JPS6181740U - - Google Patents

Info

Publication number
JPS6181740U
JPS6181740U JP16566784U JP16566784U JPS6181740U JP S6181740 U JPS6181740 U JP S6181740U JP 16566784 U JP16566784 U JP 16566784U JP 16566784 U JP16566784 U JP 16566784U JP S6181740 U JPS6181740 U JP S6181740U
Authority
JP
Japan
Prior art keywords
power supply
power
layers
electronic components
multilayer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16566784U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16566784U priority Critical patent/JPS6181740U/ja
Publication of JPS6181740U publication Critical patent/JPS6181740U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の多層配線基板における電源供
給構造の一実施例を説明するための図、第2図は
従来の多層配線基板における電源供給構造を説明
するための図である。 図中、1は多層配線基板、2及び3は電源層、
4及び5は信号層、6及び7は電源供給部、LS
I1,LSI2,LSI3,LSI4はLSIを
それぞれ示す。
FIG. 1 is a diagram for explaining an embodiment of a power supply structure in a multilayer wiring board according to the present invention, and FIG. 2 is a diagram for explaining a power supply structure in a conventional multilayer wiring board. In the figure, 1 is a multilayer wiring board, 2 and 3 are power layers,
4 and 5 are signal layers, 6 and 7 are power supply parts, LS
I1, LSI2, LSI3, and LSI4 indicate LSIs, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数個の電子部品を搭載した多層配線基板にお
いて、同一電源の供給に複数の電源供給層を設け
、電源供給部に近い電子部品には少ない層数で電
源を供給し、電源供給部から遠い電子部品には多
い層数で電源を供給することにより基板内の電源
電圧値を一定とすることを特徴とする多層配線基
板における電源供給構造。
In a multilayer wiring board equipped with a large number of electronic components, multiple power supply layers are provided to supply the same power, and power is supplied to electronic components close to the power supply section with a small number of layers, and electronic components far from the power supply section are supplied with power through a small number of layers. A power supply structure for a multilayer wiring board, characterized in that a power supply voltage value within the board is kept constant by supplying power to components through a large number of layers.
JP16566784U 1984-11-02 1984-11-02 Pending JPS6181740U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16566784U JPS6181740U (en) 1984-11-02 1984-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16566784U JPS6181740U (en) 1984-11-02 1984-11-02

Publications (1)

Publication Number Publication Date
JPS6181740U true JPS6181740U (en) 1986-05-30

Family

ID=30723507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16566784U Pending JPS6181740U (en) 1984-11-02 1984-11-02

Country Status (1)

Country Link
JP (1) JPS6181740U (en)

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