JPS613492A - Electronic part high density carrying package - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component package, and more particularly to an electronic component package mounted upright on a printed circuit board.

2. Description of the Related Art Conventionally, this type of electronic component package includes a plurality of integrated circuits on a wiring board 1, as shown in FIG.

It is equipped with electronic components 2 such as resistors and capacitors, and a plurality of terminals 3 are attached to one side of the wiring board L.
The wiring on the wiring board 1 serves to connect the plurality of electronic components 2 to each other and to connect the plurality of electronic components 2 to the plurality of terminals 3.

FIG. 3 shows a state in which the conventional electronic component package shown in FIG. 2 is mounted on a printed circuit board 4, and the electronic component package stands upright in a direction perpendicular to the printed circuit board 4.

Therefore, if electronic components 2 are to be mounted on wiring board 1 at high density, the amount of input/output signals will increase and a large number of terminals 3 will be required. However, this number of terminals has the drawback that the mounting of the terminals 3 is limited by the spacing, making it difficult to mount high-density electronic components 2.Problems to be Solved by the InventionThe purpose of the present invention is as described above. To provide an electronic component package that solves the conventional drawback, that is, the difficulty of mounting electronic components at a high density. , in an electronic component package in which multiple electronic components are mounted on a wiring board, many lead terminals are drawn out from the bottom of the wiring board, and the electronic components are mounted vertically to the printed circuit board. , a structure is adopted in which the plurality of lead terminals are attached in parallel on both sides of one side of the wiring board.

Function Since the present invention is configured as described above, a sufficient number of terminals can be obtained for electronic components that are mounted at high density.

Example Next, embodiments of the present invention will be described with reference to the drawings.

Referring to FIG. 1 showing an embodiment of the present invention, the electronic component high-density mounting package of the present invention includes a wiring board 1, a plurality of electronic components 2, and a plurality of lead terminals 3. Lead terminals 3 are attached in two rows on both sides of one side of the wiring board l. Comparing this with Figure 2, it is the same as before except that the number of terminals 3 has doubled, and the wiring board l has several electronic components 2 between each other and between electronic components 2 and terminals 3. It is also the same as before that connection wiring is provided between the two. Furthermore, the mounting on the printed circuit board 4 is no different from the conventional example shown in FIG.

Therefore, since the number of terminals 3 is doubled, the number of electronic components 2 that can be connected to these terminals is increased, and the density can be greatly improved.

Furthermore, in this electronic component high-density mounting package, the lead terminals 3 are arranged in two rows, so when mounted on the printed circuit board 4,
The strength against external forces also increases.

Effects of the Invention As explained above, according to the present invention, since the wiring board is configured to have a plurality of lead terminals on both sides of one side, the number of terminals is increased compared to the conventional one, and the electronic This has the effect of greatly increasing component mounting density and increasing strength against external forces during printed board mounting.

[Brief explanation of drawings]

Figure 1 is a perspective view (a) and side view (b) of an embodiment of the present invention, Figure 2 is a perspective view (a) and side view (b) of a conventional example, and Figure 3 is the same as that of Figure 2. FIG. 3 is a perspective view of the package mounted on a printed circuit board. l...Wiring board, 2...Electronic components, 3.
...Lead terminal, 4...Printed circuit board. [α) (b) ・Leather / Concave L (1) (b) Beam 21! l

Claims (1)

[Claims] In an electronic component package in which a plurality of electronic components are mounted on a wiring board, a large number of lead terminals are led out from one side of the wiring board, and the electronic components are mounted in an upright state perpendicular to the printed circuit board, the wiring board A high-density mounting package for electronic components, characterized in that the package has a configuration in which the plurality of lead terminals are attached in parallel on both sides of one side.