JPS6120126B2 - - Google Patents
Info
- Publication number
- JPS6120126B2 JPS6120126B2 JP52157624A JP15762477A JPS6120126B2 JP S6120126 B2 JPS6120126 B2 JP S6120126B2 JP 52157624 A JP52157624 A JP 52157624A JP 15762477 A JP15762477 A JP 15762477A JP S6120126 B2 JPS6120126 B2 JP S6120126B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- adhesive tape
- double
- layer
- sided adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 20
- 239000002390 adhesive tape Substances 0.000 claims description 14
- 239000003792 electrolyte Substances 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 238000011049 filling Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- GZUXJHMPEANEGY-UHFFFAOYSA-N bromomethane Chemical compound BrC GZUXJHMPEANEGY-UHFFFAOYSA-N 0.000 description 4
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 4
- 239000007784 solid electrolyte Substances 0.000 description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- 239000004312 hexamethylene tetramine Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229940102396 methyl bromide Drugs 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- -1 methyl halide Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Electric Double-Layer Capacitors Or The Like (AREA)
Description
本発明は、複数の電気二重層容量セルを直列に
結合した薄形のキヤパシタに関する。
従来、一般のキヤパシタとして使われているも
のは、半導体の空間電荷を応用したもの、誘電体
の両側に誘起された電荷を応用したものであつ
た。これらのうち、容量のごく小さいものは、集
積回路のように同一回路基板上に組込まれている
が、大きな容量のものは回路に外付けされた形で
使用されて来ている。電気二重層容量は、これら
キヤパシタに較べて容量密度が高く、キヤパシタ
を小型化できる可能性がある。最近、分極性電極
と固体電解質との界面で形成される電気二重層を
利用した素子が、検討され商品化されている。し
かし、これらは何れもタイマーとか積分素子のよ
うに機能素子として使われるものであり、同一基
板上にキヤパシタとして組込まれ使用さるもので
はなかつた。その理由は、電極及び電解質に銀お
よび銀塩を用いているので、高価であり、また分
解電圧が低くて耐圧が高くできなかつたためと考
えられる。
発明者らは、ハロゲン化第一銅にトリエチレン
ジアミンあるいはヘキサメチレンテトラミンのメ
チルハライドを所定量加え、所定の温度で加熱反
応させてから急冷して得た固体電解質が、ほぼ銀
塩のそれと同程度のイオン伝導性を示し、経時劣
化も少なく、分解電圧も0.72V(銀塩0.67V)と
高いことを見出した。また従来の銀塩の素子の電
解質と対極を単に前記の銅塩固体電解質と銅に置
き換えただけでは、繰返し使用に耐え、リーク電
流の小さいものが得られないが、キヤパシタ構成
要素を外気に触れないようにし、両極ともカーボ
ンを用いると有効であることを見出した。
本発明は、以上のようなキヤパシタ構成要素を
利用して、回路内に内蔵させることも可能な薄形
キヤパシタを提供するものである。
以下、本発明の実施例を説明する。
第1図及び第2図は本発明によるキヤパシタの
構成例を示す。
1及び2はフエノール樹脂、ポリエステル、エ
ポキシ樹脂、ポリイミドなどの耐熱性樹脂からな
るシートである。これら樹脂シートの内側にキヤ
パシタ要素を配し、両面接着テープ3,4等によ
り貼り合わせることにより密封する。キヤパシタ
を回路に内蔵する場合は、シート1が回路基板と
なる。
キヤパシタの製造法を詳しく説明すると、まず
樹脂シート1及び2に表面紙つきの両面接着テー
プ3及び4をそれぞれ貼り付ける。テープには貫
通孔が設けてあり、その貫通孔に蒸着、あるいは
スパツタでニツケル、ステンレス鋼、金あるいは
白金のような化学的、電気化学的に安定な金属の
層5及び6を設ける。これらの金属には通常経済
的に安価なニツケルあるいはステンレス鋼を用い
る。これによつて電極の集電体部とコネクタの一
部を形成する。7及び8はそれぞれ金属層5及び
6上に設けたカーボン塗着層からなる電極部であ
る。
これらの電極部は、活性炭と電解質とを重量比
3:7の割合で混合したもの100重量部に、15重
量部のエポキシ樹脂またはレゾール系の結着剤を
加えたブチルセロソルブを加えて練合したペース
トを層5または6上に充填し、自然乾燥後130℃
で5分間ホツトプレスすることによつて形成し
た。
その後、テープ3,4の表面紙を剥ぎ取り、一
方のシート上の電極を覆うように電解質を充填す
るための貫通孔を設けた両面接着テープ10を貼
り、その貫通孔に電解質100重量部に15重量部の
結着剤を加えたブチルセロソルブを加えて練合し
たペーストを充填し、自然乾燥して電解質層9を
形成する。その後テープ10の表面紙を剥し、電
解質層9を介してカーボン電極7と8が対向する
よう樹脂シート1と2を貼り合わせ、130℃で5
分間ホツトプレスする。貼り合わせによつて個々
のセルが直列に接続されるように両面接着テープ
の貫通孔の位置合わせを正確に行なつておく。
なお、電解質には例えばハロゲン化第一銅にト
リエチレンジアミンのメチルブロマイド
C6H12N2・(CH3Br)2またはヘキサメチレンテト
ラミンのメチルブロマイドC6H12N4・CH3Brを
12.5モル%の割合で混合し、230℃または150℃で
加熱反応させてから急冷して得たものを用いた。
次に上記のようにして10セルを直列接続した56
μF、7.2Vの本発明のキヤパシタAの特性を10
μF、16Vのタイマー用アルミ電解コンデンサB
と比較した結果を表に示す。
なお、本発明のキヤパシタAにおいて、個々の
セルの電極は大きさ2mm×2mmとし、充填厚さは
両面接着テープの厚さを50μとすることで調整し
た。また、電解質は大きさ2.6mm×2.6mmとし、充
填厚さは両面接着テープの厚さを20μとすること
で調整した。電解質充填層の間隔はカツトが可能
な1mmとし、電極の間隔は1.6mmとした。
The present invention relates to a thin capacitor in which a plurality of electric double layer capacitance cells are connected in series. Conventionally, capacitors that have been used in general have utilized the space charge of semiconductors or the charges induced on both sides of a dielectric material. Among these, those with very small capacitance are built on the same circuit board like integrated circuits, while those with large capacitance are used externally to the circuit. The electric double layer capacitor has a higher capacitance density than these capacitors, and there is a possibility that the capacitor can be made smaller. Recently, devices using an electric double layer formed at the interface between a polarizable electrode and a solid electrolyte have been studied and commercialized. However, all of these are used as functional elements such as timers and integral elements, and are not used as a capacitor incorporated on the same substrate. The reason for this is thought to be that silver and silver salts are used for the electrodes and electrolyte, which are expensive, and the decomposition voltage is low, making it impossible to achieve a high withstand voltage. The inventors added a predetermined amount of methyl halide of triethylenediamine or hexamethylenetetramine to cuprous halide, heated the reaction at a predetermined temperature, and then rapidly cooled the resulting solid electrolyte. It has been found that it exhibits high ionic conductivity, little deterioration over time, and a high decomposition voltage of 0.72V (silver salt 0.67V). Furthermore, simply replacing the electrolyte and counter electrode of a conventional silver salt element with the copper salt solid electrolyte and copper does not provide a device that can withstand repeated use and has a small leakage current. We have found that it is effective to use carbon for both electrodes. The present invention provides a thin capacitor that can be built into a circuit by using the above-described capacitor components. Examples of the present invention will be described below. 1 and 2 show an example of the structure of a capacitor according to the present invention. 1 and 2 are sheets made of heat-resistant resin such as phenol resin, polyester, epoxy resin, polyimide, etc. A capacitor element is arranged inside these resin sheets, and the resin sheets are sealed by pasting them together using double-sided adhesive tapes 3, 4 or the like. When a capacitor is built into a circuit, the sheet 1 becomes a circuit board. To explain in detail the manufacturing method of the capacitor, first, double-sided adhesive tapes 3 and 4 with a paper surface are attached to resin sheets 1 and 2, respectively. The tape is provided with through holes into which layers 5 and 6 of chemically and electrochemically stable metals such as nickel, stainless steel, gold or platinum are applied by vapor deposition or sputtering. These metals are usually economically inexpensive nickel or stainless steel. This forms the current collector portion of the electrode and a portion of the connector. Reference numerals 7 and 8 designate electrode portions made of carbon coating layers provided on metal layers 5 and 6, respectively. These electrode parts were made by mixing 100 parts by weight of a mixture of activated carbon and electrolyte at a weight ratio of 3:7 with the addition of butyl cellosolve containing 15 parts by weight of epoxy resin or resol type binder. Fill the paste on layer 5 or 6 and dry it naturally at 130℃.
by hot pressing for 5 minutes. After that, the surface paper of the tapes 3 and 4 is peeled off, and a double-sided adhesive tape 10 with a through hole for filling the electrolyte is pasted so as to cover the electrodes on one sheet, and 100 parts by weight of electrolyte is added to the through hole. A paste prepared by adding and kneading butyl cellosolve containing 15 parts by weight of a binder is filled, and the electrolyte layer 9 is formed by air drying. After that, the surface paper of the tape 10 was peeled off, and the resin sheets 1 and 2 were pasted together so that the carbon electrodes 7 and 8 faced each other with the electrolyte layer 9 in between.
Hot press for a minute. The through holes of the double-sided adhesive tape are accurately aligned so that the individual cells are connected in series by pasting. In addition, the electrolyte includes, for example, methyl bromide of triethylenediamine in cuprous halide.
C 6 H 12 N 2・(CH 3 Br) 2 or the methyl bromide of hexamethylenetetramine C 6 H 12 N 4・CH 3 Br
The mixture was mixed at a ratio of 12.5 mol%, reacted by heating at 230°C or 150°C, and then rapidly cooled. Next, 56 cells were connected in series with 10 cells as described above.
The characteristics of capacitor A of the present invention with μF and 7.2V are 10
μF, 16V aluminum electrolytic capacitor B for timer
The results of the comparison are shown in the table. In capacitor A of the present invention, the electrodes of each cell had a size of 2 mm x 2 mm, and the filling thickness was adjusted by setting the thickness of the double-sided adhesive tape to 50 μm. In addition, the size of the electrolyte was 2.6 mm x 2.6 mm, and the filling thickness was adjusted by setting the thickness of the double-sided adhesive tape to 20 μm. The spacing between the electrolyte filled layers was 1 mm to allow for cutting, and the spacing between the electrodes was 1.6 mm.
【表】【table】
【表】
以上の結果から、本発明のキヤパシタは、小型
で蓄積エネルギー密度が高く、リーク電流が小さ
く、高温まで使用できる特徴を有することがわか
る。
また、製造に当たつて、金属層及びカーボン電
極、さらには固体電解質の付着及び充填パターン
に両面接着テープを用いれば、テープ厚みによつ
て充填量を正確に制御できるばかりでなく、充填
物を密に結着するためにホツトプレスする場合に
も充填物が拡がることなくプレスされ、さらに貼
り合わせの際にも、充填物以外の所がすべて貼り
着けられ、付着強度を上げられ、充填物各層の剥
れが起こりにくい。他の手段、例えばスクリーン
印刷では、充填物が拡がらないようにしてプレス
することが難しく、またフオトレジストではプレ
スすら難しい。さらに、これら他の手段では、充
填物以外の所に接着剤を塗布することが難しい欠
点を有し、直列抵抗をバラツキなく小さくし得な
い。
容量は、第3図のように電極のカーボン混合物
の重量に比例するが、両面接着テープの貫通孔の
大きさと厚みを変えることにより、任意の容量の
ものを作ることが可能である。
以上のように本発明によれば小型で蓄積エネル
ギー密度が高いキヤパシタを提供することができ
る。[Table] From the above results, it can be seen that the capacitor of the present invention is small in size, has a high stored energy density, has a small leakage current, and can be used up to high temperatures. In addition, during manufacturing, if double-sided adhesive tape is used for the attachment and filling pattern of the metal layer, carbon electrode, and solid electrolyte, not only can the amount of filling be accurately controlled by the tape thickness, but also the amount of filling can be easily controlled. Even when hot-pressing to achieve a tight bond, the filling is pressed without spreading, and when bonding, all areas other than the filling are affixed, increasing the adhesion strength and ensuring that each layer of the filling is Peeling is less likely to occur. With other means, such as screen printing, it is difficult to press without spreading the filler, and with photoresist, even pressing is difficult. Furthermore, these other means have the drawback that it is difficult to apply the adhesive to areas other than the filling, and it is not possible to reduce the series resistance without variation. The capacity is proportional to the weight of the carbon mixture of the electrode as shown in FIG. 3, but by changing the size and thickness of the through holes in the double-sided adhesive tape, it is possible to create an arbitrary capacity. As described above, according to the present invention, it is possible to provide a capacitor that is small and has a high storage energy density.
第1図は本発明の一実施例におけるキヤパシタ
の縦断面図、第2図は同要部を除いた平面図、第
3図は同キヤパシタの電極のカーボンの重量と単
セルの容量の関係を示す特性図、第4図はキヤパ
シタの等価回路図である。
1,2……樹脂シート、3,4……両面接着テ
ープ、5,6……金属層、7,8……カーボン電
極、9……電解質、10……両面接着テープ。
Fig. 1 is a longitudinal cross-sectional view of a capacitor according to an embodiment of the present invention, Fig. 2 is a plan view with essential parts removed, and Fig. 3 shows the relationship between the weight of carbon in the electrode of the capacitor and the capacity of a single cell. The characteristic diagram shown in FIG. 4 is an equivalent circuit diagram of the capacitor. 1, 2... Resin sheet, 3, 4... Double-sided adhesive tape, 5, 6... Metal layer, 7, 8... Carbon electrode, 9... Electrolyte, 10... Double-sided adhesive tape.
Claims (1)
属層を形成するとともに前記金属層上にカーボン
塗着層からなる電極部を形成した2枚の樹脂シー
トを、固体電解質層を介して前記電極部が対向す
るように貼り合わせて、直列に結合された複数の
電気二重層容量セルを構成し、かつこれらセルを
密封したキヤパシタ。 2 前記樹脂シート上の金属層が、樹脂シート上
に貼り合わせた両面接着テープの貫通孔部分に形
成され、かつ隣接する金属層と前記接着テープに
よつて隔離されている特許請求の範囲第1項記載
のキヤパシタ。 3 前記電解質層が、前記両樹脂シートの電極部
形成面を貼り合わせる両面接着テープの貫通孔部
分に形成され、隣接する電解質層とは前記接着テ
ープにより隔離されている特許請求の範囲第1項
記載のキヤパシタ。[Scope of Claims] 1. Two resin sheets, each having a plurality of metal layers forming a current collector part and a connector part on their surfaces and electrode parts made of a carbon coating layer formed on the metal layers, are made into a solid state. A capacitor in which the electrode parts are bonded together so as to face each other with an electrolyte layer in between to form a plurality of electric double layer capacitance cells connected in series, and these cells are sealed. 2. Claim 1, wherein the metal layer on the resin sheet is formed in a through-hole portion of a double-sided adhesive tape bonded on the resin sheet, and is separated from an adjacent metal layer by the adhesive tape. Capacitor described in section. 3. Claim 1, wherein the electrolyte layer is formed in a through-hole portion of a double-sided adhesive tape that bonds the electrode portion forming surfaces of both resin sheets, and is separated from an adjacent electrolyte layer by the adhesive tape. Capacitor as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15762477A JPS5490558A (en) | 1977-12-28 | 1977-12-28 | Capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15762477A JPS5490558A (en) | 1977-12-28 | 1977-12-28 | Capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5490558A JPS5490558A (en) | 1979-07-18 |
| JPS6120126B2 true JPS6120126B2 (en) | 1986-05-21 |
Family
ID=15653789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15762477A Granted JPS5490558A (en) | 1977-12-28 | 1977-12-28 | Capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5490558A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59176136U (en) * | 1983-05-10 | 1984-11-24 | 日本ケミコン株式会社 | electric double layer capacitor |
| JP5605831B2 (en) * | 2010-07-15 | 2014-10-15 | セイコーインスツル株式会社 | Electronic component, electronic device, and method of manufacturing electronic component |
| TWI528391B (en) * | 2012-01-24 | 2016-04-01 | Taiwan Green Point Entpr Co | Supercapacitor module and its making method |
-
1977
- 1977-12-28 JP JP15762477A patent/JPS5490558A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5490558A (en) | 1979-07-18 |
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