JPS6144471Y2 - - Google Patents
Info
- Publication number
- JPS6144471Y2 JPS6144471Y2 JP6300681U JP6300681U JPS6144471Y2 JP S6144471 Y2 JPS6144471 Y2 JP S6144471Y2 JP 6300681 U JP6300681 U JP 6300681U JP 6300681 U JP6300681 U JP 6300681U JP S6144471 Y2 JPS6144471 Y2 JP S6144471Y2
- Authority
- JP
- Japan
- Prior art keywords
- airtight container
- chassis
- microwave integrated
- integrated circuit
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000010355 oscillation Effects 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
本考案は、マイクロ波集積回路を収容する気密
容器の端子部の周囲又は前記気密容器が実装され
るシヤーシの端子受け部の周囲に、段差を設ける
ことによりマイクロ波の漏洩、共振、発振等の動
作不良を改善した気密容器取付部の構造に関す
る。[Detailed description of the invention] The present invention provides a microwave integrated circuit by providing a step around the terminal portion of an airtight container housing a microwave integrated circuit or around the terminal receiving portion of a chassis in which the airtight container is mounted. This invention relates to the structure of an airtight container attachment part that improves malfunctions such as leakage, resonance, and oscillation.
従来、第１図に示すように、マイクロ波集積回
路１を収容した気密容器２のシヤーシ３への取付
部は、気密容器２とシヤーシ３とが全体にわたつ
て密接する構造となつている。この場合、気密容
器２の端子部５とシヤーシ３の端子受部６とから
ある端子接続部４に反り等による接触不良部８が
あると、わずかな間隙であつてもマイクロ波の漏
洩が起こり、回路の動作不安定、さらには発振を
起し、マイクロ波集積回路本来の性能を悪化させ
てしまうという問題があつた。 Conventionally, as shown in FIG. 1, the attachment portion of an airtight container 2 containing a microwave integrated circuit 1 to a chassis 3 has a structure in which the airtight container 2 and the chassis 3 are in close contact with each other throughout. In this case, if there is a poor contact part 8 due to warping or the like in the terminal connection part 4 between the terminal part 5 of the airtight container 2 and the terminal receiving part 6 of the chassis 3, microwave leakage may occur even if there is a small gap. However, there has been a problem that the circuit operation becomes unstable and oscillation occurs, deteriorating the inherent performance of the microwave integrated circuit.
本考案は上述の問題を解決し、マイクロ波集積
回路本来の性能を安定に発揮できるマイクロ波集
積回路用気密容器の取付部の構造を提供すること
を目的とする。 An object of the present invention is to solve the above-mentioned problems and provide a structure for a mounting part of an airtight container for a microwave integrated circuit, which can stably exhibit the original performance of the microwave integrated circuit.
この目的のために本考案は、マイクロ波集積回
路を収容する気密容器と該気密容器を取付けるシ
ヤーシとの間で、該気密容器の端子部と該シヤー
シの端子受部との接続部周囲に、段差状の間隙を
形成したものである。 For this purpose, the present invention provides, between an airtight container accommodating a microwave integrated circuit and a chassis to which the airtight container is attached, around the connection between the terminal part of the airtight container and the terminal receiving part of the chassis. A stepped gap is formed.
以下図面を参照して本考案を実施例につき説明
する。 Embodiments of the present invention will be described below with reference to the drawings.
第２図ａ，ｂに本考案のそれぞれの実施例を示
す。第２図ａはマイクロ波集積回路１を収容した
気密容器２の端子部５の周囲に段差７を設けた実
施例であり、第２図ｂはシヤーシ３の端子受部６
の周囲に段差７を設けた実施例である。第２図
ａ，ｂともに、気密容器２とシヤーシ３との接触
は端子接続部４の周辺のみで接触する。このため
気密容器２とシヤーシ３間に反り等の歪があつて
もこの反りは段差７による気密容器、シヤーシ間
の間隙で吸収され、端子接続部には影響を与え
ず、端子接続部４の接触は確保される。 FIGS. 2a and 2b show respective embodiments of the present invention. FIG. 2a shows an embodiment in which a step 7 is provided around the terminal portion 5 of the airtight container 2 housing the microwave integrated circuit 1, and FIG. 2b shows the terminal receiving portion 6 of the chassis 3.
This is an embodiment in which a step 7 is provided around the . In both FIGS. 2a and 2b, the airtight container 2 and the chassis 3 are in contact only around the terminal connection part 4. Therefore, even if there is a warpage or other distortion between the airtight container 2 and the chassis 3, this warp is absorbed by the gap between the airtight container and the chassis due to the step 7, and does not affect the terminal connection part, and the terminal connection part 4. Contact will be ensured.
以上のことから、端子接続部の接触不良に起因
するマイクロ波の漏洩、共振、発振等の動作不良
を防止し、マイクロ波集積回路本来の性能を安定
に発揮できる。また従来の構造では、加工上気密
容器とシヤーシとを全面にわたつて高い平担度を
出す必要があつたが、本考案ではこのような製造
上の難点も解決される効果がある。 From the above, malfunctions such as microwave leakage, resonance, and oscillation caused by poor contact at the terminal connection portions can be prevented, and the original performance of the microwave integrated circuit can be stably exhibited. Furthermore, in the conventional structure, it was necessary to provide a high degree of flatness over the entire surface of the airtight container and the chassis, but the present invention has the effect of solving such manufacturing difficulties.
第１図は従来のマイクロ波集積回路用容器の取
付部の概略的な縦断面図、第２図ａ，ｂはそれぞ
れ本考案の実施例を示す概略的な縦断面図であ
る。
１……マイクロ波集積回路、２……気密容器、
３……シヤーシ、４……端子接続部、４……端子
部、６……端子受部、７……段差。
FIG. 1 is a schematic vertical sectional view of a mounting portion of a conventional microwave integrated circuit container, and FIGS. 2a and 2b are schematic vertical sectional views showing an embodiment of the present invention, respectively. 1...Microwave integrated circuit, 2...Airtight container,
3... Chassis, 4... Terminal connection section, 4... Terminal section, 6... Terminal receiving section, 7... Step.
Claims (1)
密容器を取付けるシヤーシとの間で、該気密容器
の端子部と該シヤーシの端子受部との接続部周囲
に、段差状の間隙を形成したことを特徴とするマ
イクロ波集積回路用気密容器の取付部の構造。 A step-shaped gap is formed between an airtight container housing a microwave integrated circuit and a chassis to which the airtight container is attached, around a connecting portion between a terminal portion of the airtight container and a terminal receiving portion of the chassis. Features the structure of the mounting part of the airtight container for microwave integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6300681U JPS6144471Y2 (en) | 1981-04-30 | 1981-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6300681U JPS6144471Y2 (en) | 1981-04-30 | 1981-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57175471U JPS57175471U (en) | 1982-11-05 |
| JPS6144471Y2 true JPS6144471Y2 (en) | 1986-12-15 |
Family
ID=29859145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6300681U Expired JPS6144471Y2 (en) | 1981-04-30 | 1981-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144471Y2 (en) |
-
1981
- 1981-04-30 JP JP6300681U patent/JPS6144471Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57175471U (en) | 1982-11-05 |
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