JPS6155348U - - Google Patents
Info
- Publication number
- JPS6155348U JPS6155348U JP1984140574U JP14057484U JPS6155348U JP S6155348 U JPS6155348 U JP S6155348U JP 1984140574 U JP1984140574 U JP 1984140574U JP 14057484 U JP14057484 U JP 14057484U JP S6155348 U JPS6155348 U JP S6155348U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- fixed
- dissipation substrate
- semiconductor
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
- H10W72/387—Flow barriers
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の製造工程途中にお
ける斜視図、第２図は第１図のＡ−Ａ線断面図、
第３図は第１図のＢ−Ｂ線断面図、第４図はでき
上がつた半導体装置の斜視図、第５図は本考案の
別の実施例の製造工程中における要部断面図であ
る。
１：放熱用基板、２：半導体素体、３：ろう材
、４：細溝。
Fig. 1 is a perspective view of an embodiment of the present invention in the middle of the manufacturing process, Fig. 2 is a cross-sectional view taken along line A-A in Fig. 1,
3 is a sectional view taken along the line B-B in FIG. 1, FIG. 4 is a perspective view of the completed semiconductor device, and FIG. 5 is a sectional view of main parts of another embodiment of the present invention during the manufacturing process. be. 1: Heat dissipation substrate, 2: Semiconductor element, 3: Brazing material, 4: Thin groove.
Claims (1)
れるものにおいて、放熱用基板が表面から設けら
れた細溝によつて区画される複数の領域を有し、
各半導体素体がそれぞれ該領域内に固定されたこ
とを特徴とする半導体装置。 In a device in which a plurality of semiconductor elements are fixed on the same heat dissipation substrate, the heat dissipation substrate has a plurality of regions partitioned by narrow grooves provided from the surface,
A semiconductor device characterized in that each semiconductor element is fixed within the region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984140574U JPS6155348U (en) | 1984-09-17 | 1984-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984140574U JPS6155348U (en) | 1984-09-17 | 1984-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6155348U true JPS6155348U (en) | 1986-04-14 |
Family
ID=30698930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984140574U Pending JPS6155348U (en) | 1984-09-17 | 1984-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6155348U (en) |
-
1984
- 1984-09-17 JP JP1984140574U patent/JPS6155348U/ja active Pending