JPS6166872U - - Google Patents
Info
- Publication number
- JPS6166872U JPS6166872U JP15199484U JP15199484U JPS6166872U JP S6166872 U JPS6166872 U JP S6166872U JP 15199484 U JP15199484 U JP 15199484U JP 15199484 U JP15199484 U JP 15199484U JP S6166872 U JPS6166872 U JP S6166872U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- airtight terminal
- insertion hole
- pressure welding
- welding flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
第１図は気密端子を用いてパツケージされた回
路部品の気密パツケージの断面図、第２図は従来
の気密端子とカバーとを圧着するときの圧着フラ
ンジ部分を示した断面図、第３図は本考案による
一実施例の気密端子の断面図、第４図は本考案に
よる第２の実施例の断面図である。
１…ベース、１０…ベース本体裏面、１１…ベ
ース本体、２…リード線挿通孔、３…リード線、
４…絶縁材、５…回路部品、６…カバー、７…圧
接フランジ、７０…凸状部、７１…穴部。
Fig. 1 is a sectional view of an airtight package of circuit components packaged using airtight terminals, Fig. 2 is a sectional view showing the crimping flange portion when a conventional airtight terminal and cover are crimped, and Fig. 3 is FIG. 4 is a cross-sectional view of an airtight terminal according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view of a second embodiment of the present invention. 1... Base, 10... Back side of base body, 11... Base body, 2... Lead wire insertion hole, 3... Lead wire,
4... Insulating material, 5... Circuit component, 6... Cover, 7... Pressure welding flange, 70... Convex portion, 71... Hole portion.
Claims (1)
挿通孔を穿設し、このリード線挿通孔にリード線
を絶縁材により封着した気密端子において、前記
圧接フランジをベース本体裏面で構成される水準
面よりも下方に形成したことを特徴とする気密端
子。 In an airtight terminal in which a lead wire insertion hole is formed in a base having a pressure welding flange on the periphery, and a lead wire is sealed in the lead wire insertion hole with an insulating material, the pressure welding flange is inserted from a level surface formed on the back surface of the base body. An airtight terminal characterized in that an airtight terminal is also formed downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15199484U JPS6166872U (en) | 1984-10-08 | 1984-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15199484U JPS6166872U (en) | 1984-10-08 | 1984-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6166872U true JPS6166872U (en) | 1986-05-08 |
Family
ID=30710085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15199484U Pending JPS6166872U (en) | 1984-10-08 | 1984-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6166872U (en) |
-
1984
- 1984-10-08 JP JP15199484U patent/JPS6166872U/ja active Pending
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