JPS6149455U - - Google Patents
Info
- Publication number
- JPS6149455U JPS6149455U JP13444284U JP13444284U JPS6149455U JP S6149455 U JPS6149455 U JP S6149455U JP 13444284 U JP13444284 U JP 13444284U JP 13444284 U JP13444284 U JP 13444284U JP S6149455 U JPS6149455 U JP S6149455U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum foil
- semiconductor device
- semi
- coating layer
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案による半導体素子パツケージ
用材料の横断面図、第２図はこの考案による材料
でつくつたパツケージ半体の垂直断面図、第３図
はこの考案による材料でつくつたパツケージ内に
半導体素子を入れた状態の垂直断面図である。
１…半導体素子パツケージ用材料、２…アルミ
ニウム箔、４…半硬化状態の熱硬化性樹脂被覆層
。
Fig. 1 is a cross-sectional view of the material for semiconductor device packages according to this invention, Fig. 2 is a vertical sectional view of a half of the package made from the material according to this invention, and Fig. 3 is a cross-sectional view of the material for semiconductor device packages made from the material according to this invention. FIG. 2 is a vertical cross-sectional view of a state in which a semiconductor element is inserted. 1... Semiconductor element package material, 2... Aluminum foil, 4... Semi-cured thermosetting resin coating layer.
Claims (1)
２と、アルミニウム箔２の粗面に設けられた半硬
化状態の熱硬化性樹脂被覆層４とよりなる半導体
素子パツケージ用材料。 A material for a semiconductor device package, comprising an aluminum foil 2 whose at least one side is roughened, and a semi-cured thermosetting resin coating layer 4 provided on the rough surface of the aluminum foil 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13444284U JPS6149455U (en) | 1984-09-03 | 1984-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13444284U JPS6149455U (en) | 1984-09-03 | 1984-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6149455U true JPS6149455U (en) | 1986-04-03 |
Family
ID=30692953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13444284U Pending JPS6149455U (en) | 1984-09-03 | 1984-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6149455U (en) |
-
1984
- 1984-09-03 JP JP13444284U patent/JPS6149455U/ja active Pending
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