JPS6161704B2 - - Google Patents

Info

Publication number
JPS6161704B2
JPS6161704B2 JP56085221A JP8522181A JPS6161704B2 JP S6161704 B2 JPS6161704 B2 JP S6161704B2 JP 56085221 A JP56085221 A JP 56085221A JP 8522181 A JP8522181 A JP 8522181A JP S6161704 B2 JPS6161704 B2 JP S6161704B2
Authority
JP
Japan
Prior art keywords
package
semiconductor element
thin film
film layer
inorganic insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56085221A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57198649A (en
Inventor
Koichi Kugimya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56085221A priority Critical patent/JPS57198649A/ja
Publication of JPS57198649A publication Critical patent/JPS57198649A/ja
Publication of JPS6161704B2 publication Critical patent/JPS6161704B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56085221A 1981-05-30 1981-05-30 Semiconductor device Granted JPS57198649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56085221A JPS57198649A (en) 1981-05-30 1981-05-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56085221A JPS57198649A (en) 1981-05-30 1981-05-30 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57198649A JPS57198649A (en) 1982-12-06
JPS6161704B2 true JPS6161704B2 (fr) 1986-12-26

Family

ID=13852505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56085221A Granted JPS57198649A (en) 1981-05-30 1981-05-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57198649A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4989070A (en) * 1988-11-10 1991-01-29 Coriolis Corporation Modular heat sink structure
JPH04312962A (ja) * 1991-03-18 1992-11-04 Mitsubishi Electric Corp 液体封止半導体装置及びその組立方法

Also Published As

Publication number Publication date
JPS57198649A (en) 1982-12-06

Similar Documents

Publication Publication Date Title
JP2921668B2 (ja) 熱伝導性かつ電気絶縁性の結合装置およびその製造方法
US4670771A (en) Rectifier module
US4360142A (en) Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate
WO2002067324A1 (fr) Element pour circuit electronique, procede de fabrication d'un tel element et portion electronique
KR100591390B1 (ko) 멤브레인을 갖는 센서 및 그 제조 방법
JPS6161704B2 (fr)
JPH0487213A (ja) 異方性導電膜およびその製造方法
JPS5831755B2 (ja) 電気絶縁用基体
CN113097155A (zh) 一种芯片导热模块及其制备方法
JPH05283562A (ja) 樹脂封止型半導体装置
JPS6017776Y2 (ja) 温度ヒユ−ズ
JPH06125029A (ja) 半導体装置用リ−ドフレ−ム、樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法
JPS5645060A (en) Semiconductor device
JPS61187262A (ja) 半導体素子
JP3093224B2 (ja) 半導体装置
JPS587064B2 (ja) シユウセキカイロヨウパツケ−ジ
RU2080686C1 (ru) Способ изготовления полупроводниковых приборов
JPH0722544A (ja) 樹脂封止型半導体装置
JPH0193131A (ja) 半導体装置の製造方法
JPS6141238Y2 (fr)
CN121693148A (zh) 一种高散热性的农业传感器芯片封装结构
JPS6129161A (ja) 熱伝導冷却モジユ−ル装置
JP3448369B2 (ja) 混成集積回路装置
JPH03238851A (ja) 大電力絶縁樹脂封止型半導体装置
JPS5949687B2 (ja) 半導体装置