JPS6171981U - - Google Patents
Info
- Publication number
- JPS6171981U JPS6171981U JP15599284U JP15599284U JPS6171981U JP S6171981 U JPS6171981 U JP S6171981U JP 15599284 U JP15599284 U JP 15599284U JP 15599284 U JP15599284 U JP 15599284U JP S6171981 U JPS6171981 U JP S6171981U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- land portion
- auxiliary
- land
- discharge gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Emergency Protection Circuit Devices (AREA)
- Switch Cases, Indication, And Locking (AREA)
Description
第１図は従来例における放電ギヤツプの平面図
、第２図は従来例における半田レジストを除いて
構成した放電ギヤツプの平面図、第３図は従来例
の半田レジストを除いた放電ギヤツプの断面図、
第４図は本考案の一実施例における放電ギヤツプ
の平面図、第５図はその放電ギヤツプの断面図、
第６図は本考案における他の実施例の放電ギヤツ
プの平面図、第７図は第６図の断面図、第８図は
本考案のさらに他の実施例の放電ギヤツプの平面
図である。
１……対向する銅箔、２……スリツト、４……
半田ランド、５……半田補助ランド、６……半田
。
Fig. 1 is a plan view of a conventional discharge gap, Fig. 2 is a plan view of a conventional discharge gap without the solder resist, and Fig. 3 is a sectional view of the conventional discharge gap without the solder resist. ,
FIG. 4 is a plan view of a discharge gap in an embodiment of the present invention, FIG. 5 is a cross-sectional view of the discharge gap,
6 is a plan view of a discharge gap according to another embodiment of the present invention, FIG. 7 is a sectional view of FIG. 6, and FIG. 8 is a plan view of a discharge gap according to still another embodiment of the present invention. 1... Opposing copper foil, 2... Slit, 4...
Solder land, 5... Solder auxiliary land, 6... Solder.
Claims (1)
端に半田が付着可能な半田ランド部を設け、この
半田ランド部に連続してその後方の銅箔上に表面
張力によつて半田を後方に引張る補助ランド部を
設け、この半田ランド部および補助ランド部以外
の部分は半田レジストを施してなる放電ギヤツプ
。 A solder land to which solder can adhere is provided at the tips of a pair of copper foils facing each other at a predetermined interval, and the solder is applied backwards by surface tension onto the copper foil behind the solder land. A discharge gap is provided with an auxiliary land portion that is pulled by the auxiliary land portion, and the portions other than the solder land portion and the auxiliary land portion are coated with solder resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15599284U JPS6171981U (en) | 1984-10-16 | 1984-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15599284U JPS6171981U (en) | 1984-10-16 | 1984-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6171981U true JPS6171981U (en) | 1986-05-16 |
Family
ID=30714009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15599284U Pending JPS6171981U (en) | 1984-10-16 | 1984-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6171981U (en) |
-
1984
- 1984-10-16 JP JP15599284U patent/JPS6171981U/ja active Pending
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