JPS6160179U - - Google Patents
Info
- Publication number
- JPS6160179U JPS6160179U JP14514484U JP14514484U JPS6160179U JP S6160179 U JPS6160179 U JP S6160179U JP 14514484 U JP14514484 U JP 14514484U JP 14514484 U JP14514484 U JP 14514484U JP S6160179 U JPS6160179 U JP S6160179U
- Authority
- JP
- Japan
- Prior art keywords
- test device
- lead
- conductive rubber
- attached
- device body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案の１実施例を分離した形で示す
斜視図、第２図は側断面図、第３図はＤＩＰ型Ｉ
Ｃの斜視図、第４図は従来の試験具の側断面図で
ある。
図において、１はＤＩＰ型、２はＩＣ本体、３
は外部リード、４は試験具、５，１５は試験具本
体、６は試験具蓋、７，１９，２０は端子、７ａ
，１９ａ，２０ａは端子座、７Ａ，１８はリード
支持溝、８，２３はピン、１６はＩＣ装着凹部、
２１，２７は導電性ゴム板、２５は押圧蓋をそれ
ぞれ示す。
Fig. 1 is a perspective view showing an embodiment of the present invention in separated form, Fig. 2 is a side sectional view, and Fig. 3 is a DIP type I
C is a perspective view, and FIG. 4 is a side sectional view of a conventional test device. In the figure, 1 is the DIP type, 2 is the IC body, and 3
is an external lead, 4 is a test device, 5 and 15 are test device bodies, 6 is a test device lid, 7, 19, and 20 are terminals, 7a
, 19a, 20a are terminal seats, 7A, 18 are lead support grooves, 8, 23 are pins, 16 is an IC mounting recess,
21 and 27 are conductive rubber plates, and 25 is a press lid, respectively.
Claims (1)
りなる試験具本体は、該試験具本体の下面より垂
直に突出し、ＤＩＰ型ＩＣの外部リードの並列ピ
ツチに等しいピツチで並列した端子と、該ＩＣ装
着凹部の両側のリード支持部のそれぞれに、櫛形
に形成されたリード支持溝と、下面が該端子の上
部に接続する如くに該リード挿入溝内に固着され
た導電性ゴム板とを備え、該試験具本体に該ＤＩ
Ｐ型ＩＣを装着した状態で、それぞれの該リード
支持部の上面を覆う如くに該試験具本体の外側方
向より回動可能に、該試験具本体に装着された合
成樹脂よりなる押圧蓋には、該外部リードのそれ
ぞれを、上方より圧接する導電性ゴム板が装着さ
れてなり、上下に対向した一対の該導電性ゴム板
が、それぞれの該外部リードを挟着するよう構成
されてなることを特徴とするＤＩＰ型ＩＣの試験
具。 A test device main body made of synthetic resin having an IC mounting recess in the center of the upper surface protrudes vertically from the bottom surface of the test device main body, and has terminals arranged in parallel at a pitch equal to the parallel pitch of the external leads of a DIP type IC, and a terminal for mounting the IC. Each of the lead support parts on both sides of the recess is provided with a lead support groove formed in a comb shape, and a conductive rubber plate fixed in the lead insertion groove so that the lower surface is connected to the upper part of the terminal. The corresponding DI on the test device body
A pressing lid made of synthetic resin attached to the test device body is rotatable from the outside of the test device body so as to cover the top surface of each lead support when a P-type IC is attached. , a conductive rubber plate is attached that presses each of the external leads from above, and a pair of vertically opposed conductive rubber plates is configured to sandwich each external lead. A DIP type IC test device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14514484U JPS6160179U (en) | 1984-09-26 | 1984-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14514484U JPS6160179U (en) | 1984-09-26 | 1984-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6160179U true JPS6160179U (en) | 1986-04-23 |
Family
ID=30703401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14514484U Pending JPS6160179U (en) | 1984-09-26 | 1984-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6160179U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042372A (en) * | 2005-08-02 | 2007-02-15 | Smk Corp | IC socket |
-
1984
- 1984-09-26 JP JP14514484U patent/JPS6160179U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042372A (en) * | 2005-08-02 | 2007-02-15 | Smk Corp | IC socket |
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