JPS61261012A - 積層板の製造方法及びその装置 - Google Patents

積層板の製造方法及びその装置

Info

Publication number
JPS61261012A
JPS61261012A JP60103213A JP10321385A JPS61261012A JP S61261012 A JPS61261012 A JP S61261012A JP 60103213 A JP60103213 A JP 60103213A JP 10321385 A JP10321385 A JP 10321385A JP S61261012 A JPS61261012 A JP S61261012A
Authority
JP
Japan
Prior art keywords
films
film
prepregs
prepreg
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60103213A
Other languages
English (en)
Japanese (ja)
Other versions
JPH034017B2 (da
Inventor
Toshiyuki Akamatsu
資幸 赤松
Yasufumi Fukumoto
福本　恭文
Kenji Iwata
憲治 岩田
Koji Sato
光司 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP60103213A priority Critical patent/JPS61261012A/ja
Publication of JPS61261012A publication Critical patent/JPS61261012A/ja
Publication of JPH034017B2 publication Critical patent/JPH034017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP60103213A 1985-05-15 1985-05-15 積層板の製造方法及びその装置 Granted JPS61261012A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60103213A JPS61261012A (ja) 1985-05-15 1985-05-15 積層板の製造方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60103213A JPS61261012A (ja) 1985-05-15 1985-05-15 積層板の製造方法及びその装置

Publications (2)

Publication Number Publication Date
JPS61261012A true JPS61261012A (ja) 1986-11-19
JPH034017B2 JPH034017B2 (da) 1991-01-22

Family

ID=14348224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60103213A Granted JPS61261012A (ja) 1985-05-15 1985-05-15 積層板の製造方法及びその装置

Country Status (1)

Country Link
JP (1) JPS61261012A (da)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2676780A1 (de) * 2012-06-18 2013-12-25 Technische Universität Dresden Schichtförmiges Halbzeug sowie Verfahren zu dessen Herstellung
EP3513958A3 (en) * 2014-06-16 2019-10-23 SABIC Global Technologies B.V. Method of making a laminate and a forming tool
US11008050B2 (en) 2016-12-30 2021-05-18 Sabic Global Technologies B.V. Hybrid structures and methods of making the same
JP2022080156A (ja) * 2020-11-17 2022-05-27 プライムプラネットエナジー＆ソリューションズ株式会社 電極板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312964A (en) * 1976-07-22 1978-02-06 Mitsubishi Rayon Co Method of formation of composite material and formed product thereof
JPS55146710A (en) * 1979-03-30 1980-11-15 Storey Brothers & Co Method of molding molding structure
JPS5651325A (en) * 1979-10-02 1981-05-08 Mitsubishi Rayon Co Ltd Formation of fiber-reinforced plastic

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312964A (en) * 1976-07-22 1978-02-06 Mitsubishi Rayon Co Method of formation of composite material and formed product thereof
JPS55146710A (en) * 1979-03-30 1980-11-15 Storey Brothers & Co Method of molding molding structure
JPS5651325A (en) * 1979-10-02 1981-05-08 Mitsubishi Rayon Co Ltd Formation of fiber-reinforced plastic

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2676780A1 (de) * 2012-06-18 2013-12-25 Technische Universität Dresden Schichtförmiges Halbzeug sowie Verfahren zu dessen Herstellung
WO2013189886A1 (de) * 2012-06-18 2013-12-27 Technische Universität Dresden Schichtförmiges halbzeug sowie verfahren zu dessen herstellung
CN104540654A (zh) * 2012-06-18 2015-04-22 德累斯顿工业技术大学 层状半成品及其生产方法
JP2015525156A (ja) * 2012-06-18 2015-09-03 ティッセンクルップ スチール ヨーロッパ アーゲーＴｈｙｓｓｅｎｋｒｕｐｐ Ｓｔｅｅｌ Ｅｕｒｏｐｅ Ａｇ 層形状の半製品およびその製造のための方法
US9701094B2 (en) 2012-06-18 2017-07-11 Technische Universität Dresden Layered semi-finished product and method for producing it
EP3513958A3 (en) * 2014-06-16 2019-10-23 SABIC Global Technologies B.V. Method of making a laminate and a forming tool
US11603142B2 (en) 2014-06-16 2023-03-14 Sabic Global Technologies B.V. Structural body of a vehicle having an energy absorbing device and a method of forming the energy absorbing device
US12384469B2 (en) 2014-06-16 2025-08-12 Sabic Global Technologies B.V. Method of making a laminate, an energy absorbing device, an energy absorbing device composition, and a forming tool
US11008050B2 (en) 2016-12-30 2021-05-18 Sabic Global Technologies B.V. Hybrid structures and methods of making the same
JP2022080156A (ja) * 2020-11-17 2022-05-27 プライムプラネットエナジー＆ソリューションズ株式会社 電極板の製造方法

Also Published As

Publication number Publication date
JPH034017B2 (da) 1991-01-22

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