JPS6143423B2 - - Google Patents

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Publication number
JPS6143423B2
JPS6143423B2 JP55179886A JP17988680A JPS6143423B2 JP S6143423 B2 JPS6143423 B2 JP S6143423B2 JP 55179886 A JP55179886 A JP 55179886A JP 17988680 A JP17988680 A JP 17988680A JP S6143423 B2 JPS6143423 B2 JP S6143423B2
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JP
Japan
Prior art keywords
thickness
magnetic
continuous casting
micro
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55179886A
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Japanese (ja)
Other versions
JPS57104654A (en
Inventor
Kozo Hoshino
Yoshihiro Tsuji
Yoshinobu Kitao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
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Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP55179886A priority Critical patent/JPS57104654A/en
Publication of JPS57104654A publication Critical patent/JPS57104654A/en
Publication of JPS6143423B2 publication Critical patent/JPS6143423B2/ja
Granted legal-status Critical Current

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  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Continuous Casting (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は磁気デイスク用A基合金板の製法に
関し、詳細には、(1)マトリツクス中の非金属介在
物及び金属間化合物を少なくすると共にこれらを
均一微細に分散させ、且つ(2)マトリツクスのマク
ロ組織を均一微細にし、切削及び研磨によつて容
易に平滑性を優れたデイスク基盤を与える様な、
磁気デイスク用A基合金板の製法に関するもの
である。 電子計算機における記憶媒体として最も汎用さ
れている磁気デイスク基盤は、A基合金板の表
面を切削加工して所定の厚さにし、更に精密研磨
もしくは精密切削した表面に磁性体薄膜を被覆し
た構造からなり、この磁性体薄膜を磁化させるこ
とによつて信号を記憶する。この種の磁気デイス
ク基盤には一般に下記の特性が要求される。 (1) 磁気ヘツドと磁気デイスク基盤との間隙を一
定に保ち記憶の応答特性を安定化させる為、精
密研磨もしくは精密切削後の表面精度が良好で
あること。即ち基盤全体のひずみや微少うねり
が少ないこと。 (2) 磁性体薄膜を一定厚さとするのに悪影響を及
ぼす突起や穴等の表面欠陥が少なく且つ小さい
こと。またたとえ微細な欠陥であつてもそれが
集合体となつていないこと。 (3) 基盤を作製する際の切削加工や研磨が安定し
て行なえ、且つ使用時の高速回転に十分耐え得
る機械的強度を有すること。 (4) 非磁性、軽量であること。 (5) 耐食性が良好で且つある程度の耐熱性を有す
ること。 一方磁気デイスク用基盤として現在最も汎用さ
れているのはAA規格5086合金であるが、近年の
磁気デイスクに対する大容量化、高密度化の要求
は益々強くなり、1ビツト当りの磁化領域は益々
微少化されると共に、磁性体膜の薄肉化及び磁気
ヘツドと磁気デイスクの間隙の減少化が望まれて
いる。しかし上記のAA5086合金では、前記諸特
性のうち表面精度及び表面欠陥の点で高密度化に
適合できない。 本発明者等は前述の様な状況のもとで、まず良
好な表面精度が得られない原因を究明すべく研究
を行なつたところ、以下の事実が確認された。 〔A〕 現在までのデイスク基盤は表面を精密研
磨すると素材の圧延方向と平行な方向に細長く
伸びた周期0.5〜2mm程度、最大高さ0.10〜0.15
μRmax程度の微少うねりが存在した。 この原因を追求したところ、以下のことが判
明した。 (1) デイスク基盤の表面研磨後の微少うねりの
周期とマクロ組織とは対応しており、マクロ
組織が粗いほど微少うねりの高さが大きくな
る。 (2)―通常のDC鋳造法(鋳塊厚300〜600mm程
度)において粗いマクロ組織が形成される原
因の1つは、鋳塊のサブ組織の粗さ(金属間
化合物の偏在)であり、鋳塊組織を微細にす
れば製品のマクロ組織も微細になり、微少う
ねりが軽減する。 (2)−また通常の鋳塊から圧延する場合に粗い
マクロ組織が形成される今1つの原因は下記
の通りである。 熱間圧延終了後のマクロ組織は、通常熱間
圧延初期の結晶粒が引伸ばされた組織であ
る。即ち熱間圧延中の再結晶は動的再結晶で
あり、わずかな加工量でも次々と再結晶する
為個々の再結晶粒はたとえ微細であつても熱
間圧延初期の結晶粒径と非常に密接な関係が
あり、引き伸ばされた初期の結晶粒の中に若
干方位の異なつた再結晶粒が存在する状態に
なつている。従つて通常の鋳造法で微少うね
りを軽減させる為には、鋳造条件及び熱間圧
延条件をコントロールしてマクロ組織を微細
にする必要がある。 〔B〕AA5086合金製のデイスク基盤には、マト
リツクス中に直径もしくは長さが15μm程度の
金属間化合物が多数存在しており、この金属間
化合物は主としてA―Fe―Mn系共晶化合物
とMg2Si系共晶化合物であり、これらの化合物
はマトリツクスとは不連続で且つマトリツクス
よりも硬度が高いから、基盤を切削加工及び研
磨加工する際に表面に突起状欠陥として残るか
或はこれが脱落してその後に穴欠陥が形成され
る。その結果、切削及び研磨を十分に行なつて
も表面精度を十分に高めることができない。 本発明者等は前述の様な究明結果を基に、鋳塊
内に生成する晶出物を可及的に微細化し且つミク
ロ偏析を防止してやれば、A基合金板の表面精
度を大幅に改善できるであろうと考え、かかる着
想を実現すべく添加合金元素の種類及び添加量並
びに鋳造条件等について鋭意研究を進めてきた。
その結果、添加合金元素の種類及び添加量を限定
すると共に、特に連続鋳造によつて製造される鋳
造物を極力薄肉にしてやれば、急冷効果によつて
晶出物が著しく微細化し、且つ結晶組織も微細化
してミクロ偏析も激減し、上記の目的が見事に達
成されることを知つた。 本発明はかかる知見を基にして完成されたもの
であつて、その構成は、合金元素としてMn:0.9
〜1.4%を含有すると共に、Ti:0.03〜0.08%及
び/又はB:0.01%以下を含んでなるA基合金
溶湯を、板厚が4〜15mmとなる様に連続鋳造し、
更に圧延するところに要旨が存在する。 まず添加合金元素について説明する。 Mnは合金板の機械的強度及び耐食性を高める
のに不可欠の成分であり、0.9%未満ではこれら
の効果が有効に発揮されない。しかし多すぎると
金属間化合物の生成量が多くなつて偏析が起こ
り、晶出物が粗大化するので1.4%以下に抑える
べきである。 Ti及びBは鋳塊組織を微細化しミクロ偏析を
防止するのに不可欠の元素であり、これらの効果
を有効に発揮させる為にはTi:0.03%以上及び微
量のB(好ましくは0.0005%以上)を単独で或は
併用しなければならない。しかしTiが0.08%、B
が0.01%を越れると、電気化学的吸着現象を応用
したフイルターによる溶湯通過処理段階で過剰分
が殆んど除去されてしまうから、これ以上の添加
は無駄である。 尚本発明でベース金属として使用されるAは
99%以上の純度を有するものであり、A中に不
可避的に含まれるFe、Si等は、不純物量程度で
ある限り晶出物の粗大化は殆んどなく実害はな
い。 本発明では上記成分組成のA合金を溶解した
後、電気化学的吸着現象を応用したフイルターを
常法に従つて通過させて溶湯中の非金属介在物を
除去し、更に連続鋳造を行なうが、目的達成の為
には連続鋳造工程で板厚を4〜15mmにしなければ
ならない。従来の連続鋳造法では厚さが300〜600
mm程度のスラブを得るのが通例である。ところが
本発明者等が実験により確認した結果では、スラ
ブが厚肉であると急冷が困難になり凝固時に晶出
物が粗大化するから、合金組成を如何に調整して
みても晶出物の大きさご3μm以下に微細化する
ことはできない。ところが連続鋳造工程で板厚を
15mm以下に設定すると、鋳造板が極めて急速に冷
却される結果、晶出物を著しく微細化できると共
に結晶粒も微細化される。殊に本発明で用いられ
る組成は過冷却現象を起こし易いA―Mn系合
金であるから、急冷による晶出物微細化効果が如
実に発揮される。 ちなみに従来の連続鋳造法で得た厚さ300〜600
mm程度のスラブの晶出物サイズは約12μmである
のに対し、厚さを15mm以下に設定すると冷却速度
を10倍以上に高めることができ、それに伴なつて
晶出物サイズは3μm以下になる。しかも結晶粒
が微細化できる為ミクロ偏析も殆んど起こらな
い。 従つてその後熱間、温間或は冷間圧延して得ら
れるA基合金板は、極めて微細な晶出物が均一
に分散した状態で得ることができ、これを機械加
工及び研磨加工しても粗大晶出物に起因する凹凸
やミクロ偏析に起因するさざ波現象等を生じる恐
れがない。 尚上記の効果からも明らかな様に、連続鋳造時
の板厚は薄い程好ましいが、デイスク基盤の打抜
加工、切削加工及び研磨加工の精度面から少なく
とも50%以上の冷間圧延が必要であり、4mmを下
限と定めた。一方板厚が15mmを越えると冷却速度
を十分に高め得なくなり、晶出物の微細化効果が
満足に発揮されない。 尚本発明において連続鋳造とは半連続鋳造を含
むものである。 本発明は概略以上の様に構成されており、その
効果を要約すれば下記の通りである。 (1) 添加合金元素の種類及び添加量を限定すると
共に、特に連続鋳造時の板厚を可及的に薄くし
て板材を急冷する様にしたから、晶出物を著し
く微細化でき且つマトリツクス中に均一に分散
させることができる。従つて粗大晶出物に起因
する表面の凹凸及びミクロ偏析に起因するさざ
波現象を可及的に防止でき、表面精度の高い磁
気デイスク用A基合金板を得ることができ
る。 (2) 従つて磁性体膜の薄肉化、磁気ヘツドと磁気
デイスクの間隙の減少化が可能になり、磁気デ
イスクの大容量化及び高密度化に適合できる。 (3) 機械的強度、耐熱性、耐食性においても従来
品と同等乃至それ以上であり、また製法も簡単
であるから、従来品と同程度の価格で提供でき
る。 次に本発明の実施例を示す。 実施例 第1表に示す組成のA基合金溶湯を、通常用
いられている電気化学的吸着現象を応用したフイ
ルターを通過させて非金属介在物を除去した後、
5mm厚に連続鋳造し、更に冷間圧延して2mm厚の
板材とした。この板材を300℃で2時間歪取焼鈍
した後、デイスク基盤加工の通常の工程に従つ
て、0.1mm切削加工した後340℃で2時間歪取焼鈍
した。次いでバフ研磨して仕上げ、デイスク基盤
としての性能を調べ、下記の結果を得た。
The present invention relates to a method for manufacturing an A-base alloy plate for magnetic disks, and in particular, (1) reduces non-metallic inclusions and intermetallic compounds in the matrix and uniformly and finely disperses them, and (2) improves the quality of the matrix. The macrostructure is made uniform and fine, and it can be easily cut and polished to provide a disk base with excellent smoothness.
The present invention relates to a method for manufacturing an A-base alloy plate for magnetic disks. The magnetic disk substrate, which is most commonly used as a storage medium in electronic computers, has a structure in which the surface of an A-based alloy plate is cut to a predetermined thickness, and then a thin magnetic film is coated on the precision-polished or precision-cut surface. By magnetizing this magnetic thin film, signals are stored. This type of magnetic disk substrate is generally required to have the following characteristics. (1) In order to maintain a constant gap between the magnetic head and the magnetic disk base and stabilize the memory response characteristics, the surface accuracy after precision polishing or precision cutting must be good. In other words, there should be little distortion or slight waviness in the entire base. (2) There are few and small surface defects such as protrusions and holes that have an adverse effect on maintaining a constant thickness of the magnetic thin film. Also, even if the defects are minute, they do not form an aggregate. (3) It must be able to stably perform cutting and polishing when manufacturing the base, and have sufficient mechanical strength to withstand high-speed rotation during use. (4) Be non-magnetic and lightweight. (5) Good corrosion resistance and a certain degree of heat resistance. On the other hand, the AA standard 5086 alloy is currently the most commonly used substrate for magnetic disks, but in recent years there has been an increasingly strong demand for larger capacities and higher densities for magnetic disks, and the magnetized area per bit has become smaller and smaller. As the magnetic disks become more compact, it is desired to reduce the thickness of the magnetic film and the gap between the magnetic head and the magnetic disk. However, the above-mentioned AA5086 alloy is not suitable for high density in terms of surface precision and surface defects among the above-mentioned properties. Under the above-mentioned circumstances, the present inventors first conducted research to find out the reason why good surface precision could not be obtained, and the following facts were confirmed. [A] When the surface of conventional disk bases is precisely polished, they elongate in a direction parallel to the rolling direction of the material, with a period of about 0.5 to 2 mm and a maximum height of 0.10 to 0.15.
There was slight waviness on the order of μRmax. When we investigated the cause of this, we found the following. (1) The period of micro-waviness after surface polishing of the disk base corresponds to the macrostructure, and the rougher the macrostructure, the larger the height of the micro-waviness. (2) - One of the causes of the formation of a coarse macrostructure in the normal DC casting method (ingot thickness of approximately 300 to 600 mm) is the roughness of the substructure of the ingot (uneven distribution of intermetallic compounds). If the ingot structure is made finer, the macrostructure of the product will also be made finer, reducing minute waviness. (2) - Another reason why a coarse macrostructure is formed when rolling from a normal ingot is as follows. The macrostructure after hot rolling is usually a structure in which the crystal grains at the initial stage of hot rolling are elongated. In other words, recrystallization during hot rolling is dynamic recrystallization, and even if the working amount is small, recrystallization occurs one after another, so even if the individual recrystallized grains are fine, they are very different from the grain size at the initial stage of hot rolling. There is a close relationship, and recrystallized grains with slightly different orientations exist within the initial elongated grains. Therefore, in order to reduce minute waviness using a normal casting method, it is necessary to control the casting conditions and hot rolling conditions to make the macrostructure fine. [B] In the disk base made of AA5086 alloy, there are many intermetallic compounds with a diameter or length of about 15 μm in the matrix, and these intermetallic compounds are mainly composed of A-Fe-Mn eutectic compounds and Mg. 2 Si-based eutectic compounds. These compounds are discontinuous with the matrix and have higher hardness than the matrix, so when the substrate is cut and polished, they remain as protruding defects on the surface or fall off. Then a hole defect is formed. As a result, even if sufficient cutting and polishing are performed, the surface precision cannot be sufficiently improved. Based on the above-mentioned research results, the present inventors have determined that the surface precision of the A-based alloy sheet can be significantly improved by making the crystallized substances formed in the ingot as fine as possible and preventing micro-segregation. We thought that it would be possible, and in order to realize this idea, we have been conducting intensive research on the types and amounts of added alloying elements, casting conditions, etc.
As a result, by limiting the type and amount of additive alloying elements and by making the castings manufactured by continuous casting as thin as possible, the crystallized material becomes significantly finer due to the rapid cooling effect, and the crystal structure is reduced. It was found that the above objectives were successfully achieved as the particles were made finer and micro-segregation was drastically reduced. The present invention was completed based on this knowledge, and its composition includes Mn as an alloying element: 0.9
Continuously cast an A-based alloy molten metal containing Ti: 0.03 to 0.08% and/or B: 0.01% or less to a plate thickness of 4 to 15 mm,
The gist lies in the fact that it is further rolled. First, the added alloying elements will be explained. Mn is an essential component for increasing the mechanical strength and corrosion resistance of the alloy plate, and if it is less than 0.9%, these effects will not be effectively exhibited. However, if it is too large, the amount of intermetallic compounds produced increases, causing segregation and coarsening of crystallized substances, so it should be kept at 1.4% or less. Ti and B are essential elements for refining the ingot structure and preventing micro-segregation, and in order to effectively exhibit these effects, Ti: 0.03% or more and a trace amount of B (preferably 0.0005% or more) must be used alone or in combination. However, Ti is 0.08%, B
If it exceeds 0.01%, most of the excess will be removed during the molten metal passage treatment stage using a filter that applies electrochemical adsorption phenomena, so adding any more is wasteful. In addition, A used as the base metal in the present invention is
It has a purity of 99% or more, and as long as the Fe, Si, etc. that are unavoidably contained in A are at the level of impurities, there is almost no coarsening of crystallized substances and no actual harm is caused. In the present invention, after melting Alloy A having the above-mentioned composition, it is passed through a filter that applies an electrochemical adsorption phenomenon to remove nonmetallic inclusions in the molten metal, and then continuous casting is performed. In order to achieve this goal, the plate thickness must be reduced to 4 to 15 mm using a continuous casting process. Traditional continuous casting method has a thickness of 300 to 600 mm
It is customary to obtain slabs of the order of mm. However, the results confirmed by the inventors through experiments show that if the slab is thick, rapid cooling becomes difficult and the crystallized substances become coarse during solidification. It is not possible to make the size smaller than 3 μm. However, in the continuous casting process, the plate thickness
When the thickness is set to 15 mm or less, the cast plate is cooled extremely rapidly, and as a result, the crystallized substances can be made extremely fine, and the crystal grains can also be made fine. In particular, since the composition used in the present invention is an A--Mn alloy that is susceptible to supercooling, the effect of quenching to refine crystallized substances is clearly exhibited. By the way, the thickness obtained by conventional continuous casting method is 300 to 600 mm.
The size of crystallized particles in a slab of about mm is about 12 μm, but if the thickness is set to 15 mm or less, the cooling rate can be increased by more than 10 times, and the size of crystallized particles can be reduced to 3 μm or less. Become. Moreover, since the crystal grains can be made finer, micro-segregation hardly occurs. Therefore, the A-base alloy plate obtained by subsequent hot, warm or cold rolling can be obtained in a state in which extremely fine crystallized substances are uniformly dispersed, and this can be obtained by machining and polishing. Also, there is no risk of causing unevenness caused by coarse crystallized substances or ripple phenomena caused by micro-segregation. As is clear from the above effects, the thinner the plate thickness during continuous casting, the better, but cold rolling of at least 50% or more is required from the viewpoint of accuracy in punching, cutting, and polishing of the disk base. Yes, the lower limit was set at 4 mm. On the other hand, if the plate thickness exceeds 15 mm, the cooling rate cannot be increased sufficiently, and the effect of refining crystallized substances cannot be satisfactorily exhibited. In the present invention, continuous casting includes semi-continuous casting. The present invention is roughly constructed as described above, and its effects can be summarized as follows. (1) In addition to limiting the type and amount of additive alloying elements, the thickness of the plate during continuous casting was made as thin as possible and the plate material was rapidly cooled, so crystallized substances could be made extremely fine and the matrix can be uniformly dispersed throughout. Therefore, surface irregularities caused by coarse crystallized substances and ripple phenomena caused by micro-segregation can be prevented as much as possible, and an A-based alloy plate for magnetic disks with high surface precision can be obtained. (2) Therefore, it is possible to reduce the thickness of the magnetic film and the gap between the magnetic head and the magnetic disk, making it possible to adapt to larger capacities and higher densities of magnetic disks. (3) Mechanical strength, heat resistance, and corrosion resistance are the same as or better than conventional products, and the manufacturing method is simple, so it can be provided at a price comparable to conventional products. Next, examples of the present invention will be shown. Example A molten A-based alloy having the composition shown in Table 1 was passed through a commonly used filter that applied the electrochemical adsorption phenomenon to remove nonmetallic inclusions.
It was continuously cast to a thickness of 5 mm and further cold rolled to a plate material of 2 mm thickness. This plate material was strain-relief annealed at 300°C for 2 hours, then cut to 0.1 mm according to the usual process for disk substrate processing, and strain-relief annealed at 340°C for 2 hours. It was then buffed and finished, and its performance as a disk base was examined, and the following results were obtained.

【表】 〔性能試験結果〕 微少うねり:0.01μmRmax (通常は0.1μmRmax程度) 晶出物最大サイズ:2μm (通常は15μm程度) 機械的性質 耐力(Kg/mm2):17.6 抗張力(Kg/mm2):20.4 伸び(%) :12.5 上記の結果からも明らかなように、本発明によ
つて得たA基合金板は極めて高い表面精度を示
すと共に機械的性質も良好である。
[Table] [Performance test results] Micro waviness: 0.01μmRmax (usually about 0.1μmRmax) Maximum crystallized size: 2μm (usually about 15μm) Mechanical properties Proof strength (Kg/mm 2 ): 17.6 Tensile strength (Kg/mm 2 ): 20.4 Elongation (%): 12.5 As is clear from the above results, the A-based alloy plate obtained by the present invention exhibits extremely high surface precision and also has good mechanical properties.

Claims (1)

【特許請求の範囲】[Claims] 1 合金元素としてMn:0.9〜1.4%を含有する
他、Ti:0.03〜0.08%及び/若しくはB:0.01%
以下を含んでなるA基合金溶湯を、板厚が4〜
15mmとなる様に連続鋳造し、更に圧延することを
特徴とする磁気デイスク用A基合金板の製法。
1 Contains Mn: 0.9 to 1.4% as an alloying element, as well as Ti: 0.03 to 0.08% and/or B: 0.01%
The A-base alloy molten metal containing the following has a plate thickness of 4 to 4
A method for producing an A-based alloy sheet for magnetic disks, which is characterized by continuous casting to a thickness of 15 mm and further rolling.
JP55179886A 1980-12-18 1980-12-18 Manufacture of al alloy plate for magnetic disk Granted JPS57104654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55179886A JPS57104654A (en) 1980-12-18 1980-12-18 Manufacture of al alloy plate for magnetic disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55179886A JPS57104654A (en) 1980-12-18 1980-12-18 Manufacture of al alloy plate for magnetic disk

Publications (2)

Publication Number Publication Date
JPS57104654A JPS57104654A (en) 1982-06-29
JPS6143423B2 true JPS6143423B2 (en) 1986-09-27

Family

ID=16073611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55179886A Granted JPS57104654A (en) 1980-12-18 1980-12-18 Manufacture of al alloy plate for magnetic disk

Country Status (1)

Country Link
JP (1) JPS57104654A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6357735A (en) * 1986-08-27 1988-03-12 Sky Alum Co Ltd Rolled sheet of heat resistant aluminum alloy and its production
WO2017188320A1 (en) * 2016-04-27 2017-11-02 株式会社Uacj Substrate for magnetic disk

Also Published As

Publication number Publication date
JPS57104654A (en) 1982-06-29

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