JPS61199045U - - Google Patents

Info

Publication number
JPS61199045U
JPS61199045U JP1985083167U JP8316785U JPS61199045U JP S61199045 U JPS61199045 U JP S61199045U JP 1985083167 U JP1985083167 U JP 1985083167U JP 8316785 U JP8316785 U JP 8316785U JP S61199045 U JPS61199045 U JP S61199045U
Authority
JP
Japan
Prior art keywords
semiconductor
flat plate
semiconductor element
shaped portion
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985083167U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985083167U priority Critical patent/JPS61199045U/ja
Publication of JPS61199045U publication Critical patent/JPS61199045U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP1985083167U 1985-05-31 1985-05-31 Pending JPS61199045U (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985083167U JPS61199045U (mo) 1985-05-31 1985-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985083167U JPS61199045U (mo) 1985-05-31 1985-05-31

Publications (1)

Publication Number Publication Date
JPS61199045U true JPS61199045U (mo) 1986-12-12

Family

ID=30631547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985083167U Pending JPS61199045U (mo) 1985-05-31 1985-05-31

Country Status (1)

Country Link
JP (1) JPS61199045U (mo)

Similar Documents

Publication Publication Date Title
JPS6289141U (mo)
JPS6441145U (mo)
JPH0171847U (mo)
JPS62166793U (mo)
JPS62134754U (mo)
JPS61129344U (mo)
JPS6196592U (mo)
JPS619757U (ja) 側面に凹凸形状を有するブレ−カ−
JPS62159657U (mo)
JPS62126879U (mo)
JPS5942049U (ja) 電子部品装着構体
JPS63197346U (mo)
JPS61164873U (mo)
JPS5821313U (ja) 時計バンド
JPH03129654U (mo)
JPS59796U (ja) 穀物乾燥機における穀槽枠体の補強装置
JPS6332322U (mo)
JPH0261815U (mo)
JPS6122840U (ja) 壁装材縁部分の固定具
JPS61196461U (mo)
JPS61187169U (mo)
JPH0382557U (mo)
JPS6270721U (mo)
JPS6143554U (ja) 車両用成形天井
JPS62176058U (mo)