JPS61267656A - Pushing up and absorbing device for electron parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a device for pushing up and sucking electronic components.

Conventional technology In recent years, many devices have been proposed for automatically mounting electronic components onto printed circuit boards, and many electronic component supply methods have also been proposed.
It has become necessary to provide reliable and quick supply. Conventionally, electronic components of the Weno type, in which a sheet is stretched in the shape of a disk and electronic components are attached to the top, were sucked and supplied using vacuum pressure by the nozzle of the transfer device, but only vacuum pressure was used. Because the suction power was low, it was not possible to reliably suction electronic components, and suction errors were frequent. Therefore, in the conventional configuration, a single needle-like pin is pushed up from the bottom of the sheet, and supply is performed by a push-up device (hereinafter abbreviated as ejector) that peels off and lifts electronic components in synchronization with the nozzle.

Problems to be Solved by the Invention However, in recent years, there has been an increase in the number of sizes of electronic parts that can be shaped, and there has been a demand for an automatic electronic parts mounting apparatus that can mix and load many types of electronic parts.

Conventional dedicated equipment can handle a wide variety of electronic component shapes,
In addition, the ejector cannot accommodate the shape and size of the electronic component, and if only one ejector is used to push up the electronic component, the electronic component may become unstable and fall out of the nozzle, resulting in scratches, cracks, or chips. This made it impossible to supply a wide variety of electronic components.

Furthermore, since the lifting drives of the nozzle and the push-up pin are independent, there has been a problem in that it is difficult to adjust the raising of the nozzle and the push-up pin in synchronization.

Therefore, the present invention aims to make it possible to reliably pick up electronic components of various shapes and sizes.

Means for solving the problems and the technical means of the present invention for solving the above problems are:
The ejector is provided with a plurality of push-up pins and a drive device that drives the vertical movement of the transfer device and the up-and-down movement of the push-up bin.

For production The effect of this technical means is as follows.

That is, the transfer device and the push-up bins are moved up and down synchronously by the drive device, and the electronic components are pushed up by the plurality of push-up bins.

Embodiment FIG. 1 shows a part of an electronic component automatic mounting apparatus of this embodiment, FIG. 2 shows an ejector, and FIG. 3.

FIG. 4 shows the details of the push-up pin, FIG. 6 shows the relationship between the electronic component and the push-up pin, FIG. 6 shows the drive system, and FIG. 7 shows the entire electronic component automatic mounting device. 7th
A detailed explanation will be given along the flow of the printed circuit board 6 in the figure. A board stock 4 for stocking the printed circuit boards 6, a lifter device (loader) 3, an extrusion device 2 for pushing out and supplying the printed circuit boards 6, and a conveyor 6 are provided on the left side, and in the center, there is a board stock 4 for stocking the printed circuit boards 6, and a conveyor 6 for moving the printed circuit boards back and forth and left and right. Board holder 7
The printed circuit board 6 is positioned, and the electronic component 11
is positioned, transferred, and mounted on the printed circuit board 5, and the mounting process will be described later. The printed circuit board 6 on which the electronic component 11 is mounted is transported between the unloading guide rail 17 and the unloading device 1.
6 into the substrate stock 4 held by the lifter device 14 (unloader). In FIG. 1, an electronic component supply device 9 to which an indexing device 12 is fixed is provided on the X-Y table 10 in the center front, and the indexing device 121C is mounted and fixed with screws 22, and several types of electronic components 11 is installed. An ejector 23 is provided at the bottom thereof. In FIG. 2, the ejector 23 is driven by a rod 10 from a drive device which will be described later.
7 operates in one direction, and the ball joint 88. Shaft 92° Arm 93 swinging in the N direction. Ball joint 88, rod 91. An arm 85 with a ball joint 88 swinging in the L direction. The push-up shaft 83 or 84 moves up and down via the shaft 86. The shaft 8
3 or 84 is provided with one push-up pin 24a and four push-up pins 24b, as shown in FIG.

The shaft 83 or 84 is connected to the block 94 and the block 8.
1 and is urged downward by elastic bodies 100 and 101. A slide rail 89 and a cylinder 87 are provided to switch the push-up pins 24a and 24b.
The entire structure slides using a slide rail 96 fixed to a block 96 and a cylinder 99. An electronic component positioning device (hereinafter referred to as precenter) 13 is provided behind the ejector 23, and a substrate holder is placed on an X-Y table having a motor 26 for driving the X axis and a motor 26 for driving the Y axis behind it. 7 is provided to move in direction B. Furthermore, an adhesive supply device (hereinafter abbreviated as an epoxy unit) 27 is provided behind it, and the adhesive is injected into the groove of the groove ring 29 and the motor 2
It is rotated by 8. Each of the above devices is arranged in a straight line at equal intervals, and above the devices are transfer heads 40a and 40b arranged in a straight line at equal intervals.

40c moves in the E direction and transfers the electronic component 11 or adhesive. Next, the configuration for driving each device will be explained. The drive motor 103 drives the cam drive device 104, and the arm 108 rotates in the N direction (arrow) using the shaft 109 as a fulcrum through the rod 105 and the ball joint 88, and the arm 108 rotates in the N direction (arrow) through the ball joint 88 and the rod 110. Transfer head 4 attached to 44a and 44b
0a.

40b and 40G move in the E direction as described above.

Further, the rod 106 operates in the M direction (arrow), the shaft 33 rotates from the arm 66 via the ball joint 88, and the arm 36 and plate 36 swing downward (arrow), causing the transfer head 40a to move. ,40b,4
0cO/Zuru 73°74.75 performs vertical movement in the H direction. Also, by operating the rod 107 from the cam drive device 104, the ejector 23 is pushed up by the pin 2.
4a or 24b is pushed up.

The electronic components 11 of the electronic component supply device 9 are pasted on a sheet 102, arbitrarily sorted, and moved to a predetermined position on the X-Y table 1o.
Move in direction B (arrow) and stop. The cylinder 99 of the ejector 23 operates, and as described above, the entire ejector 23 is raised downward (indicated by the arrow) along the slide rail 96 by the block 97 via the shaft 98, and the ring 7 at the tip of the ejector 23 is moved to the seat 1o2. contact and stop. In the case of the selected small electronic component 11a, the nozzle 73a of the transfer head 40a is moved downward in the H direction (arrow) by the cam drive device 104 to adsorb the electronic component 11a. As the nozzle 73a rises, the rod 107 is pulled in one direction by the cam drive device 104 as before, so that the rod 107 is pulled in one direction via the ball joint 88 and the arm 93.
The arm 86 is swung in the L direction by the ball joint 88, the Shirorad 91, and the ball joint 88. The arm 86 is switched to the protruding pin shaft 84 along the system slide rail 89 by the cylinder 87, and the shaft 84 rises in the direction C (arrow) against the elastic body 100, and moves upward in the direction A or A in FIG. Nozzle 7 as shown in Figure 6 A.
3a and the push-up pin 24a, the sheet moves upward in the H direction, is peeled off from the sheet 1o2, and is supplied. Further, the nozzle 73b descends in the H direction to suck the large electronic component 11b, and the cylinder 87 moves the large electronic component 11b upward in the C direction (arrow) against the elastic body 101 of the pin shaft 83 in the same manner as above. , if the electronic component 11 is large as shown in FIG. 3 or FIG. 6, four push-up pins 24 a -
d ensures stable supply. When the cam drive device further operates, the rod 107 is pushed and the elastic body 1oO
Or, by 1o1, the push-up bins 24a and 24b are lowered.
Then, the next electronic component 11 is supplied. The electronic component 11 thus supplied is set at an angle by the transfer head 40a, and then transferred to the precenter 13 and positioned. Further, the positioned electronic component 11 is placed at a predetermined position on the printed circuit board 6 positioned at the board holder 7 by the transfer head 40b. Further, adhesive is applied to a predetermined position of the printed circuit board 6 from the rear epoxy unit 27 and the transfer head 40c. By repeating the above operations, the electronic component 11 is mounted on the printed circuit board 6.

As described above, push-up pins 24 dedicated to large and small sizes are provided so that one push-up pin operates when the electronic component 11 is small, and four push-up pins operate when the electronic component 11 is large. It is possible to stably push up various types of electronic components 11 regardless of shape and size.
Further, since the vertical movement of the transfer head 40a and the vertical movement of the ejector pin are linked by the cam drive device 104, the electronic components 11 can be smoothly supplied.

Effects of the Invention As described above, the present invention provides the ejector with a plurality of push-up bins that can be matched to the size and shape of the electronic components, thereby stably and easily pushing up the electronic components, and also allows the nozzles of the transfer head to be moved up and down. The engine and ejector turbine are linked and rise in synchronization, so electronic parts are not chipped or damaged.
It is possible to realize an electronic component push-up suction device that can push up electronic components reliably, stably, and quickly.

[Brief explanation of the drawing]

FIG. 1 is a partial perspective view of a transfer device of an automatic electronic component mounting device according to an embodiment of the present invention, FIG. 2 is a sectional view of an ejector of the same mounting device, and FIG. 3 is a sectional view of a main part of the same ejector. FIG. 4 is a plan view of the main part of the ejector, and FIG. 6 is a plan view of the main part showing the position of the pins relative to the electronic components in the ejector.
FIG. 6 is a front view of essential parts of the electronic component automatic mounting device, and FIG. 7 is a perspective view of the electronic component automatic mounting device. 23... Push-up device (ejector), 24
...Push-up pin, 73, 74.75...
··nozzle. Name of agent: Patent attorney Toshio Nakao and 1 other person11
--Electronic sound parts Figure 2 23-Electronic sound parts
Cardiac rib --- capsule (a) tot Fig. 4 δ 4 pin 2 beft knitted pin Fig. 5

Claims (3)

[Claims] (1) A push-up device that pushes up and peels off a wafer-type electronic component, a transfer device that adsorbs the electronic component and transfers it to a predetermined position, and a drive device that drives the push-up device and the transfer device; An electronic component push-up suction device characterized in that the push-up device is provided with a plurality of push-up pins. (2) The electronic component push-up suction device according to claim 1, wherein the plurality of push-up pins are selectively pushed up. (3) The electronic component push-up suction device according to claim 1, wherein the push-up device and the transfer device are moved up and down synchronously by a drive device.