JPS6165105A - Bend detector of ic lead - Google Patents

Bend detector of ic lead

Info

Publication number
JPS6165105A
JPS6165105A JP18593784A JP18593784A JPS6165105A JP S6165105 A JPS6165105 A JP S6165105A JP 18593784 A JP18593784 A JP 18593784A JP 18593784 A JP18593784 A JP 18593784A JP S6165105 A JPS6165105 A JP S6165105A
Authority
JP
Japan
Prior art keywords
lead
holes
light
leads
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18593784A
Other languages
Japanese (ja)
Inventor
Masahiro Nagao
長尾 正博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18593784A priority Critical patent/JPS6165105A/en
Publication of JPS6165105A publication Critical patent/JPS6165105A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

PURPOSE:To speed up the detection of bend in all directions by forming two means each of which projects parallel light to through holes corresponding to the number of leads formed on one side of a guide at a fixed angle and finding out the number of times of absence of 'OR' between the outputs of photodetectors which may be obtained by transmitted light. CONSTITUTION:An IC having leads 21-214 passes on an IC guide 11 having two pairs of through holes 15-21, 15a-21a so that light beams irradiated from illumination light sources 13, 13a are interrupted from passing the through holes 15-21, 15a-21a respectively and making incident on photodetectors 22-28, 22a-28a. The outputs of the converters 22-28 and that of the converters 22a-28a are inputted to independent OR circuits respectively and the number of times of repeats from the interruption of light to '0' of the OR circuits is counted by a counter. When the counter counts '2' for the frequency turning each OR circuit to '0' and '4' in total, the leads are decided as normal, and in other cases, decides as abnormal.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、I C(Int@(rat@d C1reu
it )の外観検査t%にICのリード曲夛を検出する
装置に関するものである0 〔従来の技術〕 従来この種の装置として第5図に示すようなものがある
。同図において、1は被検査対象となるデュアルインパ
ッケージ形のICで、その両側面よシリード2が引出さ
れている。3はこのIC1を送)出すICガイド、4は
IC1の映像をとるITV  カメラ、5は照明用光源
である。6はITVカメ24からの映像信号をサンプリ
ングし2値化するサンプリング2値化回路、Tはこの回
路6で2値化された後の画像を格納する画像メモリ、8
は画像メモU 7に蓄えられた2値画像からリード2の
先端点を探し出し、その先端点の間隔等からリードの曲
夛を検出するプロセッサなどの中央処理装置である。
[Detailed Description of the Invention] [Industrial Application Field] The present invention provides an IC (Int@(rat@d C1reu)
This relates to an apparatus for detecting lead distortion of an IC during an external appearance inspection (t%) of an IC. In the figure, reference numeral 1 denotes a dual-in-package type IC to be inspected, and series leads 2 are drawn out from both sides of the IC. 3 is an IC guide that sends out this IC1, 4 is an ITV camera that takes an image of IC1, and 5 is a light source for illumination. Reference numeral 6 denotes a sampling and binarization circuit that samples and binarizes the video signal from the ITV camera 24, T indicates an image memory that stores the image after being binarized by this circuit 6, and 8
is a central processing unit such as a processor that searches for the tip point of the lead 2 from the binary image stored in the image memo U7 and detects the bending of the lead from the interval between the tip points.

次に動作について説明する。ICガイド3上を送られて
きたIC1がI’tvカメニア4の視野の前に来たとき
、映像が読み込まれる。このとき、IC1のリード部分
2は金属光沢があシ、モールド部は黒い樹脂でできてい
るので、ICガイド3を反射率の悪い材料を使っておき
、適当な照明を与えれば、サンプリング2値化回路6を
通過して画像メモリ7に入る2値画像A1〜A7は、第
6図に示すように、IC1のリード部分2のみが抽出で
きることになる。なお、第6図において、例えば斜線部
は絵素が111となっている領域を示し、背景は10′
の領域である。したがって、第5図の中央処理装置8は
、上記2値画像を処理し、リード2の先端あるいはリー
ドの中心座標を求め、さらKその座標からリード間隔、
第6図中の11〜a6を求め、リードの広がシあるいは
狭ばまシ等を検出し、リードの白シを検出する。
Next, the operation will be explained. When the IC1 sent on the IC guide 3 comes in front of the field of view of the I'tv camera 4, the video is read. At this time, the lead part 2 of the IC 1 has a metallic luster and the mold part is made of black resin, so if the IC guide 3 is made of a material with poor reflectivity and appropriate lighting is applied, the sampling binary values can be adjusted. From the binary images A1 to A7 that pass through the conversion circuit 6 and enter the image memory 7, only the lead portion 2 of the IC 1 can be extracted, as shown in FIG. In FIG. 6, for example, the shaded area indicates the area where the picture element is 111, and the background is 10'.
This is the area of Therefore, the central processing unit 8 in FIG. 5 processes the binary image, determines the tip of the lead 2 or the center coordinates of the lead, and further calculates the lead interval from the coordinates.
11 to a6 in FIG. 6 are determined, widening or narrowing of the lead, etc. is detected, and whitening of the lead is detected.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記した従来の装置は、以上のように構成されているの
で、ICのリードの間隔に影響を与える第6図で見たと
きの左、右の曲)には有効であるが、前後方向の白シは
検出できないし、中央処理装置で画像処理しなければな
らないので、処理の高速性には限界があった。
The conventional device described above is configured as described above, so it is effective for the left and right curves as seen in Figure 6, which affect the interval between the IC leads. Since white spots cannot be detected and the image must be processed by a central processing unit, there is a limit to the speed of processing.

本発明は、このような事情に鑑みてなされたもので、I
Cリードとリード検出用パターンを光学的に2度マツチ
ングするか否かを調べることによシ、高速に全方向のリ
ードの白シを検出することのできるICCリードクシ検
出装置提供することを目的とする。
The present invention was made in view of these circumstances, and
The object of the present invention is to provide an ICC lead comb detection device that can detect lead white spots in all directions at high speed by checking whether or not the C lead and lead detection pattern are optically matched twice. do.

〔問題点を解決するための手段〕[Means for solving problems]

このような目的を達成するために、本発明は、rcを送
り出すガイドの側面に対して該ICの流れる方向に一定
の角度を持たせた。一定太さのそれぞれが平行表頁通孔
を前記ICの片側のリード数だけあけた貫通孔群と、そ
の各貫通孔の方向に平行な光を出す光源と、前記各貫通
孔を通過後の平行光を受光する位置に取付けた前記貫通
孔と同数の受光素子と、それら受光素子からの全ての信
号を入力とする論理和回路とを1組とし、これを2組備
え、前記ICが前記貫通孔群を通過したとき、前記両論
理和回路からの出力信号が無くなつた回数から該ICの
リード白シが有るか否かを判定するようにしたものであ
る。
In order to achieve such an object, the present invention makes a certain angle in the direction in which the IC flows with respect to the side surface of the guide that sends out the RC. A group of through holes, each of which has a constant thickness and has parallel page through holes equal to the number of leads on one side of the IC, a light source that emits light parallel to the direction of each of the through holes, and a light source that emits light parallel to the direction of each of the through holes; Two sets of light-receiving elements having the same number of through-holes as the through-holes installed at positions for receiving parallel light and an OR circuit which inputs all the signals from these light-receiving elements are provided, and the IC has the same number as the through-holes. When the IC passes through a group of through-holes, it is determined whether or not there is a lead white spot on the IC based on the number of times the output signal from both of the OR circuits disappears.

〔作用〕[Effect]

本発明においては、ICのリードが正常のときの両論理
和回路からの出力信号、が無くなる回数を基にすること
Kよシ、リード曲りがあるときにはそれ以外の回数とな
るため、その回数からリード白シを検出することができ
る。
In the present invention, the number of times the output signal from both OR circuits disappears when the IC leads are normal is used as the basis, but when there is a bent lead, the number of times is other than that, so it is based on the number of times the output signal disappears. Lead blanks can be detected.

〔実施例〕〔Example〕

第1図は本発明の一実施例を示す概略構成図である。同
図において、11はICガイドであシ、この側面12に
は被検査対象となる IC1の片側のリード2の数だけ
の貫通孔15〜21がガイトド1の方向に対して斜めに
あけてあシ、その孔の間隔はリード2が正常な場合のリ
ード間隔に等しく、その孔の大きさはリード2の太さよ
シもわずかに小さくしである。13は照明光源で、その
光線14は前記貫通孔15〜21の全てを通るように平
行性が保たれている。22〜28は受光素子としての光
電変換器であシ、各貫通孔15〜21を通過してきた光
を受ける位置に取付けられている。これは、受光信号が
一定の大きさ以上の場合信号を出力し、それ以下の場合
信号を出力しない。
FIG. 1 is a schematic diagram showing an embodiment of the present invention. In the figure, reference numeral 11 denotes an IC guide, and through holes 15 to 21, the number of which are the number of leads 2 on one side of the IC 1 to be inspected, are formed in the side surface 12 at an angle with respect to the direction of the guide 1. The interval between the holes is equal to the interval between the leads when the leads 2 are normal, and the size of the holes is slightly smaller than the thickness of the leads 2. Reference numeral 13 denotes an illumination light source whose light rays 14 are kept parallel so as to pass through all of the through holes 15 to 21. Numerals 22-28 are photoelectric converters as light-receiving elements, which are installed at positions to receive the light that has passed through each of the through-holes 15-21. This outputs a signal when the received light signal is above a certain level, and does not output a signal when it is below that level.

29は論理和回路としてのオア(OR)回路であシ、前
記各光電変換器22〜28からの出力の論理和をとる。
Reference numeral 29 is an OR circuit serving as a logical sum circuit, which calculates the logical sum of the outputs from each of the photoelectric converters 22 to 28.

なお、この照明光源132貫通孔15〜21.光電変換
器22〜28.オア回路290組はもう1組存在し、第
1図中の符号29mはもう1組のオア回路である。
Note that this illumination light source 132 through holes 15 to 21. Photoelectric converters 22-28. There is another set of OR circuits 290, and reference numeral 29m in FIG. 1 is another set of OR circuits.

また、30は両オア回路29 、29mの出力が無(零
ともいう)になった回数を数えるカウンタであシ、その
カウント数が4以外のときリード白シがあったとしてリ
ード白シを検出するものとなっている。
In addition, 30 is a counter that counts the number of times the output of both OR circuits 29 and 29m becomes null (also called zero), and when the count is other than 4, a lead blank is detected as a lead blank. It has become something to do.

なお、第2図にはそれぞれの組の貫通孔15〜21.1
5m〜21mの関係をその孔を通る平面で切った図で示
している。第2図中、21〜214 で示したものは 
IC1のリード2の断面である。
In addition, FIG. 2 shows the through holes 15 to 21.1 of each set.
The relationship between 5 m and 21 m is shown in a diagram cut along a plane passing through the hole. In Fig. 2, those indicated by 21 to 214 are
It is a cross section of lead 2 of IC1.

上記実施例の構成において、光源13で照射すると、 
IC1のリード2がICガイド110貫通孔15〜21
を遮らない限シ光電変換器22〜28に光が届き、光電
変換器22〜28が出力信号を出す。これら貫通孔は、
正常な場合の工C1のリード間隔にIC10片側リード
の個数だけあけであるので、正常なIC1が通れば、リ
ード2によシ全ての貫通孔15〜21を通る光が遮断さ
れる瞬間がある。これは、両側のリード2に対して発生
するので、正常な場合2個起きることになる。
In the configuration of the above embodiment, when irradiated with the light source 13,
Lead 2 of IC1 passes through holes 15 to 21 of IC guide 110
As long as the light is not blocked, the light reaches the photoelectric converters 22-28, and the photoelectric converters 22-28 output an output signal. These through holes are
Since there is a gap equal to the number of leads on one side of IC10 in the normal case, there is a gap between the leads of C1, so when a normal IC1 passes through, there is a moment when lead 2 blocks the light passing through all the through holes 15 to 21. . This occurs for the leads 2 on both sides, so in a normal case, two will occur.

従って、オア回路29の出力は2度零になることKなる
Therefore, the output of the OR circuit 29 becomes zero twice.

しかし、第2図に示すリード2アのように曲っているリ
ード2が存在すると、その光電変換器22には光が届く
ので、オア回路29の出力が零にならない。従って、リ
ード2に白シが存在すると、オア回路29の出力が2度
零にならなくなる。
However, if there is a bent lead 2 like lead 2A shown in FIG. 2, light will reach the photoelectric converter 22, so the output of the OR circuit 29 will not become zero. Therefore, if there is a white spot on the lead 2, the output of the OR circuit 29 will not become zero twice.

ここで、第2図に示すように、ICガイド11の側面に
2種類の貫通孔15〜21.15a〜21鳳をあけたの
は、第3図に示すリード2saのようにうまく貫通孔1
Tの方向に一致してリード2が曲った場合には白シを検
出できなくなるが、第4図の向きにも貫通孔17mをあ
けであると、このような場合も検出できるという考えに
基づいている。従って、第1図において両オア回路29
.29aからの出力がIC1の通過時に4回零にならな
ければ、リード2の曲りが有ったと検出できることにな
る0上記実施例では、rcIJ−ドの幅よシわずかに小
さい貫通孔をあけてリード検出光を作ったが、rcガイ
ドに大きめ孔をあけておき、指向性のある複数本の光線
を出す光源を用いてもよい。
Here, as shown in FIG. 2, two types of through holes 15 to 21.
It is based on the idea that if the lead 2 is bent in the direction of T, it will not be possible to detect white spots, but if the through hole 17m is also drilled in the direction shown in Figure 4, detection will be possible even in this case. ing. Therefore, in FIG.
.. If the output from 29a does not become zero four times when passing through IC1, it can be detected that lead 2 is bent. Although the lead detection light was created, a large hole may be made in the rc guide and a light source that emits a plurality of directional light beams may be used.

〔発明の効果〕〔Effect of the invention〕

以上のように9本発明によれば、リード幅よシ少い細い
平行光線を複数本件シ、その光線でリードとのマツチン
グを光学的に見るようにしたので、簡単でかつ高速、高
性能なリード1シ検出機能が得られる効果がある。
As described above, according to the present invention, a plurality of thin parallel light beams whose width is smaller than the lead width are used, and matching with the lead is optically observed using the light beams. This has the effect of providing a lead 1 detection function.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す概略構成図、第2図は
第1図における照明光源2貫通孔、光電変換器の位置関
係図、第3図および第4図は上記実施例の動作説明に供
するリード白シと貫通孔の関係図、第5図は従来例のリ
ード曲)検出装置のブロック構成図、第6図は第5図の
装置におけるリードの2値画像例を示す説明図である。 1 ・ ・ 令・ IC,2拳 11+1  ・ リー
ド、11 ・ ・・・ICガイド、13・・e・照明光
源、15〜21.15a〜21轟・・・・貫通孔、22
〜28.22a〜28息1111・φ光電変換器、29
,29龜°゛゛オア回路、3a・・吻・カウンタ。
FIG. 1 is a schematic configuration diagram showing one embodiment of the present invention, FIG. 2 is a positional relationship diagram of the illumination light source 2 through hole and photoelectric converter in FIG. 1, and FIGS. 3 and 4 are diagrams of the above embodiment. A diagram showing the relationship between lead blanks and through-holes to explain the operation, Figure 5 is a block diagram of a conventional lead song detection device, and Figure 6 is an explanation showing an example of a binary image of the lead in the device shown in Figure 5. It is a diagram. 1 ・ ・ Rei・ IC, 2 fist 11 + 1 ・ Lead, 11 ・ ... IC guide, 13 ... e. Light source, 15 ~ 21. 15a ~ 21 Todoroki ... Through hole, 22
~28.22a~28 breath 1111・φ photoelectric converter, 29
, 29°゛゛OR circuit, 3a... proboscis/counter.

Claims (1)

【特許請求の範囲】[Claims]  デュアルインパッケージ形ICを凸型のガイド上に送
り出し、そのICのリード曲りを検出するものにおいて
、前記ガイドの側面に対し前記ICの流れる方向に一定
の角度を持たせた、一定太さのそれぞれが平行な貫通孔
を前記ICの片側のリード数だけあいた貫通孔群と、そ
の各貫通孔の方向に平行な光を出す光源と、前記各貫通
孔を通過後の平行光を受光する位置に取付けた前記貫通
孔と同数の受光素子と、それら受光素子からの全ての信
号を入力とする論理和回路とを1組とし、これを2組備
え、前記ICが前記貫通孔群を通過したとき、前記両論
理和回路からの出力信号が無くなつた回数から該ICの
リード曲りが有るか否かを判定するようにしたことを特
徴とするICリード曲り検出装置。
In a device that sends out a dual-in-package type IC onto a convex guide and detects the bending of the IC's lead, each of a certain thickness has a certain angle to the side surface of the guide in the direction in which the IC flows. A group of through holes with parallel through holes separated by the number of leads on one side of the IC, a light source that emits parallel light in the direction of each of the through holes, and a position that receives the parallel light after passing through each of the through holes. One set includes the same number of light-receiving elements as the installed through-holes and an OR circuit which inputs all the signals from these light-receiving elements, and two sets of these are provided, and when the IC passes through the through-hole group. . An IC lead bending detection device, characterized in that it is determined whether or not the lead of the IC is bent based on the number of times the output signal from both of the OR circuits disappears.
JP18593784A 1984-09-05 1984-09-05 Bend detector of ic lead Pending JPS6165105A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18593784A JPS6165105A (en) 1984-09-05 1984-09-05 Bend detector of ic lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18593784A JPS6165105A (en) 1984-09-05 1984-09-05 Bend detector of ic lead

Publications (1)

Publication Number Publication Date
JPS6165105A true JPS6165105A (en) 1986-04-03

Family

ID=16179488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18593784A Pending JPS6165105A (en) 1984-09-05 1984-09-05 Bend detector of ic lead

Country Status (1)

Country Link
JP (1) JPS6165105A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01295144A (en) * 1988-05-23 1989-11-28 Mitsui High Tec Inc Method and device for inspecting lead curvature of ic device
CN109073567A (en) * 2016-04-28 2018-12-21 川崎重工业株式会社 Part check device and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01295144A (en) * 1988-05-23 1989-11-28 Mitsui High Tec Inc Method and device for inspecting lead curvature of ic device
CN109073567A (en) * 2016-04-28 2018-12-21 川崎重工业株式会社 Part check device and method

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