2 H 6 A silicon hydride gas such as B 2 H 6 or PH 3 may be introduced to also serve as impurity doping.
A−Si:H層に酸素、窒素および炭素を含有さ
せる場合についても、水素を含有させる場合と同
様な手法で行うことができる。 When oxygen, nitrogen, and carbon are contained in the A-Si:H layer, the same method as when hydrogen is contained can be used.
A−Si:H層に酸素、窒素および炭素を含有さ
せるに用いられるものとしては、これらの単体お
よびこれらの元素の化合物である。 Oxygen, nitrogen, and carbon may be contained in the A-Si:H layer using these elements alone or in compounds of these elements.
このような酸素化合物としては、SiO2、
Si3N4、CO、CO2など、窒素化合物としては
NO、NO2、NH5など、炭素化合物としては、炭
素数1〜4の飽和炭化水素、炭素数2〜4のエチ
レン系炭化水素、炭素数2〜3のアセチレン系炭
化水素等が挙げられる。例えば飽和炭化水素とし
てはメタン(CH4)、エタン(C2H6)、プロパン
(C3H8)、n−ブタン(n−C4H10)、エチレン系
炭化水素としては、エチレン(C2H4)、プロピレ
ン(C3H6)、ブテン−1(C4H5)、ブテン−2
(C4H6)、イソブチレン(C4H8)、アセチレン系炭
化水素としては、アセチレン(C2H2)、メチルア
セチレン(C3H4)が挙げられる。 Such oxygen compounds include SiO 2 ,
Nitrogen compounds such as Si 3 N 4 , CO, CO 2 , etc.
Examples of carbon compounds such as NO, NO2 , and NH5 include saturated hydrocarbons having 1 to 4 carbon atoms, ethylene hydrocarbons having 2 to 4 carbon atoms, acetylene hydrocarbons having 2 to 3 carbon atoms, and the like. For example, saturated hydrocarbons include methane (CH 4 ), ethane (C 2 H 6 ), propane (C 3 H 8 ), and n-butane (n-C 4 H 10 ), and ethylene hydrocarbons include ethylene (C 2 H 4 ), propylene (C 3 H 6 ), butene-1 (C 4 H 5 ), butene-2
(C 4 H 6 ), isobutylene (C 4 H 8 ), and acetylene hydrocarbons include acetylene (C 2 H 2 ) and methylacetylene (C 3 H 4 ).
A−Si:H層の形成には例えば酸素、窒素、酸
化物、窒化物、炭化物等の化合物のガスをA−
Si:Hを形成する原料ガスと共に内部を減圧にし
得る堆積室内に導入して該堆積室内でグロー放電
を生起させて光導電層を形成すれば良い。又、例
えば光導電層をスパツタリング法で形成する場合
には、例えば(Si+C)、(Si+SiO2)、(Si+
Si3N4)なる成分で混合成形したスパツター用のタ
ーゲツトを使用するか、SiウエハーとC、SiO2又
はSi3N4ウエハーの二枚のターゲツトを使用し
て、スパツタリングを行うか、又は酸素ガスや窒
素ガス又は炭素、酸素又は窒素を含んだ化合物の
ガスを、例えばArガス等のスパツター用のガス
と共に堆積室内に導入してSiのターゲツトを使用
してスパツタリングを行つてA−Si:H層を形成
すれば良い。 To form the A-Si:H layer, for example, a gas of a compound such as oxygen, nitrogen, oxide, nitride, or carbide is added to the A-Si:H layer.
A photoconductive layer may be formed by introducing the material together with a raw material gas for forming Si:H into a deposition chamber whose interior can be reduced in pressure and causing glow discharge within the deposition chamber. Furthermore, when forming a photoconductive layer by sputtering, for example, (Si+C), (Si+SiO 2 ), (Si+
Sputtering can be carried out by using a sputtering target made of a mixture of Si 3 N 4 ), or by using two targets of a Si wafer and a C, SiO 2 or Si 3 N 4 wafer, or by using oxygen A-Si:H is formed by introducing gas, nitrogen gas, or a compound gas containing carbon, oxygen, or nitrogen into the deposition chamber together with a sputtering gas such as Ar gas, and performing sputtering using a Si target. All you have to do is form a layer.
酸素、窒素又は炭素のA−Si:H層への合有量
は、適宜設定されるものであるが、通常の場合、
0.1〜30原子%、好適には、0.1〜20原子%、最適
には、0.2〜15原子%とされるのが望ましい。 The amount of oxygen, nitrogen or carbon incorporated into the A-Si:H layer is set appropriately, but in normal cases,
Desirably, the content is 0.1 to 30 atom %, preferably 0.1 to 20 atom %, most preferably 0.2 to 15 atom %.
A−Si:H層を放電現象を利用する堆積法によ
つて形成する場合には、所望のプラズマ雰囲気を
形成するには有効な放電現象を堆積室内に生起さ
せるに、放電電流密度を、通常は0.1〜10mA/cm2
好適には1〜5mA/cm2としたAC又はDC電流と
するのが良く、又充分なパワーを得る為には、通
常100〜500V、好適には300〜500Vの電圧に調整
され、投入される電力としては、通常0.1〜
50W、好適には0.5〜10Wとされるのが良い。
又、更には、ACの場合、その周波数は、通常0.2
〜30MHz、好適には5〜20MHzとされるのが望
ましい。 When the A-Si:H layer is formed by a deposition method that utilizes a discharge phenomenon, the discharge current density is usually adjusted to generate a discharge phenomenon in the deposition chamber that is effective for forming the desired plasma atmosphere. is 0.1~10mA/ cm2
The AC or DC current is preferably 1 to 5 mA/ cm2 , and in order to obtain sufficient power, the voltage is usually adjusted to 100 to 500 V, preferably 300 to 500 V. The power used is usually 0.1~
The power is preferably 50W, preferably 0.5 to 10W.
Furthermore, in the case of AC, its frequency is usually 0.2
It is desirable that the frequency is ~30MHz, preferably 5~20MHz.
A−Si:H層は、製造時の不純物のドーピング
によつて真性にし得、又その電導型を制御するこ
とができる。 The A-Si:H layer can be made intrinsic by doping with impurities during manufacture and its conductivity type can be controlled.
A−Si:H層中にドーピングされる不純物とし
ては、A−Si:H層をP型にするには、周期律表
第族Aの元素、例えばB、Al、Ga、In、Tl等
が好適なものとして挙げられ、n型にする場合に
は、周期律表第族Aの元素、例えば、N、P、
As、Sb、Bi等が好適なものとして挙げられる。 In order to make the A-Si:H layer P-type, impurities doped into the A-Si:H layer include elements from group A of the periodic table, such as B, Al, Ga, In, and Tl. Preferred examples include elements of group A of the periodic table when n-type, such as N, P,
Preferred examples include As, Sb, Bi, and the like.
A−Si:H層中にドーピングされる不純物の量
は、所望される電気的、光学的特性に応じて適宜
決定されるが、周期律表第族Aの不純物の場合
には通常10-6〜10-3原子%、好適には10-5〜10-4
原子%、周期律表第族Aの不純物の場合には、
通常10-3〜10-8原子%、好適には10-5〜10-7原子
%とされるのが望ましい。 The amount of impurities doped into the A-Si:H layer is determined appropriately depending on the desired electrical and optical properties, but in the case of impurities in group A of the periodic table, it is usually 10 -6 ~10 -3 atomic %, preferably 10 -5 to 10 -4
Atomic %, in the case of impurities in group A of the periodic table,
It is usually 10 -3 to 10 -8 atomic %, preferably 10 -5 to 10 -7 atomic %.
これ等不純物のA−Si:H層へのドーピング方
法は、A−Si:H層を形成する際に採用される製
造方法によつて各々異なるものであつて、具体的
には、以降の説明又は実施例に於いて詳述され
る。 The method of doping these impurities into the A-Si:H layer differs depending on the manufacturing method adopted when forming the A-Si:H layer, and the details are explained below. Or it will be explained in detail in the examples.
A−Si:H系光導電層の層厚としては、所望さ
れる電子写真特性及び使用条件、例えば、可撓性
が要求されるか否か等に応じて適宜決定されるも
のであるが、通常の場合5〜80μ、好適には10〜
70μ、最適には10〜50μとされるのが望ましい。 The layer thickness of the A-Si:H-based photoconductive layer is determined as appropriate depending on the desired electrophotographic properties and usage conditions, for example, whether flexibility is required or not. Usually 5~80μ, preferably 10~
It is desirable that the thickness be 70μ, optimally 10 to 50μ.
本発明の代表的な実施形態は第1図に示され
る。感光体には適宜所望の電子写真プロセスによ
つて静電像が形成され、この静電像はトナー(現
像剤)で現像されてトナー画像に変換されてい
る。支持体1およびA−Si層2からなる感光体表
面にはトナー画像7が形成されている。感光体表
面を押圧する状態で定着手段の代表的な1つであ
る加熱定着ローラ5が位置し、感光体と加熱定着
ローラとの間に転写材4が通過する。感光体が矢
印3の方向に、加熱定着ローラが矢印6の方向に
回転することにより、転写材4は矢印9の方向に
移動する。感光体表面に形成されていたトナー画
像7は転写材表面にトナー画像8のように転写さ
れる。これによつて、トナー画像の転写同時加熱
定着は達成される。転写材としては、紙、布、樹
脂フイルム、金属箔等、適宜使用される。加熱定
着ローラは表面が弾性体になつているものが好適
である。加熱定着ローラを加熱する方法は、加熱
定着ローラの中空部にヒータを設けることによつ
てもよいし、加熱定着ローラを加熱し得る適当な
位置にヒータを設置してもよい。また、加熱定着
ローラに代えて第2図に示すように加熱定着ベル
ト10であつてもよい。加熱定着ベルト10は矢
印11の方向に回る。トナー画像の加熱は、定着
ローラ、定着ベルトのような定着用押圧手段によ
て行うことが通常であるが、特別な場合には定着
用押圧手段部に転写材が到達する前に転写材自体
を必要な温度に加熱しておくこともできるし、ま
た、他の場合には、第3図に示すようにヒータ1
2やフラツシユヒーターを用いて必要な時に通電
して加熱することも有効である。また、必要に応
じて、転写後、補助的な加熱手段を併用してもよ
い。加熱温度はトナーの種類等により適宜設定さ
れるものであるが、通常、100〜250℃特には150
〜200℃が好適である。感光体表面に押圧される
定着ローラのような定着手段は、定着時以外は押
圧状態から解除された状態に設定されていること
も有効である。また、なお、加熱は、赤外光、可
視光、紫外光などの輻射線を照射することによつ
てもよい。トナー画像の転写をより完全に行うた
めに必要に応じて、感光体表面にはシリコンオイ
ル、フツ素樹脂、フツ素ワツクス、タルク、フツ
化カーボン、シリコンワツクス、炭化水素ワツク
ス、炭化水素オイルなどの離型性材料を継続的に
若しくは断続的に塗布することも有効である。 A representative embodiment of the invention is shown in FIG. An electrostatic image is formed on the photoreceptor by an appropriate electrophotographic process, and this electrostatic image is developed with toner (developer) and converted into a toner image. A toner image 7 is formed on the surface of the photoreceptor consisting of the support 1 and the A-Si layer 2. A heat fixing roller 5, which is a typical type of fixing means, is positioned to press the surface of the photoreceptor, and the transfer material 4 passes between the photoreceptor and the heat fixing roller. As the photoreceptor rotates in the direction of arrow 3 and the heat fixing roller rotates in the direction of arrow 6, the transfer material 4 moves in the direction of arrow 9. The toner image 7 formed on the surface of the photoreceptor is transferred to the surface of the transfer material as a toner image 8. Thereby, simultaneous transfer and heat fixing of the toner image is achieved. As the transfer material, paper, cloth, resin film, metal foil, etc. are used as appropriate. The heat fixing roller preferably has an elastic surface. The heat fixing roller may be heated by providing a heater in the hollow part of the heat fixing roller, or by installing a heater at an appropriate position where the heat fixing roller can be heated. Further, instead of the heat fixing roller, a heat fixing belt 10 as shown in FIG. 2 may be used. Heat fixing belt 10 rotates in the direction of arrow 11. Heating of the toner image is normally performed by a fixing pressure means such as a fixing roller or a fixing belt, but in special cases, the transfer material itself is heated before the transfer material reaches the fixing pressure means. In other cases, the heater 1 can be heated to the required temperature, as shown in FIG.
It is also effective to apply electricity and heat using a flash heater or a flash heater when necessary. Further, if necessary, auxiliary heating means may be used in combination after the transfer. The heating temperature is set appropriately depending on the type of toner, etc., but it is usually 100 to 250℃, especially 150℃.
~200°C is preferred. It is also effective to set a fixing means such as a fixing roller that is pressed against the surface of the photoreceptor in a state in which the pressure is released except during fixing. Furthermore, the heating may be performed by irradiating radiation such as infrared light, visible light, and ultraviolet light. In order to transfer the toner image more completely, silicone oil, fluorine resin, fluorine wax, talc, carbon fluoride, silicone wax, hydrocarbon wax, hydrocarbon oil, etc. may be applied to the surface of the photoreceptor as necessary. It is also effective to apply a releasable material continuously or intermittently.
本発明に用いる感光体としては、第1図に示さ
れる構成のものの他、必要に応じてA−Si層上に
さらに絶縁層を形成したものであつてもよい。 The photoreceptor used in the present invention may have the structure shown in FIG. 1, or may have an insulating layer further formed on the A-Si layer, if necessary.
感光体の保護及び耐久性、暗減衰特性の改善等
を主目的として絶縁層を付設する場合には絶縁層
は比較的薄く設定され、感光体を特定の電子写真
プロセスに用いる場合に設けられる絶縁層は比較
的厚く設定される。 When an insulating layer is attached with the main purpose of protecting the photoreceptor, improving its durability, dark decay characteristics, etc., the insulating layer is set relatively thin. The layer is set relatively thick.
通常、絶縁層の厚さは、0.1〜100μm、特に
は、0.1〜50μに設定される。 Usually, the thickness of the insulating layer is set to 0.1 to 100 μm, particularly 0.1 to 50 μm.
絶縁層の形成に用いられる樹脂としては、通常
の樹脂が適宜用いられるものである。例えばポリ
エチレン、ポリエステル、ポリプロピレン、ポリ
イミド、フエノール樹脂、尿素樹脂、ポリウレタ
ン、ポリスチレン、ポリ塩化ビニール、ポリ酢酸
ビニール、ポリフエニレンオキサイド、ポリフエ
ニレンサルフアイド、アクリル樹脂、ポリカーボ
ネート、シリコン樹脂、弗素樹脂、エポキシ樹脂
等などである。特に、シリコン樹脂、ポリイミド
樹脂、ポリアクリレート樹脂およびポリカーボネ
ート樹脂あるいはこれらの樹脂を混合併用した樹
脂などの耐熱性に優れたものが推奨される。 As the resin used for forming the insulating layer, a normal resin can be used as appropriate. For example, polyethylene, polyester, polypropylene, polyimide, phenolic resin, urea resin, polyurethane, polystyrene, polyvinyl chloride, polyvinyl acetate, polyphenylene oxide, polyphenylene sulfide, acrylic resin, polycarbonate, silicone resin, fluororesin, epoxy resin, etc. In particular, resins with excellent heat resistance such as silicone resin, polyimide resin, polyacrylate resin, polycarbonate resin, or a mixture of these resins are recommended.
実施例 1
第4図に示す装置を用いて以下の様にして光導
電層を形成し、これに所定の画像形成処理を施し
て画像出しを行つた。即ち、1%のNaOHなる溶
液を用いて表面処理を行い、充分水洗し乾燥させ
て表面を清浄化して直径100mm長さ350mmのアルミ
ニウムドラム1を用意して、グロー放電堆積室1
3内の所定位置にある固定部材14の所定位置に
ヒーター15とは約10cm程度離して堅固に固定し
た。Example 1 A photoconductive layer was formed in the following manner using the apparatus shown in FIG. 4, and a predetermined image forming process was performed on the photoconductive layer to form an image. That is, the surface is treated using a 1% NaOH solution, thoroughly washed with water and dried to clean the surface, an aluminum drum 1 with a diameter of 100 mm and a length of 350 mm is prepared, and a glow discharge deposition chamber 1 is prepared.
The heater 15 was firmly fixed to a predetermined position of a fixing member 14 in a predetermined position within the heater 15 at a distance of about 10 cm.
次いで、メインバルブ16を全開して堆積室1
3内の空気を排気し、約5×10- 5torrの真空度に
した。その後ヒーター15を点火してアルミニウ
ムドラムを均一に加熱して150℃に上昇させ、こ
の温度に保つた。その後、バルブ17を全開し、
引続いてボンベ18のバルブ19、ボンベ20の
バルブ21を全閉した後、流量調節バルブ22及
び23を徐々に開いて、ボンベ18よりArガス
を、ボンベ20よりSiH4ガスを堆積室15内に
導入した。 Next, the main valve 16 is fully opened to open the deposition chamber 1.
The air inside the chamber was evacuated to create a vacuum of approximately 5× 10 −5 torr . Thereafter, the heater 15 was ignited to uniformly heat the aluminum drum to 150° C., and the temperature was maintained at this temperature. After that, fully open valve 17,
Subsequently, after fully closing the valve 19 of the cylinder 18 and the valve 21 of the cylinder 20, the flow rate adjustment valves 22 and 23 are gradually opened to supply Ar gas from the cylinder 18 and SiH 4 gas from the cylinder 20 into the deposition chamber 15. It was introduced in
この時、メインバルブ16を調節して堆積室1
3内の真空度が0.75torrに保持される様にした。 At this time, adjust the main valve 16 to
The degree of vacuum inside 3 was maintained at 0.75 torr.
続いて、高周波電源24のスイツチをonにし
て、電極25,25′間に13.56MHzの高周波を
印加してグロー放電を起しアルミニウム基板上に
A−Si:H層を形成した。この時のグロー放電電
力は、約5Wであつた。又、この時のA−Si:H
層の成長速度は、約4Å/secであつて、15時間蒸
着を行い、アルミニウムドラム上に20μ厚のA−
Si:H系導電層を形成した。 Subsequently, the switch of the high frequency power supply 24 was turned on and a high frequency of 13.56 MHz was applied between the electrodes 25 and 25' to cause glow discharge and form an A-Si:H layer on the aluminum substrate. The glow discharge power at this time was about 5W. Also, A-Si:H at this time
The growth rate of the layer was about 4 Å/sec, and the deposition was carried out for 15 hours, and a 20 μ thick A-layer was deposited on an aluminum drum.
A Si:H based conductive layer was formed.
次に流量調節バルブ22,23を閉じて、高周
波電源24のスイツチをOFFしグロー放電を中
止した。 Next, the flow control valves 22 and 23 were closed, and the high frequency power source 24 was turned off to stop the glow discharge.
このようにしてA−Si:H系光導電層形成され
たアルミニウムドラムを装置より取り出し、第1
図の構成を持つた複写装置に取り付け、下記のプ
ロセスによつて静電潜像を形成し、乾式ポジトナ
ーによつて磁気ブラシ現像を行い、複写同時定着
を行つた。 The aluminum drum on which the A-Si:H-based photoconductive layer was formed in this way was taken out of the apparatus, and the first
It was attached to a copying machine having the configuration shown in the figure, an electrostatic latent image was formed by the following process, magnetic brush development was performed using dry positive toner, and simultaneous copying and fixing was performed.
6kVコロナ帯電をA−Si:H光導電層表面に
与え0.2sec後の光画像を照射し暗部電位500V
明部電位5Vのコントラストを持つた静電潜像
を得、0.2sec後に乾式ポジトナー磁気ブラシ現像
を行い、第1図の構成をもつた転写定着機構によ
つて転写紙に転写、定着を行つた。 A 6kV corona charge is applied to the surface of the A-Si:H photoconductive layer, and a light image is irradiated after 0.2 seconds to increase the dark area potential to 500V.
An electrostatic latent image with a contrast of a bright area potential of 5 V was obtained, and after 0.2 seconds, dry positive toner magnetic brush development was performed, and the image was transferred and fixed onto transfer paper by a transfer fixing mechanism having the configuration shown in Fig. 1. .
加熱定着ローラの表面温度を180℃に設定し、
転写紙がA−Si:H光導電層表面上のトナー画像
部に達した時点に同期して圧接され転写紙上にト
ナーの転写定着を完了し、転写紙の通過後はA−
Si:H光導電層表面より離れる機構となつてい
る。又A−Si:H光導電層を有するドラムの背部
には転写、加熱定着ローラからの熱によつて温度
が50℃以上に上昇しない様冷却装置を取り付けて
ある。本実施例では水冷コイルによる冷却を行つ
たところ良好であつた。このようにして得た画像
はシヤープネス定着性、コントラストも充分で、
5万枚コピー後も初期と同等の画質を得ることが
できた。 Set the surface temperature of the heat fixing roller to 180℃,
When the transfer paper reaches the toner image area on the surface of the A-Si:H photoconductive layer, it is pressed into contact with the toner image area to complete the transfer and fixation of the toner onto the transfer paper.
The mechanism is such that it separates from the surface of the Si:H photoconductive layer. A cooling device is attached to the back of the drum having the A-Si:H photoconductive layer to prevent the temperature from rising above 50 DEG C. due to heat from the transfer and heat fixing rollers. In this example, cooling was performed using a water cooling coil, and the results were good. The images obtained in this way have sufficient sharpness and contrast,
Even after copying 50,000 copies, I was able to obtain the same image quality as the initial image quality.
実施例 2
実施例1と同様に、ステンレスドラム上に作成
したA−Si:H光導電層上にフツ素樹脂(商品
名:ポリフロンエナメル、ダイキン工業製)の有
機溶剤分散液をシンナーで200cpsに希釈し浸漬
塗布により1回10μ厚の絶縁層を設け、400℃で
20分乾燥し、冷却した。その上に更に同様に10μ
厚の絶縁層を設け、基体A−Si:H光導電層絶縁
層の3層から構成される感光体を得た。次に第3
図の構成よりなる機構を有する複写装置に得られ
た感光体を取り付け下記のプロセスによつて画出
しを行つた。Example 2 Similarly to Example 1, an organic solvent dispersion of fluororesin (trade name: Polyflon Enamel, manufactured by Daikin Industries) was applied to the A-Si:H photoconductive layer prepared on a stainless steel drum at 200 cps with thinner. An insulating layer with a thickness of 10 μm was applied once by dilution and dipping at 400°C.
Dry for 20 minutes and cool. 10μ on top of that
A thick insulating layer was provided to obtain a photoreceptor composed of three layers: substrate A--Si:H photoconductive layer and insulating layer. Then the third
The obtained photoreceptor was attached to a copying machine having the mechanism shown in the figure, and an image was printed by the following process.
第3図においてヒーター12として、ハロゲン
ランプ(800W)を配置し、転写紙が通過時に同
期しランプが点灯し、転写定着を完了する。(尚
補助的に転写後定着を完全に行うためヒーターを
設けても良い。この場合には、転写用ランプは転
写に必要な熱量を供給すれば良いので、ハロゲン
ランプのW数を低くすることが出来る。)
6.5kVコロナ帯電を行いに次に7kVコロナ帯電
を行うと同時に10 lux secの光画像を照射しその
0.2sec後に100 lux secの全面露光を行い、暗部
500V明部100Vのコントラストを持つた静電
潜像を得た。次に乾式ネガトナー、磁気ブラシ現
像を行い第3図の構成より成る転写、定着を転写
紙に行いシヤープネス、コントラスト、かぶりの
無い良好な複写画像を得ることが出来た。上記プ
ロセスを10万回同様繰返し行つたところ初期画像
と大差のない良好な画像を得ることが出来た。 In FIG. 3, a halogen lamp (800W) is arranged as the heater 12, and the lamp is turned on in synchronization with the passage of the transfer paper, completing the transfer and fixing. (Additionally, a heater may be provided to complete the fixation after transfer. In this case, the transfer lamp only needs to supply the amount of heat necessary for transfer, so the wattage of the halogen lamp should be lowered.) can be done.)
A 6.5 kV corona charge is applied, followed by a 7 kV corona charge, and at the same time a 10 lux sec light image is irradiated.
After 0.2 seconds, expose the entire surface to 100 lux sec to remove dark areas.
An electrostatic latent image with a contrast of 500V bright area and 100V was obtained. Next, dry negative toner and magnetic brush development were performed, and the transfer and fixation of the structure shown in FIG. 3 was carried out on a transfer paper, and a good copied image without sharpness, contrast, or fog could be obtained. When the above process was repeated 100,000 times, it was possible to obtain a good image that was not significantly different from the initial image.
実施例 3
実施例1においてA−Si:H光導電層を有する
感光体を用いて電子写真プロセスを実行する際、
A−Si:H光導電層像表面にÅ単位のシリコンオ
イル(商品名:SH200、東レシリコン製)を供給
したところ、10万枚複写後も初期の画質と変化の
少ないシヤープネスコントラストの十分な画質を
得ることができた。シリコンオイルを用いること
によつてA−Si:H光導電層へのトナーの付着防
止および転写効率の増大を一層計ることができ
た。Example 3 When carrying out the electrophotographic process using the photoreceptor having the A-Si:H photoconductive layer in Example 1,
When silicone oil (product name: SH200, manufactured by Toray Silicon Co., Ltd.) in Å units was supplied to the surface of the A-Si:H photoconductive layer image, the initial image quality and sharpness contrast remained unchanged even after 100,000 copies were made. I was able to get good image quality. By using silicone oil, it was possible to further prevent toner from adhering to the A-Si:H photoconductive layer and to increase transfer efficiency.
第1、第2図および第3図は、本発明の電子写
真法による転写同時加熱定着の各々1態様であ
る。第4図は本発明に用いる感光体の製造に用い
る光導電層製造用装置の1態様を示す。
1……支持体、2……A−Si:H光導電層、4
……転写材、5……加熱定着ローラ、7,8……
トナー画像、10……加熱定着ベルト、12……
ヒータ。
1, 2, and 3 each show one embodiment of the simultaneous transfer and heat fixing by the electrophotographic method of the present invention. FIG. 4 shows one embodiment of a photoconductive layer manufacturing apparatus used for manufacturing the photoreceptor used in the present invention. DESCRIPTION OF SYMBOLS 1...Support, 2...A-Si:H photoconductive layer, 4
...Transfer material, 5...Heating fixing roller, 7, 8...
Toner image, 10... Heat fixing belt, 12...
heater.
Claims (1)
リコンからなる光導電層を有する電子写真感光体
表面に形成されたトナー画像を転写材に転写同時
加熱定着することを特徴とする電子写真法。 2 前記電子写真感光体表面に離型性材料を有し
ている特許請求の範囲第1項に記載の電子写真
法。 3 転写定着時において定着手段が電子写真感光
体表面に押圧される特許請求の範囲第1項に記載
の電子写真法。 4 前記光導電層には、酸素、窒素及び炭素の中
の少なくとも一種が含有されている特許請求の範
囲第1項に記載の電子写真法。 5 酸素、窒素及び炭素の中の少なくとも1種の
含有量が0.1〜30原子%である特許請求の範囲第
4項に記載の電子写真法。[Claims] 1. A toner image formed on the surface of an electrophotographic photoreceptor having a photoconductive layer made of amorphous silicon containing 10 to 40 atomic percent hydrogen is transferred to a transfer material and simultaneously heat-fixed. electrophotography. 2. The electrophotographic method according to claim 1, wherein a releasable material is provided on the surface of the electrophotographic photoreceptor. 3. The electrophotographic method according to claim 1, wherein the fixing means is pressed against the surface of the electrophotographic photoreceptor during transfer and fixing. 4. The electrophotographic method according to claim 1, wherein the photoconductive layer contains at least one of oxygen, nitrogen, and carbon. 5. The electrophotographic method according to claim 4, wherein the content of at least one of oxygen, nitrogen, and carbon is 0.1 to 30 atomic %.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16355078A JPS5587156A (en) | 1978-12-25 | 1978-12-25 | Electrophotography |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16355078A JPS5587156A (en) | 1978-12-25 | 1978-12-25 | Electrophotography |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5587156A JPS5587156A (en) | 1980-07-01 |
| JPS6119032B2 true JPS6119032B2 (en) | 1986-05-15 |
Family
ID=15776020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16355078A Granted JPS5587156A (en) | 1978-12-25 | 1978-12-25 | Electrophotography |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5587156A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768862A (en) * | 1980-10-17 | 1982-04-27 | Fuji Xerox Co Ltd | Copying method |
| WO1983001127A1 (en) * | 1981-09-28 | 1983-03-31 | Matsuzaki, Masatoshi | Image formation method |
| JPH0713749B2 (en) * | 1983-04-26 | 1995-02-15 | キヤノン株式会社 | Image forming method |
| JP2776112B2 (en) * | 1991-04-15 | 1998-07-16 | 富士ゼロックス株式会社 | Electrophotography |
| US5592274A (en) * | 1992-01-31 | 1997-01-07 | Fuji Xerox Co., Ltd. | Electrophotographic apparatus and process for simultaneously transferring and fixing toner image onto transfer paper |
| US6934484B2 (en) | 2002-08-01 | 2005-08-23 | Ricoh Company, Ltd. | Image-forming apparatus and image-forming method |
-
1978
- 1978-12-25 JP JP16355078A patent/JPS5587156A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5587156A (en) | 1980-07-01 |
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