JPS6181159U - - Google Patents
Info
- Publication number
- JPS6181159U JPS6181159U JP16673884U JP16673884U JPS6181159U JP S6181159 U JPS6181159 U JP S6181159U JP 16673884 U JP16673884 U JP 16673884U JP 16673884 U JP16673884 U JP 16673884U JP S6181159 U JPS6181159 U JP S6181159U
- Authority
- JP
- Japan
- Prior art keywords
- package body
- leads
- thick part
- glass
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図はこの考案の一実施例である水晶振動子
のキヤツプを除いた平面図で、第２図は第１図の
−線に対応する断面図である。第３図は従来
の水晶振動子のキヤツプを除いた平面図で、第４
図および第５図はそれぞれ第３図の−線およ
び−線に対応する断面図である。第６図はキ
ツプのシール方法について説明するためのシール
前の分解断面図である。
４……ガラス、５，６……リード、７……キヤ
ツプ、８……低融点ガラス、１４……パツケージ
本体、１５……底板、１５ａ……厚肉部。
FIG. 1 is a plan view of a crystal oscillator according to an embodiment of the invention with the cap removed, and FIG. 2 is a cross-sectional view taken along the line - in FIG. Figure 3 is a plan view of a conventional crystal resonator with the cap removed.
5 and 5 are cross-sectional views corresponding to lines - and - in FIG. 3, respectively. FIG. 6 is an exploded sectional view before sealing for explaining the method of sealing the kip. 4... Glass, 5, 6... Lead, 7... Cap, 8... Low melting point glass, 14... Package body, 15... Bottom plate, 15a... Thick wall portion.
Claims (1)
ケージ本体と、このパツケージ本体に低融点ガラ
スを介してシールされたキヤツプとを備えたフラ
ツトパツケージ内の前記リード上に素子を固着し
た電子部品において、 前記パツケージ本体の底板の少なくとも４隅近
傍に厚肉部を形成し、この厚肉部の近傍のリード
上に素子を固着したことを特徴とする電子部品。[Claims for Utility Model Registration] On the leads in a flat package comprising a rectangular package body sealed with glass and a cap sealed to the package body with low melting point glass. An electronic component having an element fixed thereto, characterized in that a thick part is formed near at least four corners of the bottom plate of the package body, and the element is fixed on leads near the thick part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16673884U JPS6181159U (en) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16673884U JPS6181159U (en) | 1984-10-31 | 1984-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181159U true JPS6181159U (en) | 1986-05-29 |
Family
ID=30724547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16673884U Pending JPS6181159U (en) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181159U (en) |
-
1984
- 1984-10-31 JP JP16673884U patent/JPS6181159U/ja active Pending
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