JPS6136334A - Manufacture of laminated board - Google Patents

Manufacture of laminated board

Info

Publication number
JPS6136334A
JPS6136334A JP15997884A JP15997884A JPS6136334A JP S6136334 A JPS6136334 A JP S6136334A JP 15997884 A JP15997884 A JP 15997884A JP 15997884 A JP15997884 A JP 15997884A JP S6136334 A JPS6136334 A JP S6136334A
Authority
JP
Japan
Prior art keywords
resin
varnish
formaldehyde
reaction product
phosphite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15997884A
Other languages
Japanese (ja)
Other versions
JPH043421B2 (en
Inventor
Yoshihiro Nakamura
吉宏 中村
Mitsuo Yokota
横田 光雄
Takeshi Kawai
毅 川合
Ken Nanaumi
憲 七海
Shinji Ogi
荻 伸二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP15997884A priority Critical patent/JPS6136334A/en
Publication of JPS6136334A publication Critical patent/JPS6136334A/en
Publication of JPH043421B2 publication Critical patent/JPH043421B2/ja
Granted legal-status Critical Current

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  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To manufacture a thermosetting resin laminated board having excellent flame-retardance and moisture resistance, by preparing a cocondensation resin from formaldehyde and an ester exchange reaction product of a phosphate or phosphite and a polyhydric phenol, and using the resin as a varnish for pretreatment. CONSTITUTION:The objective laminated board can be manufactured by (1) carrying out the cocondensation of (A) a reaction product obtained by the ester-exchange reaction of (i) 1-4mol of a phosphoric acid ester of formula I and/or a phosphorous acid ester of formula II (R1-6 are alkyl, aryl, preferably aryl) with (ii) preferably 1-3mol of a polyhydric phenol in the presence of anhydrous K2CO3, etc. as a catalyst, at >=100 deg.C with (B) 1-3mol of formaldehyde, based on 1mol of the compound having phenolic hydroxyl group, using trimethylamine, etc. as a catalyst, (2) using the obtained resin as the varnish for the pretreatment, and a thermosetting resin as the varnish for the post-treatment, and (3) laminating the substrates impregnated or coated with said varnishes.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は難燃性及び耐湿性に優れた熱硬化性樹脂積層板
の製造法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for producing a thermosetting resin laminate having excellent flame retardancy and moisture resistance.

(従来の技術) 従来、積層板の難燃化の方法は、リン系化合物、ブロム
系化合物、窒素系化合物及びアンチモン等の無機化合物
を単独または併用して熱硬化性樹脂に添加することによ
りなされている。
(Prior Art) Conventionally, a method for making laminates flame retardant is to add inorganic compounds such as phosphorus compounds, bromine compounds, nitrogen compounds, and antimony to thermosetting resins, either alone or in combination. ing.

リン系化合物は難燃性に優れ、ブロム系化合物との併用
で難燃化には特に優れた効果を示す。
Phosphorous compounds have excellent flame retardancy, and when used in combination with bromine compounds, they exhibit particularly excellent flame retardant effects.

窒素化合物の難燃性はリン系及びブロム系化合物はどな
い。耐湿性の向上は基材にフェオール樹脂メラミン樹脂
及びベンゾグアナミン樹脂を単独または併用して前処理
フェスとして基材に含浸させて使用している。しかし、
フェノール樹脂は難燃性には効果がない。メラミン樹脂
及びベンゾグアナミン樹脂は難燃性は充分でなく、また
耐湿性及び電気的性能は、フェノール樹脂より劣ってい
る。
What is the flame retardancy of nitrogen compounds compared to phosphorus and bromine compounds? Moisture resistance is improved by impregnating the base material with pheol resin, melamine resin, and benzoguanamine resin, either alone or in combination, as a pre-treatment face. but,
Phenolic resin has no effect on flame retardancy. Melamine resins and benzoguanamine resins do not have sufficient flame retardancy, and their moisture resistance and electrical performance are inferior to phenolic resins.

難燃性に効果のあるリン系化合物を単独で使用すると、
耐湿性の効果はなく、耐熱性が劣る。
When a phosphorus compound that has flame retardant properties is used alone,
It has no moisture resistance effect and has poor heat resistance.

また、フェノール樹脂、メラミン樹脂及びベンゾグアナ
ミン樹脂に併用して使用しても、樹脂系に組み込まれて
いないため、耐熱性が著しく低下する。
Furthermore, even when used in combination with phenol resin, melamine resin, and benzoguanamine resin, heat resistance is significantly reduced because it is not incorporated into the resin system.

(発明の目的) 本発明の目的は難燃性及び耐湿性に優れた熱硬化性樹脂
M層板の製造法を提供するものである。
(Object of the Invention) The object of the present invention is to provide a method for producing a thermosetting resin M-layer plate having excellent flame retardancy and moisture resistance.

(発明の構成) 本発明は一般式 (I) で示されるリン酸エステル類、及び/又は一般式 (I
t) 示す。) で、示される亜リン酸エステル類と、多価フェノール類
とからエステル交換反応によって得られる反応生成物A
とホルムアルデヒド類(B)による共縮合樹脂を前処理
フェノとして、基材に所定量含浸付着させ、更に熱硬化
性樹脂を後処理フェノとして、所定量含浸付着させた基
材を成型することを特徴とするものである。
(Structure of the Invention) The present invention relates to phosphoric esters represented by the general formula (I) and/or the general formula (I
t) Show. ) is a reaction product A obtained by transesterification from the phosphites shown and polyhydric phenols.
and formaldehyde (B) as a pre-treatment phenol, which is impregnated and adhered to a base material in a predetermined amount, and further a thermosetting resin is used as a post-treatment phenol, and the base material that is impregnated and adhered to a predetermined amount is molded. That is.

一般式 (I) で示されるリン酸エステル類としては、トリメチルホス
フェイト、トリエチルホスファイト、トリブチルフォス
フエイト、トリオクチルホスフェイト、トリブトキシエ
チルホスフェイト、トリスクロロエチルホスフェイト、
トリスクロロエルホスフェイト、トリフェニルホスフェ
イト、トリクレジルホスフェイト、トリキシレニルホス
フェイト、クレジルジフェニルホスフェイト、オクチル
ジフェニルホスフェイト、キシレニルジフェニルホスフ
ェイト、モノフェニルジイソゾロフヱニルホスフエイト
、ジフェニルモノイソプロビルフェニルホオスフエイト
等が挙げられる。これらの少なくとも一種が用いられる
。R,、R2,Rs はアルキル基、アリール(ary
l)基であり、互いに同じであっても異っていても良い
。アリール基として、ベンゼン環の水素を、アルキル基
、ハロゲンで置換したものも含む。
Examples of the phosphoric acid esters represented by the general formula (I) include trimethyl phosphate, triethyl phosphite, tributyl phosphate, trioctyl phosphate, tributoxyethyl phosphate, trischloroethyl phosphate,
Trischloroel phosphate, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, octyl diphenyl phosphate, xylenyl diphenyl phosphate, monophenyl diisozolphenyl phosphate , diphenylmonoisopropylphenyl phosphonate, and the like. At least one of these is used. R,, R2, Rs are alkyl groups, aryl
l) groups, which may be the same or different from each other. Aryl groups also include those in which hydrogen in the benzene ring is replaced with an alkyl group or a halogen.

一般式 (II) R5−0P(II) で示される亜リン酸エステル類としては、トリエチルホ
スファイト、トリn−ブチルホスファイト、トリス2−
エチルヘキシルホスファイトトリデシルホスファイト、
トリストリデシルホスファイト、トリステアリルホスフ
ァイト、ジフェニルモノデシルホスファイト、ジンェニ
ルモノトリデシルホスファイト、トリエチルホスファイ
ト、トリスノニルフェニルホスファイト等が挙げられる
。これらの少なくとも一種が用いられる。R4,Ra、
 Rs  はアルキル基、アリール(aryl)基であ
り、互いに同じであっても異っていても良い。アリール
基として、ベンゼン環の水素を、アルキシ基、ハロゲン
で置換したものも含む。これらの、リン酸エステル類ま
たは亜リン酸エステル類の少なくとも一種が用いられる
。多価フェノール類としては、一般式%式% で示される化合物(例えばビスフェノールA、ビスフェ
ノールF1ビスフエノールS等)、 P−インプロペニ
ルフェノールの二量体、カテコール、レゾルシン、ヒド
ロキノン、ピロガロール、ヒドロキシヒドロキノン、フ
ロログルシン、アピオノール、1.2.3.5−テトラ
ヒドロキシベンゼン等(ベンゼン環の水素がアルキル基
等によって置換されたものも含む)の少な(とも一種が
使用される。
Examples of the phosphites represented by the general formula (II) R5-0P(II) include triethyl phosphite, tri-n-butyl phosphite, and tris-2-
ethylhexyl phosphite tridecyl phosphite,
Examples include tristridecyl phosphite, tristearyl phosphite, diphenylmonodecyl phosphite, dienylmonotridecyl phosphite, triethyl phosphite, trisnonylphenyl phosphite, and the like. At least one of these is used. R4, Ra,
Rs is an alkyl group or an aryl group, and may be the same or different. Aryl groups also include those in which hydrogen in the benzene ring is substituted with an alkoxy group or a halogen. At least one of these phosphoric acid esters and phosphorous acid esters is used. Examples of polyhydric phenols include compounds represented by the general formula % (e.g. bisphenol A, bisphenol F1 bisphenol S, etc.), dimer of P-impropenylphenol, catechol, resorcinol, hydroquinone, pyrogallol, hydroxyhydroquinone, Phloroglucin, apionol, 1.2.3.5-tetrahydroxybenzene (including those in which hydrogen in the benzene ring is substituted with an alkyl group, etc.) are used.

リン酸エステル類及び/又は陳リン酸エステル類と多価
フェノール類とのエステル交換反応は温度100℃以上
で行い、特に130〜180℃が好ましい。100℃以
下では溶解しないものもあり、また反応も進行しにくい
。エステル交換によって生成するアルコール類、フェノ
ール類は反応中または反応後糸外に留出しても、そのま
まにしてもよい。特に、副成したフェノール類は熱硬化
性樹脂の原料として用いることもできる。
The transesterification reaction between phosphoric esters and/or phosphoric esters and polyhydric phenols is carried out at a temperature of 100°C or higher, preferably 130 to 180°C. Some of them do not dissolve at temperatures below 100°C, and the reaction does not proceed easily. Alcohols and phenols produced by transesterification may be distilled out of the thread during or after the reaction, or may be left as they are. In particular, the by-produced phenols can also be used as raw materials for thermosetting resins.

エステル交換反応に使用する触媒は無水に2COs、 
CsF、無水Na2COm等の無機系化合物、トリエチ
ルアミン、ジエチルアミン、ベンジルジメチルアミン等
の有機塩基化合物が挙げられる。
The catalyst used for the transesterification reaction is anhydrous 2COs,
Examples include inorganic compounds such as CsF and anhydrous Na2COm, and organic base compounds such as triethylamine, diethylamine, and benzyldimethylamine.

触媒量は全系に対して0.001〜2.0%(重量%以
下同じ)を使用するのが好ましく、0.001%以下の
触媒量ではエステル交換反応が進みにくく、2.0%以
上になると、特に無機系化合物を使用した場合、積層板
の電気特性が低下しや1い。
It is preferable to use a catalyst amount of 0.001 to 2.0% (same as below weight%) based on the entire system.If the catalyst amount is less than 0.001%, the transesterification reaction will be difficult to proceed, and if the catalyst amount is less than 0.001%, the transesterification reaction will not proceed easily. In this case, especially when an inorganic compound is used, the electrical properties of the laminate are likely to deteriorate.

リン酸エステル類及び/又は亜リン酸エステル類と多価
フェノール類の配合モル比はリン酸エステル類、亜すン
酸エステル類1〜4モルに対し、多価フェノール類1〜
5モルが好ましい。
The blending molar ratio of phosphoric acid esters and/or phosphite esters and polyhydric phenols is 1 to 4 moles of phosphoric acid esters and phosphorous acid esters to 1 to 4 moles of polyhydric phenols.
5 mol is preferred.

リン酸エステル類及び/又は亜リン酸エステル類と多価
フェノール類を触媒を用いてエステル交換反応を行い、
例えば、一般式(IV)に示される化合物等を含む反応
生成物が得られる。
Performing a transesterification reaction of phosphoric acid esters and/or phosphite esters and polyhydric phenols using a catalyst,
For example, a reaction product containing a compound represented by general formula (IV), etc. can be obtained.

Ra −0/ CRt+ Rsはアルキル基、アリール(aryl)基
を示す。) この反応生成物はリン酸エステル類及び/又は亜リン酸
エステル類と反応していない多価フェノール類の水酸基
を少なくとも1つ持つ化合物が全illで10%以上あ
ることが好ましい。
Ra -0/CRt+ Rs represents an alkyl group or an aryl group. ) This reaction product preferably contains 10% or more of the total amount of compounds having at least one hydroxyl group of polyhydric phenols that have not reacted with the phosphoric acid esters and/or the phosphorous acid esters.

上記に示したエステル交換反応によって得られる反応生
成物(4)とホルムアルデヒド類(Blとを共縮合させ
、前処理フェノとする。交換反応によって得られる反応
生成物(N中のフェノール性水酸基を待つ化合物1モル
に対し、ポルムアルデヒド1〜3モルにするのが好まし
い。ホルムアルデヒド類(B)としてはパラホルムアル
デヒド、ホルムアルデヒド、トリオキサン等であり、こ
れらの一種以上を使用する。ポルムアルデヒド類との反
応に用いる触媒はトリメチルアミン、トリエチルアミン
、ジメチルアミン、ジエチルアミン、モノメチルアミン
、モノエチルアミン、エチレンジアミン、アンモニアへ
キサミン等の有機アミン類か、AJ(OH)s 、 Z
n(OH)3. NaOHMg(OH)2等の余端水酸
化物を1種以上を用いる。好しくけ有機アミン類がよい
。また前処理ワニスに、他のフェノール樹脂、メラミン
樹脂、ベンゾグアナミン樹脂等を必要敞添加してもよい
The reaction product (4) obtained by the transesterification reaction shown above is co-condensed with formaldehyde (Bl) to obtain a pretreated phenol. It is preferable to use 1 to 3 moles of formaldehyde per 1 mole of the compound.Formaldehydes (B) include paraformaldehyde, formaldehyde, trioxane, etc., and one or more of these is used. The catalyst used is organic amines such as trimethylamine, triethylamine, dimethylamine, diethylamine, monomethylamine, monoethylamine, ethylenediamine, ammoniahexamine, AJ(OH)s, Z
n(OH)3. One or more residual hydroxides such as NaOHMg(OH)2 are used. Preferably, organic amines are used. Further, other phenolic resins, melamine resins, benzoguanamine resins, etc. may be added to the pretreatment varnish as necessary.

後処理フェノとして使用する熱硬化性樹脂は一般的なフ
ェノール樹脂、エポキシ樹脂、ポリエステル樹脂、メラ
ミン樹脂等で、これらの樹脂中にリン酸エステル類、亜
リン酸エステル類またはテトラブロモビスフェノールA
またはこのグリシジルエーテル等のブロム系化合物を併
用して用(・るが好ましい。ここで後処理とは、前処理
した基材に上記の樹脂ワニスー徨以上所定量含浸付着さ
せる工程であり、ここで用いる基材は紙、布、ガラス混
抄紙、合成#1!絣布等である。
Thermosetting resins used as post-processing phenols are general phenol resins, epoxy resins, polyester resins, melamine resins, etc., and these resins contain phosphoric acid esters, phosphorous acid esters, or tetrabromobisphenol A.
Alternatively, a bromine-based compound such as glycidyl ether may be used in combination (preferably. Here, post-treatment is a step of impregnating and adhering a predetermined amount of the above resin varnish to the pretreated substrate. The base materials used are paper, cloth, glass-mixed paper, synthetic #1! Kasuri cloth, etc.

上記に示した棟にエステル交換反応によって得られる反
応生成物(8)とホルムアルデヒド類(匂との共縮合フ
ェノを前処理フェノとして基材に含浸させ、史に熱硬化
性樹脂を後処理フェノとして、楠定虻含浸付着させた基
材を必要枚数重ね合せ、必要な温度(室温も含む)、必
要な圧力(無圧も含む)で行なわれる。
In the above-mentioned structure, the reaction product (8) obtained by transesterification and formaldehyde (co-condensed with formaldehyde) are impregnated into the base material as a pre-treatment phenol, and the thermosetting resin is used as a post-treatment phenol. The required number of base materials impregnated with Kusunoki and adhered thereto are stacked one on top of the other, and the process is carried out at the required temperature (including room temperature) and the required pressure (including no pressure).

実施例 クレジルジフェニルホスフェイ) 337 g1カテコ
ール110gを反応容器に入れ、触媒として無水に2C
O30,9gを用い、125℃9時間反応を続け、クレ
ジルジフェニルホスフェイト−カテコール反応生成物を
得た。リン含有率6゜6%であった。この反応生成物と
80%ホルムアルデヒド80gをトリメチルアミン2.
4gを80℃、9時間反応させ、ホルムアルデヒド共縮
合樹脂を得、更にこれをメタ、ノールに洛かして、紡処
理用フェスとした。これをクラフト紙に上記前処理ワニ
スを含浸乾燥させた。l1lJ処理樹脂付着量20%と
した。史に桐油変性量24゜5%のm−クレゾールレゾ
ール樹脂100部に対し、難燃剤としてクレジルジフェ
ニルホスフェイト15部、テトラブロモビスフェノール
Aグリシジルエーテル25部配合し、後処理ワニスとし
て、全樹脂付着量50.8%になる様含浸乾燥させ、こ
のプリプレグ5枚と接着剤付鋼はくと組み合せて加熱加
圧積層して1.611111の片面銅張積層板を得た。
Example Cresyl diphenyl phosphate) 337 g1 110 g of catechol was placed in a reaction vessel, and 2C was added to anhydrous water as a catalyst.
Using 30.9 g of O, the reaction was continued at 125° C. for 9 hours to obtain a cresyl diphenyl phosphate-catechol reaction product. The phosphorus content was 6.6%. This reaction product and 80 g of 80% formaldehyde were mixed with 2.0 g of trimethylamine.
4 g was reacted at 80° C. for 9 hours to obtain a formaldehyde co-condensed resin, which was further soaked in methanol and ethanol to obtain a fabric for spinning treatment. This was impregnated into kraft paper with the above pretreated varnish and dried. The l1lJ treatment resin adhesion amount was 20%. To 100 parts of m-cresol resol resin modified with 24.5% tung oil, 15 parts of cresyl diphenyl phosphate and 25 parts of tetrabromobisphenol A glycidyl ether were added as a flame retardant, and used as a post-treatment varnish to completely adhere to the resin. The prepreg was impregnated and dried to a concentration of 50.8%, and five sheets of this prepreg were combined with adhesive-coated steel foil and laminated under heat and pressure to obtain a single-sided copper-clad laminate of 1.611111.

この銅張積層板の特性を別表に示す。The characteristics of this copper-clad laminate are shown in the attached table.

比較例 フェノール樹脂174g(フヱノール含有量100g)
Kクレジルシフ曵ニルホスフェイト337gを添加し、
これをメタノールに溶かして、前処理用ワニスとした。
Comparative example phenol resin 174g (phenol content 100g)
Add 337 g of Kresilschiff phosphate,
This was dissolved in methanol to prepare a pretreatment varnish.

これをクラフト紙に上記前処理ワニスを含浸乾燥させた
。前処理樹脂付着量20%とした。更に桐油変性量24
゜5%のm−クレゾールレゾール樹脂100部に対し、
難燃剤としてクレジルシフ墨ニルホス7曵イト15部、
テトラブロモビスフェノールAグリシジルエーテル25
部を配合し、後処理ワニスとして、全樹脂量付着量5α
8%になる様含浸乾燥させ、以下実施例と同様な方法で
銅張積層板を得た。この銅張積層板の特性を別表に示す
This was impregnated into kraft paper with the above pretreated varnish and dried. The pretreatment resin adhesion amount was 20%. In addition, tung oil modification amount 24
゜For 100 parts of 5% m-cresol resol resin,
15 parts of cresylschiff ink nylphos 7-chlorite as a flame retardant;
Tetrabromobisphenol A glycidyl ether 25
As a post-treatment varnish, the total amount of resin deposited is 5α.
It was impregnated and dried to a concentration of 8%, and a copper-clad laminate was obtained in the same manner as in the examples below. The characteristics of this copper-clad laminate are shown in the attached table.

比較例2 メラミン樹脂ワニスを前処理ワニスとして、クラフト紙
に樹脂付着量20%になる様含浸させ、以降実施例に示
す方法で銅張積層板を得た。
Comparative Example 2 Kraft paper was impregnated with a melamine resin varnish as a pretreatment varnish so that the amount of resin adhesion was 20%, and a copper-clad laminate was then obtained by the method shown in the example.

この銅張積層板の特性を別表に示す。The characteristics of this copper-clad laminate are shown in the attached table.

(発明の効果) 以上説明した様に本発明は難燃性が優れるリン酸エステ
ル類または亜リン酸エステル類と多価フェノール類をエ
ステル交換反応させ、得られる反応生成物とホルムアル
デヒド類による共縮合樹脂を前処理ワニスとして基材に
含浸させ、更に熱硬化性樹脂を後処理ワニスとして、使
用することにより、難燃性を有し、耐湿性、耐熱性に優
れた積層板が製造できる。
(Effects of the Invention) As explained above, the present invention involves transesterification of phosphoric acid esters or phosphite esters with excellent flame retardancy and polyhydric phenols, and co-condensation of the resulting reaction product with formaldehyde. By impregnating a base material with a resin as a pre-treatment varnish and further using a thermosetting resin as a post-treatment varnish, a laminate having flame retardancy and excellent moisture resistance and heat resistance can be manufactured.

Claims (1)

【特許請求の範囲】 1、一般式( I ) ▲数式、化学式、表等があります▼(R_1、R_2、
R_3はアル キル基、アリール(aryl) 基を示す。) で示されるリン酸エステル類、及び/又は 一般式(II) ▲数式、化学式、表等があります▼(II)(R_4、R
_6、R_6はアルキル基、アリール(aryl) 基を示す。) で、示される亜リン酸エステル類と、多価フェノール類
とからエステル交換反応によって得られる反応生成物(
A)とホルムアルデヒド類(B)による共縮合樹脂を前
処理ワニスとして、基材に所定量含浸付着させた基材を
成型することを特徴とする積層板の製造法。 2、リン酸エステル類または亜リン酸エステル類のR_
1〜R_6がアリール(aryl)基である特許請求の
範囲第1項記載の積層板の製造法。
[Claims] 1. General formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(R_1, R_2,
R_3 represents an alkyl group or an aryl group. ), and/or general formula (II) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(II) (R_4, R
_6 and R_6 represent an alkyl group or an aryl group. ) is the reaction product (
A method for producing a laminate, which comprises molding a base material in which a predetermined amount of a co-condensed resin of A) and formaldehyde (B) is impregnated into the base material as a pretreatment varnish. 2. R_ of phosphoric acid esters or phosphite esters
The method for producing a laminate according to claim 1, wherein 1 to R_6 are aryl groups.
JP15997884A 1984-07-30 1984-07-30 Manufacture of laminated board Granted JPS6136334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15997884A JPS6136334A (en) 1984-07-30 1984-07-30 Manufacture of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15997884A JPS6136334A (en) 1984-07-30 1984-07-30 Manufacture of laminated board

Publications (2)

Publication Number Publication Date
JPS6136334A true JPS6136334A (en) 1986-02-21
JPH043421B2 JPH043421B2 (en) 1992-01-23

Family

ID=15705326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15997884A Granted JPS6136334A (en) 1984-07-30 1984-07-30 Manufacture of laminated board

Country Status (1)

Country Link
JP (1) JPS6136334A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607990A (en) * 1991-10-11 1997-03-04 Chemische Fabrik Budenheim Rudolf A. Oetker Method for making phenol-formaldehyde resins flame-resistant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607990A (en) * 1991-10-11 1997-03-04 Chemische Fabrik Budenheim Rudolf A. Oetker Method for making phenol-formaldehyde resins flame-resistant

Also Published As

Publication number Publication date
JPH043421B2 (en) 1992-01-23

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