JPS6165751U - - Google Patents

Info

Publication number
JPS6165751U
JPS6165751U JP1984150937U JP15093784U JPS6165751U JP S6165751 U JPS6165751 U JP S6165751U JP 1984150937 U JP1984150937 U JP 1984150937U JP 15093784 U JP15093784 U JP 15093784U JP S6165751 U JPS6165751 U JP S6165751U
Authority
JP
Japan
Prior art keywords
base plate
thermal expansion
grooves
heat sink
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984150937U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984150937U priority Critical patent/JPS6165751U/ja
Publication of JPS6165751U publication Critical patent/JPS6165751U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1984150937U 1984-10-05 1984-10-05 Pending JPS6165751U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984150937U JPS6165751U (cs) 1984-10-05 1984-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984150937U JPS6165751U (cs) 1984-10-05 1984-10-05

Publications (1)

Publication Number Publication Date
JPS6165751U true JPS6165751U (cs) 1986-05-06

Family

ID=30709067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984150937U Pending JPS6165751U (cs) 1984-10-05 1984-10-05

Country Status (1)

Country Link
JP (1) JPS6165751U (cs)

Similar Documents

Publication Publication Date Title
JPS6165751U (cs)
JPS617039U (ja) ヒ−トシンク
JPH0381640U (cs)
JPS624190U (cs)
JPS62122390U (cs)
JPS6170945U (cs)
JPH03128987U (cs)
JPS5983047U (ja) ヒ−トパイプ式放熱器
JPS63100893U (cs)
JPS58182431U (ja) 放熱器
JPS59132649U (ja) 放熱器
JPS6022841U (ja) 放熱器
JPS60106346U (ja) ヒ−トシンクに半導体素子取付構造
JPH02142036U (cs)
JPH0428492U (cs)
JPS62174341U (cs)
JPS6166994U (cs)
JPS62131834U (cs)
JPS61134041U (cs)
JPS61129347U (cs)
JPS6251754U (cs)
JPS62101236U (cs)
JPS5983048U (ja) ヒ−トパイプ式放熱器
JPS62124856U (cs)
JPS61168644U (cs)