JPS6126467B2 - - Google Patents
Info
- Publication number
- JPS6126467B2 JPS6126467B2 JP11433078A JP11433078A JPS6126467B2 JP S6126467 B2 JPS6126467 B2 JP S6126467B2 JP 11433078 A JP11433078 A JP 11433078A JP 11433078 A JP11433078 A JP 11433078A JP S6126467 B2 JPS6126467 B2 JP S6126467B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- workpiece
- cutting
- cut
- load
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004260 weight control Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 2
- 239000013078 crystal Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】
この発明はワイヤを用いた切断装置に係り、特
に加工物面に加えるワイヤの加重を切断面の形状
に応じて制御するようにした切断装置に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cutting device using a wire, and more particularly to a cutting device in which the load of the wire applied to the surface of a workpiece is controlled in accordance with the shape of the cut surface.
従来例えばLiTaO3等の単結晶材を薄板状に切
断するものとしてワイヤを用いた所謂ワイヤ切断
装置が使用されている。すなわち、かかるワイヤ
切断装置は所定の支持部材の間に張設されたワイ
ヤを単結晶材等の加工物面に所定の加重をもつて
当接し、この状態でワイヤを往復動させることに
より加工物を切断するようにしたものである。 Conventionally, a so-called wire cutting device using a wire has been used to cut a single crystal material such as LiTaO 3 into thin plates. In other words, such a wire cutting device brings a wire stretched between predetermined support members into contact with the surface of a workpiece such as a single crystal material with a predetermined load, and reciprocates the wire in this state to cut the workpiece. It is designed to cut.
ところが、一般にこの種の切断装置では加工物
面に加えるワイヤ加重を一定にしているので仮に
加工物の切断面形状がワイヤの切込深さに従つて
変わるような場合にはこれに応じて切断速度が変
化してしまい、切断能率が低下するばかりでなく
LiTaO3等の単結晶材を薄板にするような場合薄
板の加工精度が低下する欠点があつた。 However, in general, this type of cutting device keeps the wire load applied to the workpiece surface constant, so if the shape of the cut surface of the workpiece changes depending on the cutting depth of the wire, the cutting will be performed accordingly. Not only will the speed change, cutting efficiency will decrease.
When making a single crystal material such as LiTaO 3 into a thin plate, there was a drawback that the processing accuracy of the thin plate decreased.
この発明は上記欠点を除去するためなされたも
ので、加工物面に加えるワイヤ加重を加工物の切
断単位面積当り一定になるよう制御することによ
り切断加工精度の向上および切断能率の向上を図
ることができる切断装置を提供することを目的と
する。 This invention was made to eliminate the above-mentioned drawbacks, and aims to improve cutting accuracy and cutting efficiency by controlling the wire load applied to the surface of the workpiece to be constant per unit area of workpiece cut. The purpose is to provide a cutting device that can.
以下、この発明の一実施例を図に従い説明す
る。図において、１，２，３はワイヤ支持部材例
えば多溝滑車で、これら滑車１，２，３は所定の
間隔をおいて図示のように三角点上に配置する。
そして、これら滑車１，２，３の間にエンドレス
のワイヤ４を複数本並列に巻装する。 An embodiment of the present invention will be described below with reference to the drawings. In the figure, reference numerals 1, 2, and 3 are wire support members, such as multi-groove pulleys, and these pulleys 1, 2, and 3 are arranged at a predetermined interval on a triangular point as shown in the figure.
A plurality of endless wires 4 are wound in parallel between these pulleys 1, 2, and 3.
また、上記滑車１は図示しない電動機の出力軸
に連結し回転駆動可能にし、他の滑車２，３をワ
イヤ４の摩擦抵抗により従動するようにしてい
る。この場合滑車１の回転駆動方向は図示矢印方
向に頻繁に切換えられワイヤ４を往復動させるよ
うにしている。 The pulley 1 is connected to the output shaft of an electric motor (not shown) so that it can be rotated, and the other pulleys 2 and 3 are driven by the frictional resistance of the wire 4. In this case, the rotational driving direction of the pulley 1 is frequently switched in the direction of the arrow shown in the figure to cause the wire 4 to reciprocate.
ワイヤ４に当接して例えばSi、LiNbO3、
LiTaO3、水晶、セラミツク等の加工物５を配置
する。この加工物５は取付台６に接着剤等で固着
している。 In contact with the wire 4, for example, Si, LiNbO 3 ,
A workpiece 5 such as LiTaO 3 , crystal, ceramic, etc. is placed. This workpiece 5 is fixed to a mounting base 6 with adhesive or the like.
取付台６には加重印加用ワイヤ７の一端を接続
している。このワイヤ７は取付台６の位置を制御
し加工物５へのワイヤ４の当接圧力つまりワイヤ
加重を制御するものである。またワイヤ７の他端
は加重制御装置８に接続している。 One end of a load applying wire 7 is connected to the mounting base 6. This wire 7 controls the position of the mount 6 and the contact pressure of the wire 4 against the workpiece 5, that is, the wire load. The other end of the wire 7 is connected to a weight control device 8.
この制御装置８は主制御回路８１、増巾器８２
および加重発生装置例えば電磁装置８３より構成
している。このうち主制御回路８１は上記加工物
５の切断面形状をワイヤ４の切込み深さに対応し
て検出するもので、この検出値に応じて加工物５
の単位切断面積当りのワイヤ加重を一定にするよ
うな出力を発生するようにしている。 This control device 8 includes a main control circuit 81 and an amplifier 82.
and a load generating device, for example, an electromagnetic device 83. Among these, the main control circuit 81 detects the shape of the cut surface of the workpiece 5 in accordance with the depth of cut of the wire 4, and the main control circuit 81 detects the shape of the cut surface of the workpiece 5 in accordance with the depth of cut of the wire 4.
It is designed to generate an output that makes the wire load per unit cutting area constant.
この場合、主制御回路８１は加工物５の切断面
形状を予め記憶しておき、ワイヤ４の切込み深さ
に応じて上記記憶内容を順次読み出し上述と同様
加工物５の単位切断面積当りのワイヤ加重を一定
にするような出力を発生するものでもよい。 In this case, the main control circuit 81 stores the shape of the cut surface of the workpiece 5 in advance, and sequentially reads out the memory contents according to the cutting depth of the wire 4. It may also be possible to generate an output that makes the weight constant.
そして主制御回路８１の出力を増巾器８２を介
して電磁装置８３に与える。この電磁装置８３は
上記主制御回路８１の出力に応じた電磁吸引力を
発生するもので、この吸引力をもつて上記加重印
加用ワイヤ７を引張駆動し加工物５へのワイヤ加
重を加工物５の切断単位面積当り一定になるよう
にしている。 The output of the main control circuit 81 is then applied to an electromagnetic device 83 via an amplifier 82. This electromagnetic device 83 generates an electromagnetic attraction force according to the output of the main control circuit 81, and uses this attraction force to pull and drive the load application wire 7 to apply a wire load to the workpiece 5. It is made to be constant per cutting unit area of 5.
尚、図中９はスラリー（砂粒と切削液を混合し
たもの）を供給する装置である。 Note that 9 in the figure is a device that supplies slurry (a mixture of sand grains and cutting fluid).
次に以上のように構成した装置の作用を述べ
る。いま取付台６上に固着された加工物５をワイ
ヤ４に当接し、この状態で滑車１，２，３を駆動
し、ワイヤ４を往復動作すると、上記ワイヤ４に
よる加工物５の切断が開始される。 Next, the operation of the apparatus constructed as above will be described. The workpiece 5 now fixed on the mounting base 6 is brought into contact with the wire 4, and in this state, the pulleys 1, 2, and 3 are driven to move the wire 4 back and forth, and the wire 4 starts cutting the workpiece 5. be done.
加工物５の切断が始まると主制御回路８１は上
記ワイヤ４の切断深さに対応した加工物５の切断
面形状を検出し、この検出値に応じた出力を発生
する。従つてこの出力が増巾器８２を介して電磁
装置８３に与えられるとこの出力に応じた電磁吸
引力が発生し、この吸引力をもつて加重印加用ワ
イヤ７が引張駆動される。これにより取付台６の
位置が制御され加工物５へのワイヤ４の当接圧力
つまりワイヤ加重が制御されこの状態で切断が行
なわれる。この場合上記ワイヤ７を駆動する電磁
装置８３の電磁力は主制御回路８１の出力つまり
加工物５の単位切断面積当りのワイヤ加重を一定
にするような出力により決定される。従つて加工
物５の切断面形状が切断の進行とともに変わる場
合もワイヤ７により制御される加工物５へのワイ
ヤ加重は加工物５の切断単位面積当り常に一定に
制御されることになる。 When cutting of the workpiece 5 starts, the main control circuit 81 detects the shape of the cut surface of the workpiece 5 corresponding to the cutting depth of the wire 4, and generates an output according to this detected value. Therefore, when this output is applied to the electromagnetic device 83 via the amplifier 82, an electromagnetic attraction force corresponding to this output is generated, and the load application wire 7 is driven in tension by this attraction force. As a result, the position of the mount 6 is controlled, and the contact pressure of the wire 4 against the workpiece 5, that is, the wire load, is controlled, and cutting is performed in this state. In this case, the electromagnetic force of the electromagnetic device 83 that drives the wire 7 is determined by the output of the main control circuit 81, that is, the output that makes the wire load per unit cutting area of the workpiece 5 constant. Therefore, even if the shape of the cut surface of the workpiece 5 changes as cutting progresses, the wire load on the workpiece 5 controlled by the wire 7 is always controlled to be constant per unit area of the workpiece 5 cut.
従つて、このような構成によれば加工物の切断
面形状がワイヤの切込深さに従つて変わるような
場合でも切断速度を略一定にすることができる。
これにより切断作業を効率よく行なうことがで
き、切断能率の向上を図ることができしかも加工
物の切断面を良好に仕上げることができ加工精度
の向上を図ることもできる。また、切断速度を一
定にできることはワイヤ断線等の事故防止策とし
ても充分の効果が期待でき、しかも同一形状の加
工物にあつては切断所要時間のバラツキを小さく
できることから量産品の切断加工には極めて効果
的である。 Therefore, with such a configuration, the cutting speed can be kept substantially constant even when the shape of the cut surface of the workpiece changes depending on the cutting depth of the wire.
As a result, the cutting work can be performed efficiently, cutting efficiency can be improved, and the cut surface of the workpiece can be finished well, so that the machining accuracy can be improved. In addition, being able to keep the cutting speed constant can be expected to have a sufficient effect as a measure to prevent accidents such as wire breakage.Furthermore, it is possible to reduce the variation in cutting time for workpieces of the same shape, making it suitable for cutting mass-produced products. is extremely effective.
尚この発明は上記実施例にのみ限定されず要旨
を変更しない範囲で適宜変形して実施できる。例
えば上述した実施例では加工物５を固着した取付
台６の位置を移動することによりワイヤ加重を制
御するようにしたが、加工物５側を固定しワイヤ
４側を移動してワイヤ加重を制御するようにして
もよい。また、上述した実施例では取付台６を加
重印加用ワイヤ７を介して駆動するようにした
が、取付台６を直接駆動するようにしてもよい。
更に取付台６の駆動源として電磁装置を用いた
が、これも他の他の方式例えばトルクモータ、機
械的摩擦力、空気圧液体圧等の力を利用したもの
に置代えることもできる。 It should be noted that the present invention is not limited to the above-mentioned embodiments, but can be implemented with appropriate modifications without changing the gist. For example, in the embodiment described above, the wire load was controlled by moving the position of the mounting base 6 to which the workpiece 5 was fixed, but the wire load was controlled by fixing the workpiece 5 side and moving the wire 4 side. You may also do so. Further, in the above embodiment, the mounting base 6 is driven via the load applying wire 7, but the mounting base 6 may be driven directly.
Further, although an electromagnetic device is used as a drive source for the mounting base 6, this can also be replaced by other methods such as a torque motor, mechanical friction force, pneumatic liquid pressure, or other force.
以上述べたようにこの発明によれば加工物の切
断部に加えるワイヤ加重を加工物の切断単位面積
当り一定になるよう制御することにより切断加工
精度および切断能率の向上を図ることができる切
断装置を提供できる。 As described above, according to the present invention, the cutting device is capable of improving cutting accuracy and cutting efficiency by controlling the wire load applied to the cutting part of the workpiece so that it is constant per unit area of the workpiece. can be provided.
図はこの発明の一実施例を示す概略構成図であ
る。
１，２，３……多溝滑車、４……ワイヤ、５…
…加工物、６……取付台、７……加重印加用ワイ
ヤ、８……加重制御装置、８１……主制御回路、
８２……増巾器、８３……電磁装置、９……スラ
リー供給装置。
The figure is a schematic configuration diagram showing an embodiment of the present invention. 1, 2, 3...Multi-groove pulley, 4...Wire, 5...
... Workpiece, 6 ... Mounting base, 7 ... Load application wire, 8 ... Weight control device, 81 ... Main control circuit,
82... Multiplier, 83... Electromagnetic device, 9... Slurry supply device.
Claims (1)
所定加重をもつて当接させ、この状態で上記ワイ
ヤを往復動させることにより加工物を切断するよ
うにしたものにおいて、上記ワイヤの切込み深さ
に対応した加工物の切断面形状を検出する検出手
段と、この検出手段からの情報に応じて前記ワイ
ヤに加わる加重を加工物の切断単位面積当り一定
になるように制御する加重制御手段とを具備した
ことを特徴とする切断装置。1. A wire stretched between supporting members is brought into contact with the workpiece surface with a predetermined load, and the workpiece is cut by reciprocating the wire in this state, in which the cut of the wire a detection means for detecting the shape of the cut surface of the workpiece corresponding to the depth; and a weight control means for controlling the load applied to the wire to be constant per unit area of the workpiece cut according to information from the detection means. A cutting device characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11433078A JPS5542736A (en) | 1978-09-18 | 1978-09-18 | Cutter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11433078A JPS5542736A (en) | 1978-09-18 | 1978-09-18 | Cutter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5542736A JPS5542736A (en) | 1980-03-26 |
| JPS6126467B2 true JPS6126467B2 (en) | 1986-06-20 |
Family
ID=14635107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11433078A Granted JPS5542736A (en) | 1978-09-18 | 1978-09-18 | Cutter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5542736A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63123267U (en) * | 1987-02-05 | 1988-08-10 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5741118A (en) * | 1980-08-22 | 1982-03-08 | Sumitomo Electric Ind Ltd | Cutting of work |
| JPH0419754U (en) * | 1990-06-11 | 1992-02-19 |
-
1978
- 1978-09-18 JP JP11433078A patent/JPS5542736A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63123267U (en) * | 1987-02-05 | 1988-08-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5542736A (en) | 1980-03-26 |
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