JPS61251U - electronic components - Google Patents

electronic components

Info

Publication number
JPS61251U
JPS61251U JP8453384U JP8453384U JPS61251U JP S61251 U JPS61251 U JP S61251U JP 8453384 U JP8453384 U JP 8453384U JP 8453384 U JP8453384 U JP 8453384U JP S61251 U JPS61251 U JP S61251U
Authority
JP
Japan
Prior art keywords
electronic components
leads
electronic component
package body
wide part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8453384U
Other languages
Japanese (ja)
Inventor
精一 影山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP8453384U priority Critical patent/JPS61251U/en
Publication of JPS61251U publication Critical patent/JPS61251U/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の部分斜視図、第２図は従来
の電子部品の斜視図、第３図は本考案の電子部品の使用
状態を示す正面図、第４図は第３図におけるリード部分
を示す拡大部分肩視図である。 ４・・・・・・電子部品、５・・・・・・リード、６・
・・・・・パッケージ本体、７・・・・・・透孔。Figure 1 is a partial perspective view of an embodiment of the present invention, Figure 2 is a perspective view of a conventional electronic component, Figure 3 is a front view showing the electronic component of the present invention in use, and Figure 4 is a third FIG. 3 is an enlarged partial shoulder view showing the lead portion in the figure. 4...Electronic parts, 5...Leads, 6.
...Package body, 7...Through hole.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）パッケージ本体から突出する複数本のリードを備
えた電子部品において、前記リードに他の電子部品のリ
ードを挿入可能な透孔を設けてなることを特徴とする電
子部品。(1) An electronic component comprising a plurality of leads protruding from a package body, characterized in that the leads are provided with through holes into which leads of other electronic components can be inserted. （２）リードはパッケージ本体から水平方向に伸びる幅
広部を有し、透孔はほこの幅広部に形成されている実用
新案登録請求の範囲第１項記載の電子部品。(2) The electronic component according to claim 1, wherein the lead has a wide part extending horizontally from the package body, and the through hole is formed in the wide part.
JP8453384U 1984-06-07 1984-06-07 electronic components Pending JPS61251U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8453384U JPS61251U (en) 1984-06-07 1984-06-07 electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8453384U JPS61251U (en) 1984-06-07 1984-06-07 electronic components

Publications (1)

Publication Number Publication Date
JPS61251U true JPS61251U (en) 1986-01-06

Family

ID=30634130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8453384U Pending JPS61251U (en) 1984-06-07 1984-06-07 electronic components

Country Status (1)

Country Link
JP (1) JPS61251U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219909B1 (en) 1990-11-28 2001-04-24 Hitachi, Ltd. Method of mounting disk drive apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512440U (en) * 1978-07-10 1980-01-26
JPS58158955A (en) * 1982-03-16 1983-09-21 Toshiba Corp Semiconductor integrated circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512440U (en) * 1978-07-10 1980-01-26
JPS58158955A (en) * 1982-03-16 1983-09-21 Toshiba Corp Semiconductor integrated circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219909B1 (en) 1990-11-28 2001-04-24 Hitachi, Ltd. Method of mounting disk drive apparatus
US6856482B2 (en) 1990-11-28 2005-02-15 Hitachi, Ltd. Disk drive apparatus and method of mounting same
US7227712B2 (en) 1990-11-28 2007-06-05 Hitachi Global Storage Technologies Japan, Ltd. Disk drive apparatus and method of mounting same

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