JPS6130295Y2 - - Google Patents

Description

[Detailed description of the invention] This invention uses an evaporator filled with a condensable cooling medium and a semiconductor device to be alternately stacked and pressed together, and cools the semiconductor device by utilizing the phase change between the liquid and gas phases of the refrigerant. The present invention relates to a boiling cooling device for semiconductor devices.

The conventional one has a semiconductor element 3 as shown in FIG.
and the evaporator 2 are stacked alternately, and the side plates 1 at both ends and a plurality of tightening rod bolts 4 are connected via an insulator 9.
The structure is such that the semiconductor element 3 is assembled into a rod shape, and the semiconductor element 3 and the evaporator 2 are pressed together under a predetermined load so that the heat generated by the semiconductor element 3 is well conducted to the evaporator 2.

On the other hand, the evaporator 2 communicates with the condenser 7 through a heat transport pipe 8, and the cooling medium filled inside circulates between the evaporator and the condenser, and the heat generated by the semiconductor element 3 is transferred to the condenser. The structure is such that the semiconductor element is cooled by dissipating heat from the surface. A heat transport pipe 8 that communicates the condenser 7 and the evaporator 2 is an insulating pipe 8B for insulating the evaporator 2 and the condenser 7, and an insulating pipe 8B for insulating the evaporator 2 and the evaporator 2 as shown in FIG. It is constructed of bellows 8A that can be moved in the left-right direction to widen the dimensions between adjacent evaporators and facilitate element replacement.

However, in the conventional device configured in this way, when replacing the semiconductor element, when the tightening rod 4 is loosened and the pressure load between the semiconductor element 3 and the evaporator 2 is released, the bellows 8A is released due to the weight of the evaporator 2. grows,
The evaporator 2 hangs down from a predetermined position, and when reassembling it, it takes a high level of skill and work to lift up the multiple hanging evaporators 2 and align their centers with the semiconductor elements 3. The drawback was that it was difficult and took a long time.

The present invention was made to solve the above-mentioned drawbacks of the conventional technology, and consists of stacking an evaporator filled with a condensable cooling medium and a semiconductor element alternately in a rod shape, and connecting them with a plurality of tightening rods. The evaporator and the semiconductor element are pressed together under a predetermined load, and the evaporator and the condenser are connected through a heat transport tube equipped with bellows to circulate the cooling medium between the evaporator and the condenser, thereby generating the semiconductor element. An object of the present invention is to provide a boiling cooling device for a semiconductor device in which assembly and replacement of semiconductor elements can be easily performed by providing an insulated tightening rod at a position where the bottom surface of an evaporator comes into contact with the evaporator. It is something.

An embodiment of the present invention will be described below.

Figures 3 and 4 are diagrams showing the main parts of an embodiment of the present invention, in which the number of tightening rods (bolts) 4A is reduced to three as shown in Figure 4, and an evaporator is attached to the lower side tightening rod. The evaporator 2 and the semiconductor element 3 are constructed so as to be in a firm state, side plates 1A are provided on both sides, and the evaporator 2 and the semiconductor element 3 are pressed together with a tightening rod 4A as in the conventional method. By making the evaporator rest on the clamping rod 4A in this way, the sagging of the evaporator 2 caused by loosening the clamping rod 4A during element conversion is always maintained on the clamping rod 4A. Therefore, the tightening rod absorbs the force of the evaporator lowering, which prevents the evaporator from sagging.

However, since the evaporator 2 is supported by the tightening rod in this way because the evaporator is an electrically conductive part, it is possible to insulate the evaporator and the tightening rod by covering the tightening rod with an insulating tube or the like. However, as shown in FIG. 5, there are cases where the insulation distance 5 between the evaporators 2 becomes insufficient. In order to solve this problem of insufficient insulation distance, as shown in FIG. 6, a support plate 6 having a thickness smaller than the thickness of the evaporator is attached to the lower outer periphery of the evaporator by welding or the like. As a result, the insufficient insulation distance becomes a distance of 5A as shown in FIG. 6, which can be made considerably larger depending on how the support plate 6 is attached. In addition, by attaching the support plate 6, the tightening rod 4
When receiving the evaporator 2 at A, if the support plate 6 is not attached to the tightening rod, the spherical surface of the tightening rod and the spherical surface of the evaporator will be connected, and the spherical surface and the spherical surface will be received at one point, so the left and right If misalignment occurs, there is a risk that the evaporator 2 may sag slightly.
By attaching the support plate 6, as shown in FIG. 7, if the support plate 6 is brought into contact with the surface of the tightening rod 4A, it will be completely resting on the tightening rod 4A. There are also advantages such as no lateral deviation and complete fixation of the evaporator 2.

In addition, by holding the evaporator 2 with the tightening rod 4A as in the present invention, the number of tightening rods can be reduced to three, reducing the assembly work, and improving work efficiency by reducing the number of bolt loosening operations when replacing elements. It is also possible to improve Also, by providing a support plate 6 on the evaporator 2 and supporting it with the tightening rod 4A, when multiple evaporators are pressed together and assembled, the support plate 6 provides a stable surface for the tightening rod 4A. Since it can be received at
This also has the advantage of improving work efficiency, such as not having to think about correcting left-right misalignment when welding.

Further, in the above description, the support plate 6 is made of metal and is fixed to the evaporator by welding, brazing, etc., but if necessary, the support plate may be made of an insulating material and the evaporator and support plate may be bonded or bonded. Alternatively, it may be fixed with screws or the like.

As described above, according to the present invention, the evaporator filled with a condensable cooling medium and the semiconductor element are stacked alternately and assembled into a rod shape, and the evaporator and the semiconductor element are connected by a plurality of tightening rods. The evaporator and condenser are connected to each other by a heat transport pipe equipped with a bellows, and the cooling medium is circulated between the evaporator and the condenser to transport the heat generated by the semiconductor element. In this product, an insulated tightening rod is provided at the position where the bottom surface of the evaporator comes into contact, so when assembling or replacing semiconductor elements, the evaporator can be tightened with the tightening rod that comes into contact with the bottom surface of the evaporator. As a result, the evaporator does not sag due to deformation of the bellows, etc., and therefore the element can be easily assembled and replaced.

[Brief explanation of the drawing]

FIG. 1 is a front view showing a conventional evaporative cooling device for semiconductor devices, FIG. 2 is a side view of FIG. 4 is a side view of FIG. 3, FIGS. 5 and 6 are diagrams showing the insulation distance between the evaporators in the embodiment of the present invention, and FIG. 7 is a sectional view taken along the - line in FIG. 6. It is. In the figure, 2 is an evaporator, 3 is a semiconductor element, 4A is a tightening rod, and 6 is a support plate. Note that the same reference numerals in the drawings indicate the same or corresponding parts.

Claims (1)

[Claims for Utility Model Registration] (1) An evaporator filled with a condensable cooling medium and a semiconductor element are stacked alternately and assembled into a rod shape, and connected by a plurality of tightening rods, so that the evaporator and the semiconductor element are assembled into a rod shape. The semiconductor element is generated by pressurizing the semiconductor element with a predetermined load, communicating the evaporator and the condenser through a heat transport pipe equipped with bellows, and circulating the cooling medium between the evaporator and the condenser. wherein at least one of the plurality of tightening rods is an insulated tightening rod, and the insulated tightening rod is connected to a bottom surface of the evaporator. A boiling cooling device for a semiconductor device, characterized in that the device is provided at a position where the cooling device contacts the device. (2) Registration of a utility model characterized in that a support plate having a thickness smaller than the thickness of the evaporator is fixed to the lower surface of the evaporator, and the support plate is brought into contact with an insulated tightening rod. The evaporative cooling device for semiconductor devices according to claim 1. (3) The boiling cooling device for a semiconductor device according to claim 2 of the utility model registration, wherein the support plate is an insulator.