JPS6123349A - Radiator - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heat sink for dissipating heat generated from semiconductor elements in various devices such as audio equipment and control equipment that use many semiconductor elements. It is related to □. [Second 11 Technology] When a semiconductor element is energized, it generates heat due to its electrical resistance. Generally, this heat makes the characteristics of the semiconductor element unstable, and if left untreated, it will eventually lead to thermal destruction of the semiconductor. Therefore, in order to remove this unnecessary heat as quickly as possible, a heat radiator consisting of a substrate on which a semiconductor element is attached and enlarged heat radiating fins such as a U-shape or a corrugated shape is required.

Conventional heatsinks are based on the coupling method between the substrate and heatsink fins (
Brazing is classified into 1) type and 2) caulking type, each of which has been put into practical use.

Fig. 18 schematically shows the radiator (1), and Fig. 19 schematically shows the radiator (2). A is a front view, B is a side view, and C in Fig. 19 is a schematic diagram. FIG. 3 is an enlarged view showing a required bonding portion of the fin i-board. In each figure, 1 is a substrate, 2 is a board, 3 is a semiconductor element, 4'' in FIG. 1C is a brazing fillet, and 5 in FIG.
□ ” To make a caulking type heatsink, emboss the substrate 1 in advance to form a protrusion 6, attach the fin 2 (drill a hole in the hole 7 C), and then insert the substrate into the hole of the fin during bonding. After inserting the protrusion 6, crush the protrusion 6 and attach the fin 2 to the substrate 1.
It is joined by caulking. Note that 8 is a recess formed by embossing.

Problems to be Solved by the Invention The conventional heatsink of the brazing type (1) has no steps in brazing the fins to the substrate, that is, degreasing, assembling, brazing, Each step of disassembly costs money,
This has the disadvantage of increasing product costs;
2) With the caulking type, since the board is embossed, it is not possible to make the board thinner, the embossing process causes distortion in the shape, and four parts are formed on the embossed side. There is a disadvantage in making the substrate surface unsuitable for use as a semiconductor mounting surface.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and provide a high-performance heatsink that can be subjected to iFJ by mechanically bonding fins to a substrate.

Means to solve problems Hereinafter, the present invention will be explained based on the drawings.

1 and 3 show an example of a heatsink according to the present invention, in which FIG. 1 is a perspective view, FIG. 2 is a plan view, and FIG. FIG.

The present invention is a heat radiator characterized by being configured as follows.

On a base plate 1 consisting of an aluminum profile formed with a protrusion 10 with a locking piece 9 extending on both sides of the top, its side plate 11 and mounting plate are provided so that the fin 2 can slide through the protrusion 10 thereon. The fin 2, which has a notch 12 integrally formed in the portion 7, is attached to the protrusion 1 of the substrate 1 at the notch 12.
0, and the installation is carried out by making surface contact with the nest plate 1 at the part a3, and by deforming the locking piece 9, the board 1
is fixed.

FIG. 4 is a perspective view showing the basic shape of the substrate 1 used in the present invention.
It is made of an extruded integral member having a thick wall portion 14 of 3 and one or more protrusions 1o.

FIG. 5 is an enlarged view of the protruding portion. Projection 1 as shown
At the top of 0, locking pieces 9 extend along both sides. This locking piece 9 is pressed down and deformed against the substrate 1 when the fin 2 is attached to the substrate 1, thereby fixing the fin 2 to the substrate 1. The optimum overall shape of the protrusion 10 with the locking piece 9 at the top is a T-shape as shown in FIGS. 4 and 5, but the shape shown in FIGS. 6 and 7 is also suitable. However, either one can be put to practical use.

The form of the substrate 1 and the arrangement of the fin bonding surfaces 15 on the substrate 1 are varied depending on the thermal design of the radiator. for example,
Many forms having a planar fin joint surface 15 including the protrusion 10 and a plurality of protrusions 10 can be adopted. For example, FIG. 8 shows a substrate in which two fin joints 15 are fixedly aligned,
FIG. 9 shows an example in which both surfaces of the substrate 1 are used as fin bonding surfaces 15, and FIG. 10 shows an example in which the width of the substrate 1 is increased and three protrusions 1o are provided for wide fins.

Next, regarding the fins, it is preferable to use fins with enlarged side plates 11, such as U-shaped or full-gate fins, so that the fins can combine with the substrate and exhibit a high heat dissipation effect.
It is molded from a commercially available aluminum plate of A5052. A plate thickness of 0.1 to 3nIIIl is practical, but a thickness of about 0.3 to 2.0mm is optimal in terms of workability and cost. FIG. 11 shows an example of a U-shaped fin in a developed view, and the illustrated form is the original plate of the U-shaped fin. FIG. 12 is a perspective view of a U-shaped fin formed from this original plate.

As shown in FIGS. 11 and 12, the fin is provided with a notch 12 for inserting the fin into the protrusion 1o on the substrate 1. As shown in FIGS. Then, tongue pieces 16 are provided on both sides of the portion in contact with this notch 12.

Such U-shaped fins are produced by, for example, as shown in FIG.
Then, the fin original plate 21 is cut out by the cutting machine 20, and the original plate 21 is cut out by the next press culm as shown in FIG. 11.
, it is easy to manufacture by bending along the B-B line. 22 is a mold for making the notches.

Note that the shapes of the fins are diverse, for example, the first
Irregularly shaped fins such as those with steps as shown in Figure 4 can also be used.

To connect the U-shaped fin 2 and the substrate 1 described above,
The protrusion 10 of the substrate 1 is inserted into the notch 12 of the fin 2, and the tongue piece 16 is placed along the notch 12 of the fin 2.
slide the mounting part 7 of the fin 2 onto the board from the end of the board 1 so that the fin 2 is placed under the locking piece 9 of the protrusion 10, and place the fin 2 in the predetermined position on the board 1. It is inserted into the notch 12. Thereafter, as shown in FIG. 15, the locking piece 9 is pressed (pushed and deformed) against the tongue piece 16 using the crimping jig 23 of a press machine, and the fin 2 is pressed onto the tongue piece 16 to attach the fin 2 to the substrate 1.
Fixed to.

Note that 24 is a press stand.

The state of the locking pieces 9 of the protrusions 10 in the radiator thus jqed is shown in FIGS. 2 and 3. FIG. 2 shows a plane particle in which the portion of the protrusion 10 of the substrate 1 corresponding to the valley of the U-shaped fin is deformed.

FIG. 16 schematically shows an example of an apparatus for successively crimping U-shaped fins 2 onto a long substrate 1. This apparatus is equipped with three press machines 24 to increase the efficiency of the crimping process.
A series of crimping jigs 23 are crimped, so that three U-shaped fins 2 can be crimped at the same time. 25
is the feed roller.

Note that the arrangement positions of the fins on the substrate can be freely set, and the pitch of the fin rows can be changed on the substrate as shown in FIG. 17 depending on the purpose of the heat sink.

As mentioned above, the method for crimping the fins onto the substrate is the first method.
As shown in FIGS. 5 and 16, the crimping jig 23 is crimped downward in the direction iJ with the fin joint 15 of the substrate 1 facing upward, but the fin joint 15 is facing downward. It is also possible to perform crimping by holding the substrate 1 inverted so that the crimping jig 23 is operated upward from below the substrate 1. In this case, since the fins 2 are supported by the locking pieces 9 of the substrate 1, a special temporary fixing jig for preventing the fins 2 from falling is not required.

The dimensional relationship of each part of the example board and fins is as follows:
It is as follows.

Substrate (Fig. 5) a: 2-10ml al: 1-4mm a2: 1-8mm -〇- f: o, 5-3mm g: 1-2m... h=f 10g s: 2-10mm Fin (Fig. 11, Fig. 12) [:0.3~21I1m W:20~200ml1 1-1 + 20~100mlID:3~
20mm b, c, d, e, k: Fin notch dimensions b:
a+(0,5~2)=c+2ee:
0,5~3 nun k: h+(1~2)mm L=280d d<[) Next, width (W): 5011m, length 1-): 100mm
Ill: Thickness S): 3uun substrate, width (W): 5
0IllI11 Height H): 40mm, Plate thickness (
T) : A heatsink made by combining seven U-shaped fins of 0.5II1m according to the present invention and a heatsink also made by brazing numbers and k-10- fasteners has an effective output of 40.
A W semiconductor element was attached to each of the heat sinks, and the thermal resistance values of the heat sinks were measured.

The results were as follows. The smaller the thermal resistance value R, the better the heat dissipation performance. In other words, it exhibits excellent performance equivalent to a brazed frame in which the substrate and fins are metallurgically joined.
This is superior to the caulking type shown in Fig. 19, which has been in practical use for some time.

1. The heat dissipation performance of the heat sink according to the present invention is better than that of the caulking type heat sink, and the brazing is comparable to that of the type heat sink.

2. Since both the substrate and the fins in the present invention can have a variety of shapes and structures, there is a great degree of freedom in designing the heat sink.

3. The substrate according to the present invention can be made thinner and does not suffer from distortion due to processing.

4. The heat radiator according to the present invention is more easily mass-produced than the conventional brazing type and caulking type, and the cost can be reduced.

[Brief explanation of the drawing]

1 to 3 are diagrams showing an example of an integrated heat sink according to the present invention, in which FIG. 1 is a perspective view, FIG. 2 is a plan view, and FIG. 3 is a line x-X in FIG. 2. 4 is a perspective view showing an example of the substrate according to the present invention, FIG. 5 is an enlarged sectional view of the protrusion shown in FIG. 4, and FIG. 6 is a sectional view of the protrusion according to the present invention. 7 is a sectional view showing another modification, FIG. 8 is a front view showing a modification of the board, and FIG. 9 is a front view showing another modification of the board. FIG. 10 is a front view showing a substrate for wide fins, FIG. 11 is a developed view of the U-shaped fin according to the present invention, FIG. 12 is a perspective view of the U-shaped fin, and FIG. 13 is a perspective view of the U-shaped fin. A schematic diagram illustrating the manufacturing process, FIG. 14 is a perspective view showing a modified example of the T-16 fin according to the present invention, and FIG. 15 is a diagram showing how the locking piece of the board is crimped onto the fin in order to assemble the heat sink according to the present invention. FIG. 16 is a schematic diagram showing a device for successively crimping a large number of fins onto a long substrate. FIG. 17 is a front view showing a modified example of the heat sink according to the present invention. Figure 18 is a diagram showing a conventional brazing type heat radiator, in which A is a front view and B is a side view, and Figure 19 is a diagram showing a conventional caulking type heat radiator, in which A is a front view and B is a side view. C is a side view, and C is a partially enlarged front view.・ 1... Board, 2... Fin, 3... Semiconductor element, l... Fin mounting part, 9... Locking piece, 1
0...Protrusion, 11...Side plate of fin, 12...Notch□1.13...Semiconductor element mounting surface, 14
..., thick part of M plate, 15... fin joint surface, 16
... tongue piece, 11 ... continuous press machine, 20 ... cutting machine, 21 ... fin original plate, 23 ... crimping jig and tool. Par-13"- Figure 16

Claims (1)

[Claims] (1) A substrate consisting of an aluminum profile formed with a protrusion with locking pieces extending along both sides of the top, with cutouts in its side plates and mounting area so that the fin can slide through the protrusion. The integrally formed fin is inserted into the protrusion of the board at the notch, is brought into surface contact with the board at the attachment part, and is fixed to the board by deforming the locking piece. radiator.