JPS6146741U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6146741U
JPS6146741U JP13281484U JP13281484U JPS6146741U JP S6146741 U JPS6146741 U JP S6146741U JP 13281484 U JP13281484 U JP 13281484U JP 13281484 U JP13281484 U JP 13281484U JP S6146741 U JPS6146741 U JP S6146741U
Authority
JP
Japan
Prior art keywords
lid body
semiconductor equipment
stem
lid
annular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13281484U
Other languages
Japanese (ja)
Inventor
深志 木船
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP13281484U priority Critical patent/JPS6146741U/en
Publication of JPS6146741U publication Critical patent/JPS6146741U/en
Pending legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の溶接前の状態を示す断面図
、第２図はその溶接時の状態を示す断面図、第３図は従
来の容器の溶接時の状態を示す断面図である。 １：ｉ体、２：ステム、３：溶接プロジエクション、４
：環状突起、５：半導体片、９：溶接部。Fig. 1 is a cross-sectional view showing an embodiment of the present invention before welding, Fig. 2 is a cross-sectional view showing the welding state, and Fig. 3 is a cross-sectional view showing the welding state of a conventional container. It is. 1: i-body, 2: stem, 3: welding projection, 4
: Annular projection, 5: Semiconductor piece, 9: Welded part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体片を収容する容器が周縁部で溶接結合される蓋体
とステムからなるものにおいて、ステムの蓋体側に、蓋
体に設けられた環状溶接プロジエクションより内側で蓋
体との間の狭い間隙を形成する環状突起が形成されてい
ることを特徴とする半導体装置。In cases where a container containing semiconductor chips is composed of a lid body and a stem that are welded together at the peripheral edge, there is a narrow space between the lid body and the lid body on the inside of the annular weld projection provided on the lid body on the lid side of the stem. A semiconductor device characterized in that an annular projection forming a gap is formed.
JP13281484U 1984-08-31 1984-08-31 semiconductor equipment Pending JPS6146741U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13281484U JPS6146741U (en) 1984-08-31 1984-08-31 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13281484U JPS6146741U (en) 1984-08-31 1984-08-31 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6146741U true JPS6146741U (en) 1986-03-28

Family

ID=30691369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13281484U Pending JPS6146741U (en) 1984-08-31 1984-08-31 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6146741U (en)

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