JPS6142949B2 - - Google Patents
Info
- Publication number
- JPS6142949B2 JPS6142949B2 JP3930580A JP3930580A JPS6142949B2 JP S6142949 B2 JPS6142949 B2 JP S6142949B2 JP 3930580 A JP3930580 A JP 3930580A JP 3930580 A JP3930580 A JP 3930580A JP S6142949 B2 JPS6142949 B2 JP S6142949B2
- Authority
- JP
- Japan
- Prior art keywords
- pypo
- silver
- film
- resistance
- carbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 39
- 239000004020 conductor Substances 0.000 claims description 17
- 229920000642 polymer Polymers 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 9
- 239000004962 Polyamide-imide Substances 0.000 claims description 7
- 229920002312 polyamide-imide Polymers 0.000 claims description 7
- 125000000623 heterocyclic group Chemical group 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 2
- 229920005596 polymer binder Polymers 0.000 claims 1
- 239000002491 polymer binding agent Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 37
- 229910052709 silver Inorganic materials 0.000 description 36
- 239000004332 silver Substances 0.000 description 36
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 29
- 229910052799 carbon Inorganic materials 0.000 description 17
- 239000011230 binding agent Substances 0.000 description 13
- 229910002804 graphite Inorganic materials 0.000 description 10
- 239000010439 graphite Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000005979 thermal decomposition reaction Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000007858 starting material Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000001694 spray drying Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000011882 ultra-fine particle Substances 0.000 description 2
- 101150078308 DOK1 gene Proteins 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 description 1
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229920000140 heteropolymer Polymers 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- -1 silver Chemical compound 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Description
本発明は新規な導電性粉末を結合剤に分散して
得られる導電性組成物に関し、従来の銀系導電皮
膜の銀を部分的に新規な導電材料に置換すること
により、低コストでかつ高性能の導電性皮膜を提
供するものである。更に、本発明は新規導電材料
として、耐熱性高分子を熱分解して得られる高電
導性物質(以下Pyrolytic Polymerの略として
PYPOと呼ぶ)を用いることを特徴とする新規な
導電性組成物に関する。
銀あるいはカーボンの粉末を高分子中に分散し
て得られる皮膜は、特にエレクトロニクスの分野
で、プリント基板用導体、抵抗体あるいは加熱体
(ヒータ)として広く利用されている。銀系導電
皮膜は一般に比抵抗が10-3Ωcm以下で、面積抵抗
としては1Ω/□以下の低い値を与える。一方、
カーボン系皮膜は比抵抗が10-2Ωcm以上で、面積
抵抗としても10Ω/□以下のものを得ることが困
難である。銀系皮膜のコストは銀の価格の変動に
よりカーボン皮膜の10倍から50倍にも及ぶと考え
られており、価格的にも性能(抵抗値)からも銀
とカーボンのギヤツプを埋める新規な導電皮膜の
出現が以前から望まれていた。そのような目的の
ために考えられることは、銀とカーボンを混合す
ることであるが、カーボンと銀は相容性に乏し
く、それぞれを共通の結合剤(バインダー)に分
散することが困難であるとの理由から、これを混
合するとカーボンの凝集が生じ、低抵抗の皮膜を
形成することができない。他の方式としては、銅
あるいはニツケルを用いた導電皮膜があるが、こ
れらも分散性、耐酸化性などに多くの問題を持
ち、信頼性のある商品は得られていない。銅の表
面を銀でコートした粉末を用いた皮膜も存在して
いるが、コスト的なメリツトはほとんどない。ま
た、カーボンからのアプローチとして、黒鉛(グ
ラフアイト)を添加するかあるいはグラフアイト
皮膜を製造するというものがあるが、グラフアイ
トは銀の場合と同様にカーボンとの相容性が悪
く、多くを混入することができない。カーボン−
グラフアイト系の皮膜の一般的な特徴としては、
粒子がバインダー中に凝集分散している場合が多
く、皮膜としての接着性に乏しく、導電性接着剤
としての用途はほとんど不可能と言つてよい。
また、最近の技術として注目されているもの
に、鱗片状のグラフアイトあるいはカーボンを用
いる提案がある。銀系導電皮膜の高い導電性が、
鱗片状の銀粉末を使用することにより粉体間の有
効な接触路を増加させていることに由来している
ことを考えると、この方式は可能性の高いものと
考えられるが、現段階では低コストで安定に供給
される鱗片状カーボン、グラフアイトはない。
そこで本発明は、高価な銀系導電皮膜のコスト
を低減させ、かつ、カーボン系皮膜以下の抵抗値
を有する導導電性皮膜を得んとするものである。
特に本発明は、新規な電導体の粉末で銀およびバ
インダーとの相容性が非常に高い熱分解高分子
(PYPO)を銀と混合して用い、銀の使用量を低
減させかつ、面積抵抗が1Ω/□以下の導電性皮
膜を製造するものである。
本発明で開示される新規な電導体PYPOはポリ
イミド、ポリアミド−イミド、ポリオキサジアゾ
ール、ポリベンゾチアゾールなど一般に耐熱性高
分子と呼ばれている含窒素ヘテロ高分子を真空中
で熱分解して得られる有機電導体で、低次元電導
体に分類される。低次元電導体は『化学と工業』
昭和54年4月号221頁〜240頁に記載されているよ
うに、従来の3次元電導体と異なり、線方向(1
次元)あるいは面方向(2次元)のみに高い電導
性を有する材料の総称である。PYPOは高分子が
熱分解によつて縮合し、黒鉛に近い広がつた平面
構造を有し、2次元性の電導体になつていること
が予想される。デユポン社のカプトンHフイルム
(ポリイミド)が真空中で熱分解を受けて5×
10-2Ω・cmの電導体に変化することはIBM社のS.
D.Bruck氏により1964年に報告されている。
(Polymer誌5巻435頁1964年)。また、ポリアク
リロニトリルが熱分解により1.5×10-1Ωcmに変
化することがロシア学派により1963年に報告され
ている。(A.V.Airapetjanc氏等、Dok1.Akad.
Nauk SSSR誌148巻605頁1963年)。このような
PYPOは耐熱性が高いという利点を持つが、低抵
抗材料としてはカーボン、黒鉛に劣ることが予想
され、機械的性質も通常の高分子から見ると皮膜
性、可撓性など著しく劣ることが指摘されて、そ
の後の研究開発は進んでいない。
しかしながら、最近のめざましい低次元電導体
の研究の結果、有機物の低分子化合物および高分
子化合物において金属性電導を示すものが数多く
合成され、銀よりも高い電導性を示すものおよび
超伝導を示すものなどまで発見されている。ま
た、高電導性を目指した分子レベルの設計および
合成技術なども著しい進展を見せている。(吉村
「化学と工業」第32巻第4号225頁、昭和54年4月
号参照)従つて本発明は、このような観点、およ
び抜群の耐熱性を有するという点に着目し、
PYPOを用い、新規な導電性組成物を提供するも
のである。
本発明の第一の特徴は、PYPOの粉体を高分子
バインダーに分散して導電性組成物を形成すると
ころにあるが、この用途にとつてPYPOが有利な
長所を有することは以下に列挙する事実の発見に
基づいている。すなわち、
1 PYPOは非常にもろい固体であるため、機械
的方法で容易に1μ以下の粉末に加工すること
ができる。
2 熱分解前の高分子の形状が自由に選べるた
め、たとえばキヤスト法による超薄膜、スプレ
ードライ法による超微粒子などを出発物質にし
てPYPOを製造すると容易にPYPOの微粒子が
得られる。また、超薄膜から得られるPYPOは
鱗片状の粉体となる。
3 PYPOはグラフアイトと異なり水素原子を多
く含んだ有機性の材料であるため、ほとんどの
高分子バインダーおよび溶剤とよく相容し、凝
集による2次粒子の形成をほとんど示さない。
これらの中で1と3はフイラーマトリクス系の
複合材料を製造する場合の基本的な要請に合致す
ることを意味している。更に、本発明において用
いられるPYPOの出発材料はポリイミド、ポリア
ミド−イミド、ポリオキサジアゾールおよびポリ
ベンゾチアゾールのいずれかまたはその混合物で
あることが特徴であり、これらは全て2×10-2Ω
cm以下の比抵抗を示す材料である。たとえば、ポ
リイミドは従来5×10-2Ωcmと報告されていたも
のが、純度の高い原材料を用い、850℃で4時間
処理することにより1.4×10-2ΩcmのPYPOが得ら
れている。ポリイミドPYPOの比重は1.8で(ポ
リイミドは1.4)耐熱温度は900℃であつた。ポリ
アミド−イミドPYPOは同様の条件で製造され、
2×10-2Ωcmの比抵抗を示した。ポリオキサジア
ゾールは700℃および800℃で処理した結果それぞ
れ2×10-2、1×10-2Ωcmの比抵抗を持つた。ま
た、ポリベンゾチアゾールは850℃で処理するこ
とにより1×10-2Ωcm以下の比抵抗を持つた。な
お、本発明に用いられるPYPOの出発物質は上記
の材料に限定されることはなく、ポリイミド共重
合体たとえばポリエステル−イミド、ポリベンズ
イミダゾール、ポリベンゾオキサゾール、ポリチ
アジアゾール、ポリオキサジアゾリル、トリアゾ
ール、ポリキノキサリン、ポリイミダゾピロロ
ン、など窒素を含むヘテロ環からなる耐熱性高分
子も同様に使用される。
更に、本発明を有効ならしめるPYPOの他の特
徴は、PYPOは銀と混合しても、銀と化学反応す
ることは全くなく、銀粒子およびPYPO粒子の凝
集を全く起さないことである。
このように、PYPOは高分子バインダー中に分
散して導電性組成物を形成するに非常に有利な性
質を有しており、更に銀との相容性も高く、従つ
て銀−PYPOをフイラーとする皮膜は高性能の導
電皮膜となつた。銀系導電性皮膜とカーボン系皮
膜の間に面積抵抗のギヤツプは1〜10Ω/□であ
ることを先に述べたが、1Ω/□以下の抵抗を得
る場合にも、銀の重量の少なくとも50%をPYPO
によつて置換えることが可能となつた。これは体
積%に換算すると約80%となり、銀の使用量低減
の効果は著しいことがわかる。PYPOのみの面積
抵抗はバインダーなしの皮膜で5Ω/□以上、バ
インダーを含む皮膜で1KΩ/□であつたので、
銀−PYPO系複合皮膜の低い抵抗値は上に述べた
PYPOの特長が生かされた結果と見るべきであろ
う。
以下に実施例を示し、本発明の具体的効果を説
明する。
実施例 1
ポリイミドフイルムは例えばデユポン社からカ
プトンHフイルムとして市販されている。この他
にデユポン社のPyre−MLあるいはモンサント社
のSolution7Wなどワニスでも入手することがで
きる。ここでは12.5μのカプトンHフイルムおよ
びPyre−MLをガラス上にキヤストして得られた
1μのフイルムの両者を出発材料とした例を示
す。上記ポリイミドフイルムを石英管に入れ
10-3Torrの真空中にて、850℃の温度で熱分解し
た。熱分解は試料が850℃に達する以前から開始
してNOx、COxなどの気体が放出されるが、抵
抗値が安定になる時間として4時間を処理時間と
して設定した。熱分解により得られたPYPOの比
抵抗は1.4×10-2Ωcm以下であつた。
次に、得られたPYPOを遠心式ボールミルで約
1時間粉砕し、更にアトライタで2時間粉砕し
た。粉体の粒度は、カプトンHから得られたもの
は5μ以下、Pyre−MLからのPYPOは1μ以下
となつた。銀粉として市販の銀ペースト用粉末を
用い、ポリエステル樹脂をバインダーとし、イソ
ホロン系溶剤を用いてペーストを試作した。皮膜
は200メツシユのスクリーンを用いて、ポリエス
テルあるいはセラミツク基板上に印刷した。印刷
後150℃1時間セツテイングを行ない、抵抗を測
定した。第1図にカプトンHフイルムから得られ
たPYPOを使用した場合の面積抵抗のPYPO/銀
比率への依存性を示す。図から判るように1Ω/
□以下の面積抵抗を得るためには銀の約60重量%
をPYPOに置換えることが可能である。これは体
積%に換算すると90%となり、PYPOによる著し
い増量効果が発揮されたことになる。
ここでカーボンとの比較を行なうと、同様の手
法でカーボン粉末を銀ペーストに添加した場合、
混合比はカーボン10%が最高で、それ以上の場合
はペーストの凝集が起き、印刷などによる皮膜化
が不可能になつた。カーボン混入10%の銀ペース
トの面積抵抗は約0.2Ω/□PYPOの場合の約2倍
であつた。
次に、Pyre−MLから得られた超微粒子PYPO
を用いた場合の結果を第1表に示す。
The present invention relates to a conductive composition obtained by dispersing a novel conductive powder in a binder, which is achieved by partially replacing silver in a conventional silver-based conductive film with a novel conductive material. It provides a high performance conductive film. Furthermore, the present invention uses a highly conductive material (hereinafter abbreviated as pyrolytic polymer) obtained by thermally decomposing a heat-resistant polymer as a new conductive material.
The present invention relates to a novel conductive composition characterized by using PYPO). Films obtained by dispersing silver or carbon powder in polymers are widely used, particularly in the electronics field, as conductors for printed circuit boards, resistors, or heaters. A silver-based conductive film generally has a specific resistance of 10 -3 Ωcm or less, and a low sheet resistance of 1 Ω/□ or less. on the other hand,
Carbon-based films have a specific resistance of 10 -2 Ωcm or more, and it is difficult to obtain a sheet resistance of 10 Ω/□ or less. The cost of silver-based coatings is thought to be 10 to 50 times that of carbon coatings due to fluctuations in the price of silver, and this is a new conductive film that fills the gap between silver and carbon in terms of price and performance (resistance value). The appearance of a film has long been desired. One possibility for such a purpose is to mix silver and carbon, but carbon and silver are poorly compatible and it is difficult to disperse each in a common binder. For this reason, when these are mixed, carbon agglomeration occurs, making it impossible to form a low-resistance film. Other methods include conductive films using copper or nickel, but these also have many problems with dispersibility, oxidation resistance, etc., and reliable products have not been obtained. There is also a coating using powder that coats the surface of copper with silver, but there is almost no cost advantage. In addition, as an approach from carbon, there is the addition of graphite (graphite) or the production of a graphite film, but graphite, like silver, is not compatible with carbon and is often used. Cannot be mixed. Carbon-
The general characteristics of graphite-based films include:
In many cases, the particles are aggregated and dispersed in the binder, resulting in poor adhesion as a film, making it almost impossible to use it as a conductive adhesive. In addition, a recent technique that has been attracting attention is a proposal to use scale-like graphite or carbon. The high conductivity of the silver-based conductive film
Considering that this method is derived from the fact that the effective contact path between the powders is increased by using scaly silver powder, this method is considered to be highly possible, but at this stage there is no There is no scaly carbon or graphite that can be stably supplied at low cost. Therefore, the present invention aims to reduce the cost of an expensive silver-based conductive film and to obtain a conductive film having a resistance value lower than that of a carbon-based film.
In particular, the present invention uses a pyrolytic polymer (PYPO), which is a novel conductor powder and has very high compatibility with silver and a binder, mixed with silver to reduce the amount of silver used and to reduce the area resistance. This method produces a conductive film with a resistance of 1Ω/□ or less. The novel conductor PYPO disclosed in the present invention is obtained by thermally decomposing nitrogen-containing heteropolymers, which are generally called heat-resistant polymers such as polyimide, polyamide-imide, polyoxadiazole, and polybenzothiazole, in a vacuum. The resulting organic conductor is classified as a low-dimensional conductor. Low-dimensional conductors are “chemistry and industry”
As described on pages 221 to 240 of the April 1974 issue, unlike conventional three-dimensional conductors,
It is a general term for materials that have high conductivity only in the two-dimensional direction or in the planar direction (two-dimensional). PYPO is a polymer condensed through thermal decomposition, and is expected to have a planar structure similar to that of graphite, making it a two-dimensional conductor. Dupont's Kapton H film (polyimide) undergoes thermal decomposition in vacuum and becomes 5x
The change to a conductor of 10 -2 Ω・cm was reported by IBM's S.
This was reported by D.Bruck in 1964.
(Polymer, Vol. 5, p. 435, 1964). Furthermore, the Russian School reported in 1963 that polyacrylonitrile changes to 1.5×10 -1 Ωcm by thermal decomposition. (AVAirapetjanc et al., Dok1.Akad.
Nauk SSSR Vol. 148, p. 605, 1963). like this
Although PYPO has the advantage of high heat resistance, it is expected to be inferior to carbon and graphite as a low-resistance material, and it has been pointed out that its mechanical properties are significantly inferior to ordinary polymers, such as filmability and flexibility. However, research and development has not progressed since then. However, as a result of recent remarkable research into low-dimensional conductors, many organic low-molecular compounds and polymer compounds that exhibit metallic conductivity have been synthesized, and some exhibit higher conductivity than silver and others exhibit superconductivity. etc. have been discovered. In addition, remarkable progress has been made in molecular-level design and synthesis technology aimed at achieving high conductivity. (Refer to Yoshimura, "Chemistry and Industry" Vol. 32, No. 4, p. 225, April 1974 issue) Therefore, the present invention focuses on such viewpoints and the fact that it has outstanding heat resistance,
A novel conductive composition using PYPO is provided. The first feature of the present invention is that PYPO powder is dispersed in a polymeric binder to form a conductive composition, and the advantages of PYPO for this application are listed below. is based on factual findings. That is, 1 PYPO is a very brittle solid, so it can be easily processed into a powder of 1 μm or less by mechanical methods. 2. Since the shape of the polymer before thermal decomposition can be freely selected, fine particles of PYPO can be easily obtained by producing PYPO using, for example, an ultra-thin film by the casting method or ultra-fine particles by the spray-drying method as a starting material. Furthermore, the PYPO obtained from the ultra-thin film becomes a scaly powder. 3 Unlike graphite, PYPO is an organic material containing many hydrogen atoms, so it is compatible with most polymeric binders and solvents, and shows almost no formation of secondary particles due to aggregation. Among these, 1 and 3 mean that they meet the basic requirements when manufacturing filler matrix composite materials. Further, the starting material of PYPO used in the present invention is characterized in that it is polyimide, polyamide-imide, polyoxadiazole, and polybenzothiazole, or a mixture thereof, all of which have a resistance of 2×10 -2 Ω.
It is a material that exhibits a specific resistance of less than cm. For example, polyimide was previously reported to have a PYPO of 5 x 10 -2 Ωcm, but by using highly pure raw materials and treating it at 850°C for 4 hours, PYPO of 1.4 x 10 -2 Ωcm was obtained. The specific gravity of polyimide PYPO was 1.8 (polyimide was 1.4) and the heat resistance temperature was 900°C. Polyamide-imide PYPO is produced under similar conditions,
It showed a specific resistance of 2×10 -2 Ωcm. Polyoxadiazole had a specific resistance of 2×10 -2 and 1×10 -2 Ωcm as a result of treatment at 700°C and 800°C, respectively. Further, polybenzothiazole had a specific resistance of 1×10 -2 Ωcm or less when treated at 850°C. Note that the starting materials for PYPO used in the present invention are not limited to the above materials, and include polyimide copolymers such as polyester-imide, polybenzimidazole, polybenzoxazole, polythiadiazole, polyoxadiazolyl, triazole, Heat-resistant polymers consisting of nitrogen-containing heterocycles such as polyquinoxaline and polyimidazopyrrolone are also used. Further, another feature of PYPO that makes the present invention effective is that even when mixed with silver, PYPO does not undergo any chemical reaction with silver, and does not cause any aggregation of silver particles and PYPO particles. As described above, PYPO has properties that are very advantageous for forming conductive compositions when dispersed in a polymeric binder, and is also highly compatible with silver, making it possible to use silver-PYPO as a filler. The resulting film has become a high-performance conductive film. As mentioned earlier, the gap in area resistance between the silver-based conductive film and the carbon-based film is 1 to 10 Ω/□, but even when obtaining a resistance of 1 Ω/□ or less, at least 50 %PYPO
It became possible to replace it by This is approximately 80% when converted to volume %, and it can be seen that the effect of reducing the amount of silver used is remarkable. The sheet resistance of PYPO alone was 5Ω/□ or more for the film without binder and 1KΩ/□ for the film containing binder, so
The low resistance value of the silver-PYPO composite film was mentioned above.
This should be seen as a result of taking advantage of PYPO's features. Examples are shown below to explain specific effects of the present invention. Example 1 A polyimide film is commercially available, for example, as Kapton H film from DuPont. In addition, varnishes such as Dupont's Pyre-ML or Monsanto's Solution7W are also available. Here, an example is shown in which both a 12.5μ Kapton H film and a 1μ film obtained by casting Pyre-ML on glass are used as starting materials. Put the above polyimide film into a quartz tube.
It was pyrolyzed at a temperature of 850°C in a vacuum of 10 -3 Torr. Thermal decomposition starts before the sample reaches 850°C and gases such as NOx and COx are released, but the treatment time was set at 4 hours to allow the resistance value to stabilize. The specific resistance of PYPO obtained by thermal decomposition was 1.4×10 -2 Ωcm or less. Next, the obtained PYPO was pulverized in a centrifugal ball mill for about 1 hour, and further pulverized in an attritor for 2 hours. The particle size of the powder obtained from Kapton H was 5μ or less, and that of PYPO from Pyre-ML was 1μ or less. A paste was prototyped using commercially available silver paste powder as the silver powder, polyester resin as the binder, and isophorone solvent. The film was printed on a polyester or ceramic substrate using a 200 mesh screen. After printing, it was set at 150°C for 1 hour and the resistance was measured. Figure 1 shows the dependence of the sheet resistance on the PYPO/silver ratio when PYPO obtained from Kapton H film is used. As you can see from the figure, 1Ω/
□Approximately 60% by weight of silver to obtain the following sheet resistance
It is possible to replace PYPO with PYPO. This is 90% when converted to volume %, indicating that PYPO exerted a significant volume increase effect. Comparing this with carbon, when carbon powder is added to silver paste using the same method,
The highest mixing ratio was 10% carbon, and if it was higher than that, the paste would agglomerate, making it impossible to form a film by printing. The sheet resistance of the silver paste containing 10% carbon was about twice that of 0.2Ω/□PYPO. Next, ultrafine particles of PYPO obtained from Pyre-ML
Table 1 shows the results when using .
【表】
第1図に示した粗いPYPOの場合と比較する
と、明らかに抵抗値の減少が見られる。
実施例 2
ポリアミド−イミド樹脂はアセトアシド、キシ
レンなどを溶剤としたワニスの形のものを出発物
質とし、清浄なガラス基板上に平均5000Åの皮膜
としてキヤストした。200〜250℃の温度で硬化さ
せ、水にガラス基板を浸した後に樹脂皮膜を機械
的に分離して、熱分解処理を施した。熱分解は
850℃で4時間行ない、比重が約1.7の黒色の
PYPOを得た。このPYPOをアトライタにて2時
間粉砕することにより厚さが5000Å以下、径が1
μ以下の鱗片状のPYPO粉末を得た。バインダー
としてフエノキシ樹脂を用いてPYPO−銀ペース
トを試作し、300メツシユのスクリーンにて皮膜
を形成した。PYPOが50重量%(83体積%)以下
では面積抵抗は0.3Ω/□以下で、1Ω/□以下で
は最高75%のPYPOの添加が可能であつた。
また、同じポリアミドイミドワニスから出発し
て、350℃の雰囲気中でスプレードライすること
により1μ以下の球状ポリアミド−イミド樹脂を
製造した。これを熱分解して得られるPYPOは
0.8μ以下の径を持つ球形PYPOとなり、同様に
銀と混合して使用できた。しかし、鱗片状PYPO
に比して混合限界は65%と低く、抵抗も約1.5〜
2倍となつていた。
実施例 3
ポリオキサジアゾールおよびポリベンゾチアゾ
ールはイミド系樹脂と同様に熱分解により金属に
近い電導体になる。これらはいずれもフイルムか
ら出発して、処理したPYPOを銀粉末およびエポ
キシ樹脂と共に3本ロールで混練しつつ粉砕し
た。200メツシユのスクリーンで印刷して得られ
た銀−PYPO系皮膜の抵抗値を測定した結果を第
2表に示す。[Table] When compared with the case of coarse PYPO shown in Figure 1, a clear decrease in resistance value can be seen. Example 2 A polyamide-imide resin was cast in the form of a varnish using acetoacide, xylene, etc. as a solvent as a starting material onto a clean glass substrate as a film having an average thickness of 5000 Å. After curing at a temperature of 200 to 250°C, the resin film was mechanically separated after immersing the glass substrate in water and subjected to thermal decomposition treatment. Pyrolysis is
The process was carried out at 850℃ for 4 hours, resulting in a black color with a specific gravity of approximately 1.7.
Got PYPO. By crushing this PYPO with an attritor for 2 hours, the thickness is less than 5000Å and the diameter is 1.
A scaly PYPO powder with a size of less than μ was obtained. A PYPO-silver paste was prototyped using phenoxy resin as a binder, and a film was formed using a 300 mesh screen. When PYPO was 50% by weight (83% by volume) or less, the sheet resistance was 0.3Ω/□ or less, and when PYPO was 1Ω/□ or less, it was possible to add up to 75% PYPO. Further, starting from the same polyamide-imide varnish, a spherical polyamide-imide resin of 1 μm or less was manufactured by spray drying in an atmosphere at 350°C. PYPO obtained by pyrolyzing this is
The result was spherical PYPO with a diameter of less than 0.8μ, and it could also be used by mixing it with silver. However, scaly PYPO
The mixing limit is as low as 65% compared to
It had doubled in size. Example 3 Polyoxadiazole and polybenzothiazole, like imide resins, become electrical conductors similar to metals by thermal decomposition. In each case, the treated PYPO was started from a film, and the treated PYPO was kneaded and pulverized with silver powder and epoxy resin using three rolls. Table 2 shows the results of measuring the resistance value of the silver-PYPO film obtained by printing with a 200 mesh screen.
【表】
1Ω/□以下の面積抵抗を得るためのPYPOの
混合、限界はポリオキサジアゾールおよびポリベ
ンゾチアゾールに対してそれぞれ65および70%で
あつた。
以上のように本発明は、窒素を有するヘテロ環
を分子中に持つ耐熱性高分子を熱分解して得られ
る電導性材料PYPOを粉末にして、銀粒子と混合
してバインダー中に分散させて得られる新規な導
電性組成物を提供するものであり、PYPOの添加
量は組成物の面積抵抗を1Ω/□以下にするよう
に制御すればよく、その値は銀との比率で60〜80
重量%となる。実施例で示したように混合の限界
はPYPOの形状(鱗片、球、ブロツク)などによ
り変化するので、一律に限界値を定義することは
できない。なお以上の例は銀ペーストへPYPOを
添加する様な例であるが、銀以外に銀−パラジウ
ム系、金系、白金−金系、金−パラジウム系、パ
ラジウム系、白金−パラジウム系のペーストにも
PYPOを添加する事が可能であることは言うまで
もない。
なお、本発明により得られる導電性組成物は、
エレクトロニクス分野において、導線、ヒータ、
抵抗体など、従来の銀およびカーボン皮膜の間の
コスト的、性能的ギヤツプを埋めるものとして、
広く利用できる。[Table] Mixing of PYPO to obtain a sheet resistance of less than 1 Ω/□, the limits were 65 and 70% for polyoxadiazole and polybenzothiazole, respectively. As described above, the present invention involves powdering the conductive material PYPO obtained by thermally decomposing a heat-resistant polymer having a nitrogen-containing heterocycle in the molecule, mixing it with silver particles, and dispersing it in a binder. The purpose is to provide a novel conductive composition, and the amount of PYPO added may be controlled so that the sheet resistance of the composition is 1Ω/□ or less, and the value is 60 to 80% in ratio to silver.
% by weight. As shown in the examples, the limit of mixing varies depending on the shape of PYPO (scales, spheres, blocks), etc., so it is not possible to uniformly define the limit value. Note that the above example is an example of adding PYPO to silver paste, but in addition to silver, it can also be added to silver-palladium, gold, platinum-gold, gold-palladium, palladium, and platinum-palladium pastes. too
Needless to say, it is possible to add PYPO. In addition, the conductive composition obtained by the present invention is
In the electronics field, conductors, heaters,
To fill the cost and performance gap between conventional silver and carbon films, such as resistors,
Widely available.
図はポリイミドから得られる熱分解高分子
(PYPO)と銀およびポリエステル系バインダー
から成る導電性組成物の面積抵抗とPYPOの組成
比の関係を示す図である。
The figure shows the relationship between the area resistance and the composition ratio of PYPO of a conductive composition comprising a pyrolytic polymer (PYPO) obtained from polyimide, silver, and a polyester binder.
Claims (1)
熱分解して得られる電導体の粉末、銀粉末および
高分子バインダーを含むことを特徴とする導電性
組成物。 2 チツ素原子を含むヘテロ環を有する高分子
が、ポリイミド、ポリアミド−イミド、ポリオキ
サジアゾール、ポリベンゾチアゾールのいずれか
あるいはその混合物である特許請求の範囲第1項
記載の導電性組成物。[Scope of Claims] 1. An electrically conductive composition comprising a conductor powder obtained by thermally decomposing a polymer having a heterocycle containing a nitrogen atom, silver powder, and a polymer binder. 2. The conductive composition according to claim 1, wherein the polymer having a heterocycle containing a nitrogen atom is polyimide, polyamide-imide, polyoxadiazole, polybenzothiazole, or a mixture thereof.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3930580A JPS56136406A (en) | 1980-03-26 | 1980-03-26 | Conductive composition |
| US06/247,316 US4401590A (en) | 1980-03-26 | 1981-03-25 | Conductive pyrolytic product and composition using same |
| US06/496,300 US4497728A (en) | 1980-03-26 | 1983-05-19 | Conductive pyrolytic product and composition using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3930580A JPS56136406A (en) | 1980-03-26 | 1980-03-26 | Conductive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56136406A JPS56136406A (en) | 1981-10-24 |
| JPS6142949B2 true JPS6142949B2 (en) | 1986-09-25 |
Family
ID=12549399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3930580A Granted JPS56136406A (en) | 1980-03-26 | 1980-03-26 | Conductive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56136406A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0440653U (en) * | 1990-07-31 | 1992-04-07 |
-
1980
- 1980-03-26 JP JP3930580A patent/JPS56136406A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0440653U (en) * | 1990-07-31 | 1992-04-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56136406A (en) | 1981-10-24 |
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