JPS6155333U - - Google Patents
Info
- Publication number
- JPS6155333U JPS6155333U JP1984140572U JP14057284U JPS6155333U JP S6155333 U JPS6155333 U JP S6155333U JP 1984140572 U JP1984140572 U JP 1984140572U JP 14057284 U JP14057284 U JP 14057284U JP S6155333 U JPS6155333 U JP S6155333U
- Authority
- JP
- Japan
- Prior art keywords
- byproduct
- supply pipe
- cleaning device
- suction port
- exhaust fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984140572U JPS6155333U (de) | 1984-09-17 | 1984-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984140572U JPS6155333U (de) | 1984-09-17 | 1984-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6155333U true JPS6155333U (de) | 1986-04-14 |
Family
ID=30698928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984140572U Pending JPS6155333U (de) | 1984-09-17 | 1984-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6155333U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12028987B2 (en) | 2021-04-26 | 2024-07-02 | PAC Tech—Packaging Technologies GmbH | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole |
-
1984
- 1984-09-17 JP JP1984140572U patent/JPS6155333U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12028987B2 (en) | 2021-04-26 | 2024-07-02 | PAC Tech—Packaging Technologies GmbH | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole |
| US12349287B2 (en) | 2021-04-26 | 2025-07-01 | PAC Tech—Packaging Technologies GmbH | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole |