JPS61220A - Flame-retarding epoxy resin composition - Google Patents
Flame-retarding epoxy resin compositionInfo
- Publication number
- JPS61220A JPS61220A JP12015984A JP12015984A JPS61220A JP S61220 A JPS61220 A JP S61220A JP 12015984 A JP12015984 A JP 12015984A JP 12015984 A JP12015984 A JP 12015984A JP S61220 A JPS61220 A JP S61220A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- resin
- epoxy resin
- flame
- brominated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
A、産業上の利用分野
本発明は、耐熱性、耐湿性、耐溶剤性に優れ、硬化収縮
が小さい特性を有する難燃性エポキシ樹脂組成物に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a flame-retardant epoxy resin composition having excellent heat resistance, moisture resistance, solvent resistance, and low curing shrinkage.
B、従来の技術
1ポキシ樹脂は、電気的、機械的特性などの点で優れて
いるために、個別半導体、コイル、碍子、プリント配線
基板、もしくはLSIなどの素子を封止して、電気・電
子部品を製造する用途に使用されている。B. Prior Art 1 Poxy resin has excellent electrical and mechanical properties, so it can be used to seal elements such as individual semiconductors, coils, insulators, printed wiring boards, or LSIs, and to provide electrical and mechanical properties. Used for manufacturing electronic parts.
最近、電気・電子部品において、高い信頼性や高密度化
などが要望され、これを満すため、耐熱性、耐衝撃性、
耐溶剤性等が優れ、且つ難燃性の1ポキシ樹脂組成物の
開発が要求されている。Recently, there has been a demand for high reliability and high density in electrical and electronic components, and to meet these demands, heat resistance, impact resistance,
There is a demand for the development of a 1-poxy resin composition that has excellent solvent resistance and is flame retardant.
C0発明が解決しようとする問題点
従来、難燃性エポキシ樹脂は、樹脂に難燃化剤を添加す
る添加型のものと、エポキシ樹脂などと反応する反応型
難燃化剤と、樹脂自体が難燃性を有する自己消火性樹脂
が知られている。Problems to be solved by the C0 invention Conventionally, flame-retardant epoxy resins have been divided into additive-type ones in which a flame retardant is added to the resin, reactive-type flame retardants that react with the epoxy resin, and resins themselves. Self-extinguishing resins having flame retardant properties are known.
例えば、エポキシ樹脂に難燃化剤(テトラブロムビスフ
ェノールAなど)やフェノール・ノボラック型樹脂、ジ
シアンジアミド、イミダゾール系等の硬化剤を配合した
樹脂組成物が電気・電子絶縁材料として用いられている
。この組成物によって得られた硬化体は架橋密度が低く
、耐熱性、耐衝撃性や耐溶剤性などの点で満足するもの
は得られない欠点がある。For example, resin compositions in which epoxy resins are blended with flame retardants (such as tetrabromobisphenol A), phenol-novolak type resins, dicyandiamide, imidazole-based hardening agents, etc. are used as electrical/electronic insulating materials. The cured product obtained from this composition has a low crosslinking density, and has the disadvantage that it cannot be obtained in terms of heat resistance, impact resistance, solvent resistance, etc.
またジシアンジアミドをエポキシ樹脂や臭素化エポキシ
樹脂の硬化剤としC用いた系では、積層板関係では樹脂
との相溶性が悪く、ブ°リプレグ製造時に硬化剤が析出
する場合があり、反応も不均一になりやすいため耐熱性
、耐溶剤性や耐ミーズリング性などが低下覆る欠点を有
する。In addition, in systems where dicyandiamide is used as a curing agent for epoxy resins and brominated epoxy resins, it has poor compatibility with resins in laminates, and the curing agent may precipitate during the production of polypregs, resulting in uneven reactions. This has the disadvantage of decreasing heat resistance, solvent resistance, measling resistance, etc.
D9問題点を解決するための手段
本発明者らは、上述の如き従来の欠点を解消すべく種々
の化合物について、硬化剤とし−このi
物性評価を行な・た結果、高純度臭素化ノボラ“′□□
ツク型樹脂をエポキシ樹脂の硬化剤に
使用した場合、硬化速度が従来のノボラック型樹脂より
早く、耐燃性、耐熱性、耐衝撃性、耐溶剤性等の優れた
性能を有することを見出し、本発明するに至ったもので
ある。Means for Solving Problem D9 In order to solve the above-mentioned conventional drawbacks, the present inventors have developed various compounds as curing agents.
As a result of physical property evaluation, high purity brominated novola “′□□
We discovered that when Tsuku-type resin is used as a curing agent for epoxy resin, the curing speed is faster than that of conventional novolac-type resin, and it has excellent performance such as flame resistance, heat resistance, impact resistance, and solvent resistance. This is what led to his invention.
10作用および効果 以下、本発明をさらに詳細に説明する。10 actions and effects The present invention will be explained in more detail below.
本発明における1ポキシ樹脂としては、1分子あたり2
個以上のエポキシ基を有するエポキシ樹脂は、全て使用
することが可能である。この様なエポキシ樹脂としては
、ビスフェノールA型エポキシ樹脂、臭素化ビスフェノ
ールA型エポキシ樹脂、ノボラック型エポキシ樹脂、エ
ポキシ化ポリオレフィン樹脂などがあり、単独もしくは
、混合して使用することも可能である。In the present invention, 1 poxy resin is 2 per molecule.
Any epoxy resin having more than 2 epoxy groups can be used. Such epoxy resins include bisphenol A epoxy resins, brominated bisphenol A epoxy resins, novolac epoxy resins, and epoxidized polyolefin resins, and they can be used alone or in combination.
本発明における高純度臭素化ノボラック樹脂は、一般式
〔式中Rは、水素もしくはメチル基を示し、nは平均値
0〜15を示す。XとV(よ、ぞれぞれ0〜2の整数を
示す。〕
で表わされる樹脂であり、臭素化フェノール類(臭素化
フェノール、臭素化クレゾール等)をアルデヒド類と共
に酸性触媒上で縮合させて得られるコボリンー、ホモポ
リマー樹脂である。The high-purity brominated novolak resin in the present invention has the general formula [wherein R represents hydrogen or a methyl group, and n represents an average value of 0 to 15]. It is a resin represented by Cobolin is a homopolymer resin obtained by
またノボラック型樹脂(コポリマ〜、小モボリマー型)
を、臭素と反応しない溶媒に溶解し、これを臭素させる
ことによっても得られる。Also, novolac type resin (copolymer~, small mobolymer type)
It can also be obtained by dissolving this in a solvent that does not react with bromine and brominating it.
特に本発明の高純度臭素化ノボラック型樹脂は、本出願
人が先に提案した方法(特願昭59−67986号)、
即ちノボラック型樹脂を溶剤に溶解し、ラジカル禁止剤
の存在型暗所で臭素化して有利に得ることができる。In particular, the high purity brominated novolak type resin of the present invention can be obtained by the method previously proposed by the applicant (Japanese Patent Application No. 1986-67986).
That is, it can be advantageously obtained by dissolving a novolac type resin in a solvent and brominating it in the dark in the presence of a radical inhibitor.
従来のフェノールノボラック型樹脂に比べC1本発明に
おける高純度臭素化ノボラック型樹脂は、エポキシ基に
対する求核性が高いため、硬化速度が早い特徴がある。Compared to conventional phenol novolac type resins, the high purity brominated novolac type resin in the C1 invention has a high nucleophilicity to epoxy groups, and therefore has a high curing speed.
また本発明の高純度臭素化ノボラック型樹脂ではイの構
成tツマ−にアルキルフェノール類を用い、これを共縮
合することによって、樹脂の流動性が優れ、耐湿性、耐
衝撃性の優れた難燃性樹脂組成物を与える特徴がある。In addition, in the high purity brominated novolac type resin of the present invention, alkylphenols are used as the component (a), and by co-condensing them, the resin has excellent fluidity and is flame retardant with excellent moisture resistance and impact resistance. It has the characteristics of providing a synthetic resin composition.
更にまた求める物性によってノボラックの共縮合度を調
整することが可能である。Furthermore, it is possible to adjust the degree of co-condensation of novolak depending on the desired physical properties.
また、耐燃性においても、臭素化度を調整して使用する
ことができる。Also, regarding flame resistance, the degree of bromination can be adjusted and used.
本発明における高純度臭素化ノボラック型樹脂の臭素含
有率は5〜60%であり、その遊離臭素化上ツマ−は0
,3%以下の、高純度臭素化ノボラック型樹脂である。The bromine content of the high-purity brominated novolac type resin in the present invention is 5 to 60%, and the free bromination content is 0.
, 3% or less, is a high purity brominated novolak type resin.
この遊離モノンー含有率が高いと架橋密度が低下し、耐
熱性や耐溶剤性などが低下づるため好ましくなく、また
成形相お1組成物においては、金型などの汚染の原因に
なるため好ましくない。A high content of free monones is undesirable because it lowers the crosslinking density and reduces heat resistance and solvent resistance.In addition, in the case of a molding phase composition, it is undesirable because it causes contamination of the mold, etc. .
高純度臭素化ノボラック型樹脂の重合度[1は0〜15
の範囲で15を超えると樹脂との相溶性が低下し、樹脂
の流れ性を低下し成形性が悪くなる。又、得られた硬化
体の強度などが低下し、好ましくない。nがO(2核体
)以下であると耐熱性が低下する。上記のうちC重合度
1〜8で軟化点が約40〜130℃のものが好ましい1
゜次に、エポキシ樹脂に対Jる高純度臭素化ノボラック
型樹脂の添加量は、高純度臭素化ノボラック型樹脂のフ
ェノール性水酸基がエポキシ樹脂のエポキシ基に対して
0.7・〜1.1当量の範囲が望ましい。1.1当量を
超える場合には、臭素化ノボラック型樹脂が未反応で残
り、−万0.7当量以下では、エポキシ樹脂が未反応で
残るため、耐熱性等が低下する。上記の範囲のうち特に
好ましくは0.8〜1.0当量である。Polymerization degree of high purity brominated novolac type resin [1 is 0 to 15
If it exceeds 15 in the range, the compatibility with the resin decreases, the flowability of the resin decreases, and the moldability deteriorates. In addition, the strength of the obtained cured product decreases, which is not preferable. When n is less than or equal to O (binary), heat resistance decreases. Among the above, those with a degree of C polymerization of 1 to 8 and a softening point of about 40 to 130°C are preferred 1
゜Next, the amount of high purity brominated novolak type resin added to the epoxy resin is such that the phenolic hydroxyl group of the high purity brominated novolac type resin is 0.7 to 1.1 to the epoxy group of the epoxy resin. A range of equivalents is desirable. When the amount exceeds 1.1 equivalents, the brominated novolac type resin remains unreacted, and when the amount is less than -0.7 equivalents, the epoxy resin remains unreacted, resulting in a decrease in heat resistance. Among the above ranges, particularly preferably 0.8 to 1.0 equivalents.
一般的にエポキシ樹脂の硬化剤としては、ジシアンジア
ミド、ジアミノシフ−[ニルスルホン、ジアミノシフ1
ニルメタンなどの芳香族系硬化剤、酸無水物系硬化剤等
が使用されている。Generally, curing agents for epoxy resins include dicyandiamide, diaminosif-[nylsulfone, diaminosif-1
Aromatic curing agents such as nilmethane, acid anhydride curing agents, etc. are used.
硬化促進剤としては、一般的にベンジルジメチルアミン
、トリメチルアミンなどの第3級ア4 ミノ
類、2−メチルイミダゾール、)lニルイミダゾールな
どのイミダゾール類などが使用されているが、得られる
硬化体の耐熱性、耐水性などの低下する欠点がある。As curing accelerators, tertiary amines such as benzyldimethylamine and trimethylamine, and imidazoles such as 2-methylimidazole and )l-nylimidazole are generally used. There are drawbacks such as reduced heat resistance and water resistance.
本発明、者らは、上記の如き従来の欠点を解消すべく種
々のエポキシ硬化促進剤について検討した結果、耐熱性
、耐湿性に優れ、高純度臭素化ノボラック樹脂に適合し
た硬化促進剤の開発に至った。その硬化促進剤としては
、3−フェニル−1,1−ジメチルウレア、3−(4ブ
ロムフエニル)−i、i−ジメチルウレア、1,1′
−フェニレンビス(3,3−ジメチルウレア)などの尿
素誘導体などを挙げることができる。エポキシ樹脂組成
物に添加される硬化促進剤の配合量は、エポキシ樹脂に
対して0.05〜10重量部、好ましくは0.5〜5重
量部の範囲が望ましい。The inventors of the present invention have investigated various epoxy curing accelerators in order to overcome the above-mentioned drawbacks of conventional epoxy curing accelerators, and have developed a curing accelerator that has excellent heat resistance and moisture resistance and is compatible with high-purity brominated novolac resins. reached. As the curing accelerator, 3-phenyl-1,1-dimethylurea, 3-(4bromphenyl)-i,i-dimethylurea, 1,1'
Examples include urea derivatives such as -phenylenebis(3,3-dimethylurea). The amount of the curing accelerator added to the epoxy resin composition is desirably in the range of 0.05 to 10 parts by weight, preferably 0.5 to 5 parts by weight, based on the epoxy resin.
0.05重量部未満では硬化促進効果が低く、10重量
部以上では、硬化が急激に進み、収縮性が大きくなる欠
点がある。If it is less than 0.05 parts by weight, the curing accelerating effect will be low, and if it is more than 10 parts by weight, curing will proceed rapidly and shrinkage will increase.
また、これに必要に応じて硬化促進剤、希釈剤、充填剤
、顔料難燃化剤等の各種の添加剤を加えても良い、
F、実施例
次に、本発明の効果を確認Jるために行なった実験例に
ついて説明する。In addition, various additives such as curing accelerators, diluents, fillers, pigment flame retardants, etc. may be added to this as necessary. An example of an experiment conducted for this purpose will be explained.
〔実施例1〜5〕
クレゾールノボラック型1ボ4−シ樹脂であるEOCN
−4023(日本化薬(株)社、エポキシ当量210・
〜230) 、高臭素化エポキシ樹脂エボトーhYDB
−400(京都化成(株)社)、高純度臭素化クレゾー
ル・フェノールノボラック型共縮合樹脂と硬化促進剤を
表−1の処方に依って夫々配合し、メチルエチルケ[・
ンを加え、エポキシ樹脂ワニスを調製した。コニポギシ
シラン処理した厚さ0.18mmのガラスクロス(日東
紡績E P F 18A >からなる基材にこのワニス
を含浸塗布し、160℃の温度で乾燥して樹脂分40%
のプリプレグを作成した。このプリプレグを8板積層し
、これに両面に厚さ35μの銅箔を小ねて160℃、6
osg/ ctiで60分間熱圧成形し、板厚さが’I
、6mmの銅張積層板を作製した。。[Examples 1 to 5] EOCN, which is a cresol novolak type 1-4 resin
-4023 (Nippon Kayaku Co., Ltd., epoxy equivalent 210.
~230), highly brominated epoxy resin EBOTO hYDB
-400 (Kyoto Kasei Co., Ltd.), a high-purity brominated cresol/phenol novolac type co-condensation resin and a curing accelerator were blended according to the formulation in Table 1, and methyl ethyl ket [.
was added to prepare an epoxy resin varnish. This varnish is impregnated and coated on a base material made of 0.18 mm thick glass cloth (Nitto Boseki E P F 18A) treated with Konipogishiran, and dried at a temperature of 160°C to reduce the resin content to 40%.
A prepreg was created. Eight sheets of this prepreg were laminated, and copper foil with a thickness of 35μ was placed on both sides of the prepreg, and the temperature was set at 160°C for 60 minutes.
Hot pressure molded for 60 minutes using OSG/CTI, and the plate thickness is 'I'.
, a 6 mm copper-clad laminate was produced. .
このようにして得られた実施例の銅張積層板の耐熱性、
難、燃性、ミーズリング性、成形性、硬度、吸水率を調
べたところ、表−1に示す結果を得た。The heat resistance of the copper-clad laminate of the example obtained in this way,
When the retardancy, flame resistance, measling property, moldability, hardness, and water absorption were examined, the results shown in Table 1 were obtained.
〔比較例1)
表−1記載のように、実施例1〜5の高純度臭素化クレ
ゾール・フェノールノボラック型共縮合樹脂をジシアン
ジアミドに変え、硬化促進剤として、ベンジルジメチル
アミンを配合し、これ以外の条件は実、施例1〜5と同
様に行ない、両面銅箔積層板を作製した。実施例1〜5
と同様に性能試験を行なった結果を表−1に示す。[Comparative Example 1] As shown in Table 1, the high-purity brominated cresol/phenol novolak type cocondensation resin of Examples 1 to 5 was changed to dicyandiamide, and benzyldimethylamine was blended as a curing accelerator. The same conditions as in Examples 1 to 5 were used to produce double-sided copper foil laminates. Examples 1-5
Table 1 shows the results of a performance test conducted in the same manner as above.
〔実施例6〜7〕
ト記の組成物を90−110℃の温度で十分混練後、冷
却、粉砕して成形材料とした。[Examples 6 to 7] The composition described in (g) was sufficiently kneaded at a temperature of 90 to 110°C, then cooled and pulverized to obtain a molding material.
E’CON 1
00部(日本化薬社製、エボギシ当量210〜230)
高純度臭素化クレゾール・
フェノールノボラック型樹脂
3=フ1ニル−1,1−ジメチルウレア 4
部ヒユーズレックス RD −8(龍森礼製)350部
カルナバワックス 2部カー
ボンブラック 1部ミランノ
コップリング剤 0.5部硬化条件
は、100℃、2時間プラス170℃/6時間で、iス
トピースを作製しlこ。E'CON 1
00 parts (manufactured by Nippon Kayaku Co., Ltd., Ebogishi equivalent weight 210-230)
High purity brominated cresol/phenol novolac type resin 3 = F1-1,1-dimethylurea 4
Part: Fuse Rex RD-8 (manufactured by Rei Tatsumori) 350 parts Carnauba wax 2 parts Carbon black 1 part Milano Copper 0.5 part Curing conditions were 100°C for 2 hours plus 170°C for 6 hours. Create a.
硬化体の曲げ強度、ガラス転移温度、シア−1D強度、
硬化収縮性を表−2に示した。Bending strength of cured product, glass transition temperature, shear-1D strength,
The curing shrinkage properties are shown in Table 2.
〔比較例2〕
表−2記載の通り実施例6〜7配合の高純度臭素化クレ
ゾール・フェノールノボラック型樹脂をフェノール・ノ
ボラック樹脂ランダムタイプ、軟化点85℃に変え、難
燃性1ポキシ樹脂BREN (日本化桑社製、エポキシ
当M 280〜300)を添加し、成形材料を調製し、
実施例6〜7と同様に硬化物を作製し、物性評価を行な
った。[Comparative Example 2] As shown in Table 2, the high purity brominated cresol/phenol novolac type resin blended in Examples 6 to 7 was changed to a phenol/novolak resin random type with a softening point of 85°C, and flame retardant 1 poxy resin BREN was obtained. (manufactured by Nippon Kayakusha Co., Ltd., epoxy weight M 280-300) was added to prepare a molding material,
Cured products were produced in the same manner as in Examples 6 and 7, and their physical properties were evaluated.
手続補正書輸発)
昭和59年7月121
1、事件の表示
昭和59年 特許側 第120159号2、発明の名称
難燃性エポキシ樹脂組成物
3、補正をする者
事件との関係 特許出願人
住 所 東京都千代田区丸の内1−4−5名
称 (234)山陽国策バルブ株式会社〒101
英 ビル3階
5、補正の対象
補 正 の 内 容
1、明細書第8頁9行目における
[積層板関係では」の7字をl’Jll除。Procedural Amendment (Import) July 121, 1982 1. Indication of the case 1988 Patent side No. 120159 2. Name of the invention Flame retardant epoxy resin composition 3. Person making the amendment Relationship to the case Patent applicant Address: 1-4-5 Marunouchi, Chiyoda-ku, Tokyo
(234) Sanyo Kokusaku Valve Co., Ltd. 101
3rd floor, 5th floor of the British Building, Contents of the amendment 1, the 7th character ``in relation to laminates'' on page 8, line 9 of the specification was omitted by l'Jll.
2、明18書第6頁3〜4行目に 「ノボラックの」とあるを 「ノボラック型−樹脂の」と8]正。2. Mei 18, page 6, lines 3-4 It says "Novolac's" "Novolak type - resinous" and 8] Correct.
3、同頁10行目において
1−七ノマーは」と「0.3%以ト」の間に1、」を加
入。3. In line 10 of the same page, add 1,'' between ``1-7 nomer'' and ``0.3% or less''.
4、明細書第8頁1・から2行目に 「顔料難燃化剤Jとあるを 「顔料、難燃化剤」と目止。4. On page 8 of the specification, lines 1 to 2 "Pigment flame retardant J" "Pigments, flame retardants" and a seal.
5、明細書箱11頁4行目に [ミランカツブリング剤]とあるを 「シランカッ−1リング剤」と6T j[。5. Statement box page 11, line 4 It says [Milan Cutting Agent] "Silanka-1 ring agent" and 6T [.
6、同頁7〜8行目に 「シア−1D強度」とあるを 「ショアーD硬麿」と訂正。6. On the same page, lines 7-8 It says "Shear-1D strength" Corrected to "Shore D Koumaro."
7、明細書第13頁 表−2最下段左欄に「シアーU砂
度」とあるを
1シヨア一硬度」と訂正。7. On page 13 of the specification, in the bottom left column of Table 2, the phrase ``Shear U Sandness'' has been corrected to ``1 Shore 1 Hardness''.
Claims (1)
0〜15を示す。xとyは、それぞれ0〜2の整数を示
す。〕 で表わされる高純度臭素化ノボラック型樹脂と、エポキ
シ硬化促進剤を添加することを特徴とする難燃性エポキ
シ樹脂組成物。[Claims] Epoxy resin has the following general formula ▲ mathematical formula, chemical formula, table, etc. ▼ (In the formula, R represents hydrogen or a methyl group, n represents an average value of 0 to 15, x and y are each represents an integer of 0 to 2.] A flame-retardant epoxy resin composition characterized by adding a high-purity brominated novolac type resin represented by these and an epoxy curing accelerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12015984A JPS61220A (en) | 1984-06-12 | 1984-06-12 | Flame-retarding epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12015984A JPS61220A (en) | 1984-06-12 | 1984-06-12 | Flame-retarding epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61220A true JPS61220A (en) | 1986-01-06 |
Family
ID=14779411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12015984A Pending JPS61220A (en) | 1984-06-12 | 1984-06-12 | Flame-retarding epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61220A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6231959B1 (en) * | 1995-02-27 | 2001-05-15 | Matsushita Electric Works, Ltd. | Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
-
1984
- 1984-06-12 JP JP12015984A patent/JPS61220A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6231959B1 (en) * | 1995-02-27 | 2001-05-15 | Matsushita Electric Works, Ltd. | Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
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