JPS61229332A - 半導体素子製造装置 - Google Patents

半導体素子製造装置

Info

Publication number
JPS61229332A
JPS61229332A JP60069015A JP6901585A JPS61229332A JP S61229332 A JPS61229332 A JP S61229332A JP 60069015 A JP60069015 A JP 60069015A JP 6901585 A JP6901585 A JP 6901585A JP S61229332 A JPS61229332 A JP S61229332A
Authority
JP
Japan
Prior art keywords
jig
workpiece
predetermined position
predetermined
guide plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60069015A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0337858B2 (2
Inventor
Yasuo Watanabe
渡辺　泰男
Masayuki Yasu
安　正行
Masakatsu Takasu
鷹栖　征勝
Toshiaki Fukuhara
福原　俊明
Koichi Saisu
斉須　好一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Setsubi Engineering Co Ltd
Hitachi Ltd
Original Assignee
Hitachi Setsubi Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Setsubi Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Setsubi Engineering Co Ltd
Priority to JP60069015A priority Critical patent/JPS61229332A/ja
Publication of JPS61229332A publication Critical patent/JPS61229332A/ja
Publication of JPH0337858B2 publication Critical patent/JPH0337858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60069015A 1985-04-03 1985-04-03 半導体素子製造装置 Granted JPS61229332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60069015A JPS61229332A (ja) 1985-04-03 1985-04-03 半導体素子製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60069015A JPS61229332A (ja) 1985-04-03 1985-04-03 半導体素子製造装置

Publications (2)

Publication Number Publication Date
JPS61229332A true JPS61229332A (ja) 1986-10-13
JPH0337858B2 JPH0337858B2 (2) 1991-06-06

Family

ID=13390338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60069015A Granted JPS61229332A (ja) 1985-04-03 1985-04-03 半導体素子製造装置

Country Status (1)

Country Link
JP (1) JPS61229332A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104518A (ja) * 2010-11-05 2012-05-31 Sumitomo Heavy Ind Ltd 封止装置の基板受け渡し機構及び封止装置の基板受け渡し方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104518A (ja) * 2010-11-05 2012-05-31 Sumitomo Heavy Ind Ltd 封止装置の基板受け渡し機構及び封止装置の基板受け渡し方法

Also Published As

Publication number Publication date
JPH0337858B2 (2) 1991-06-06

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