JPS6153934U - - Google Patents

Info

Publication number
JPS6153934U
JPS6153934U JP1984137689U JP13768984U JPS6153934U JP S6153934 U JPS6153934 U JP S6153934U JP 1984137689 U JP1984137689 U JP 1984137689U JP 13768984 U JP13768984 U JP 13768984U JP S6153934 U JPS6153934 U JP S6153934U
Authority
JP
Japan
Prior art keywords
wiring layer
solder bump
bump electrodes
wiring
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984137689U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984137689U priority Critical patent/JPS6153934U/ja
Publication of JPS6153934U publication Critical patent/JPS6153934U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01208—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using permanent auxiliary members, e.g. using solder flow barriers, spacers or alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/287—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1984137689U 1984-09-11 1984-09-11 Pending JPS6153934U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984137689U JPS6153934U (cs) 1984-09-11 1984-09-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984137689U JPS6153934U (cs) 1984-09-11 1984-09-11

Publications (1)

Publication Number Publication Date
JPS6153934U true JPS6153934U (cs) 1986-04-11

Family

ID=30696100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984137689U Pending JPS6153934U (cs) 1984-09-11 1984-09-11

Country Status (1)

Country Link
JP (1) JPS6153934U (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6359376U (cs) * 1986-10-07 1988-04-20
JP2010010611A (ja) * 2008-06-30 2010-01-14 Toshiba Corp プリント回路板及び電子機器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4846866A (cs) * 1971-10-12 1973-07-04
JPS4983860A (cs) * 1972-12-22 1974-08-12
JPS49113163A (cs) * 1973-02-14 1974-10-29

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4846866A (cs) * 1971-10-12 1973-07-04
JPS4983860A (cs) * 1972-12-22 1974-08-12
JPS49113163A (cs) * 1973-02-14 1974-10-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6359376U (cs) * 1986-10-07 1988-04-20
JP2010010611A (ja) * 2008-06-30 2010-01-14 Toshiba Corp プリント回路板及び電子機器

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