JPS6182764U - - Google Patents
Info
- Publication number
- JPS6182764U JPS6182764U JP16831684U JP16831684U JPS6182764U JP S6182764 U JPS6182764 U JP S6182764U JP 16831684 U JP16831684 U JP 16831684U JP 16831684 U JP16831684 U JP 16831684U JP S6182764 U JPS6182764 U JP S6182764U
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- printed wiring
- wiring board
- soldering
- elevator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 11
- 210000000078 claw Anatomy 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- 238000004140 cleaning Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 238000001816 cooling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は自動半田付け装置の平面図、第２図は
第１図の正面図、第３図はキヤリヤ送り込み装置
の平面図、第４図は第３図の正面図、第５図はキ
ヤリヤ送り込み装置によりキヤリヤが１ステツプ
移動した状態図、第６図はキヤリヤ送り込み装置
によりキヤリヤが２ステツプ移動した状態図、第
７図はキヤリヤ送り込み装置によりキヤリヤが３
ステツプ移動した状態図、第８図は搬送ラインに
よりキヤリヤが移動し始める状態図、第９図は搬
送ライン終端までキヤリヤが搬送された状態図、
第１０図はキヤリヤ挿入装置によりキヤリヤがキ
ヤリヤ下降エレベーターに送り込まれた状態図、
第１１図はキヤリヤ下降エタベーターの正面図、
第１２図は第１１図の側面図、第１３図は回避装
置の詳細図、第１４図はキヤリヤ上昇エレベータ
ーの側面図、第１５は第１４図の正面図、第１６
図はキヤリヤ爪開閉装置の詳細図、第１７図はキ
ヤリヤ爪開閉装置により基板が解放されて基板搬
送コンベア上に落下する状態図、第１８図は検出
器により指示ユニツトの「ＯＮ」を検知されてい
る状態図、第１９図は第１８図の側面図、第２０
図は検出器により指示ユニツトの「ＯＦＦ」を検
知されている状態図、第２１図は第２０図の側面
図、第２２図は指示変更装置により指示ユニツト
が「ＯＮ」から「ＯＦＦ」に変更される状態図、
第２３図はキヤリヤの平面図、第２４図は第２３
図の側面図、第２５図は指示ユニツトの詳細を示
す平面図、第２６図は第２５図の側面図、第２７
図は２ＤＩＰ＋指示ユニツト「ＯＮ」の時のキヤ
リヤの流れを示す図、第２８図は１ＤＩＰ＋指示
ユニツト「ＯＮ」の時のキヤリヤの流れを示す図
、第２９図は２ＤＩＰ＋指示ユニツト「ＯＦＦ」
および１ＤＩＰ＋指示ユニツト「ＯＦＦ」の時の
キヤリヤの流れを示す図である。
１……フラクサー、２……予備加熱器、３……
半田槽、４……冷却フアン、５……リード線カツ
ター、６……ブラシ、７……基板洗浄器、８……
乾燥フアン、９……キヤリヤ爪開閉装置、１０…
…基板搬出コンベア、１１……キヤリヤ上昇エレ
ベーター、１２……基板セツト部、１３……キヤ
リヤ送り込み装置、１４……搬送ライン、１５…
…返却ライン、１６……回避装置、１７……キヤ
リヤ挿入装置、１８……キヤリヤ爪洗浄器、１９
……エスケープ、２０……指示変更装置、２１，
２２，２３，２４……検出器、２５……キヤリヤ
下降エレベーター、７１……指示ユニツト、７８
……キヤリヤ。
Fig. 1 is a plan view of the automatic soldering device, Fig. 2 is a front view of Fig. 1, Fig. 3 is a plan view of the carrier feeding device, Fig. 4 is a front view of Fig. 3, and Fig. 5 is a front view of the carrier feeding device. Figure 6 shows a state in which the carrier has moved one step by the carrier feeding device, Figure 6 shows a state in which the carrier has moved two steps by the carrier feeding device, and Figure 7 shows a state in which the carrier has moved three steps by the carrier feeding device.
Figure 8 is a diagram showing the state in which the carrier has moved step by step, Figure 8 is a diagram showing the state in which the carrier begins to move by the conveyance line, Figure 9 is a diagram in which the carrier has been conveyed to the end of the conveyance line,
Fig. 10 is a state diagram in which the carrier is sent into the carrier descending elevator by the carrier insertion device;
Figure 11 is a front view of the carrier lowering elevator;
Figure 12 is a side view of Figure 11, Figure 13 is a detailed view of the avoidance device, Figure 14 is a side view of the carrier lift elevator, Figure 15 is a front view of Figure 14, and Figure 16 is a side view of Figure 11.
The figure is a detailed view of the carrier claw opening/closing device, Figure 17 is a diagram of the state in which the substrate is released by the carrier claw opening/closing device and falls onto the substrate transport conveyor, and Figure 18 is a diagram of the state in which the indicator unit is detected as "ON" by the detector. Fig. 19 is a side view of Fig. 18, Fig. 20 is a side view of Fig.
The figure shows a state diagram in which the indicator unit is detected as OFF by the detector, Figure 21 is a side view of Figure 20, and Figure 22 shows the indicator unit being changed from ``ON'' to ``OFF'' by the indicator change device. state diagram,
Fig. 23 is a plan view of the carrier, Fig. 24 is a plan view of the carrier.
25 is a plan view showing details of the indicating unit, FIG. 26 is a side view of FIG. 25, and FIG. 27 is a side view of FIG.
The figure shows the flow of the carrier when 2DIP+instruction unit is "ON", FIG. 28 shows the flow of the carrier when 1DIP+indication unit is "ON", and FIG. 29 shows the flow of carrier when 2DIP+indication unit is "OFF".
and 1DIP+instruction unit ``OFF'' is a diagram showing the flow of the carrier. 1...Fluxer, 2...Preheater, 3...
Solder bath, 4... Cooling fan, 5... Lead wire cutter, 6... Brush, 7... Board cleaner, 8...
Drying fan, 9... Carrying claw opening/closing device, 10...
...Substrate unloading conveyor, 11...Carrier lift elevator, 12...Substrate setting section, 13...Carrier feeding device, 14...Transportation line, 15...
... Return line, 16 ... Avoidance device, 17 ... Carrier insertion device, 18 ... Carrier claw washer, 19
...Escape, 20...Instruction change device, 21,
22, 23, 24...Detector, 25...Carrier descending elevator, 71...Indication unit, 78
...Kiyariya.
補正 昭６０．２．２５
図面の簡単な説明を次のように補正する。
明細書第２０頁第４行の「第１５」を「第１５
図」と訂正する。Amendment February 25, 1980 The brief description of the drawing is amended as follows. “15th” on page 20, line 4 of the specification
"Fig." is corrected.
Claims (1)
半田付けおよび半田付け後の後処理工程の各処理
部を通して搬送し、予備半田付けおよび本半田付
けを行う自動半田付け装置において、印刷配線板
保持具で構成されたキヤリヤの切換可能な回転子
の指示により、自動半田付装置に設置された検出
器に指示を与える指示ユニツトと、印刷配線板キ
ヤリヤを前記各処理部を通して進行させる搬送ラ
インと、前記印刷配線板キヤリヤに印刷配線板を
セツトする基板セツト部と、前記基板セツト部か
ら前記搬送ラインに送り込むキヤリヤ送り込み装
置と、リード線カツテイングおよびブラシによる
バリ取り工程を回避させる回避装置と、前記印刷
配線板キヤリヤの主可動子をスライドさせ印刷配
線板を取り外すキヤリヤ爪開閉装置と、取り外し
た印刷配線板を装置外に送り出す基板搬出コンベ
アと、前記搬送ラインから排出される前記印刷配
線板キヤリヤを装置下部に下降させるキヤリヤ下
降エレベーターと、前記搬送ラインから前記キヤ
リヤ下降エレベーターに前記印刷配線板キヤリヤ
を送り込むキヤリヤ挿入装置と、前記キヤリヤ下
降エレベーターから前記印刷配線板キヤリヤを受
け取つて前記基板セツト部の下方に反送する返却
ラインと、この返却ラインの途中に位置しキヤリ
ヤ爪を洗浄する移動式のキヤリヤ爪洗浄器と、前
記印刷配線板キヤリヤの指示を変更する指示変更
装置と、前記返却ラインから前記印刷配線板キヤ
リヤを受け取つて上昇させるキヤリヤ上昇エレベ
ーターとを有し、前記印刷配線板キヤリヤの指示
を検知して半田付けの作業工程を変更し得るよう
にしたことを特徴とする半田付け装置。 Pretreatment process for soldering printed wiring boards,
In an automatic soldering machine that performs preliminary soldering and main soldering by conveying the soldering through each processing section of the post-soldering process, a switchable rotor of a carrier consisting of a printed wiring board holder is used. An instruction unit that gives instructions to a detector installed in an automatic soldering device according to instructions, a conveyance line that advances the printed wiring board carrier through each of the processing sections, and a board that sets the printed wiring board on the printed wiring board carrier. a carrier feeding device for feeding the board from the substrate setting section into the conveying line; an avoidance device for avoiding the lead wire cutting and deburring steps using a brush; a carrier pawl opening/closing device for removing the printed wiring board, a board unloading conveyor for sending the removed printed wiring board out of the equipment, a carrier lowering elevator for lowering the printed wiring board carrier discharged from the transport line to the lower part of the equipment, and a carrier lowering elevator for lowering the printed wiring board carrier discharged from the transport line to the lower part of the equipment. a carrier insertion device for feeding the printed wiring board carrier into the carrier descending elevator; a return line for receiving the printed wiring board carrier from the carrier descending elevator and returning it to the lower part of the board setting section; a mobile carrier claw washer for cleaning the carrier claws; an instruction changing device for changing instructions for the printed wiring board carrier; and a carrier lifting elevator for receiving and raising the printed wiring board carrier from the return line. 1. A soldering device comprising: a soldering device, wherein the soldering process can be changed by detecting an instruction from the printed wiring board carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168316U JPH0225571Y2 (en) | 1984-11-06 | 1984-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168316U JPH0225571Y2 (en) | 1984-11-06 | 1984-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6182764U true JPS6182764U (en) | 1986-05-31 |
| JPH0225571Y2 JPH0225571Y2 (en) | 1990-07-13 |
Family
ID=30726092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984168316U Expired JPH0225571Y2 (en) | 1984-11-06 | 1984-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0225571Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8441361B2 (en) | 2010-02-13 | 2013-05-14 | Mcallister Technologies, Llc | Methods and apparatuses for detection of properties of fluid conveyance systems |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242922U (en) * | 1975-09-19 | 1977-03-26 |
-
1984
- 1984-11-06 JP JP1984168316U patent/JPH0225571Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242922U (en) * | 1975-09-19 | 1977-03-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0225571Y2 (en) | 1990-07-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63140763A (en) | Automatic soldering device | |
| CN112616253A (en) | Mounting mechanism of integrated circuit board | |
| CN113213121B (en) | Machine for feeding, covering, discharging and cap dismounting of semiconductor substrate | |
| JPS6182764U (en) | ||
| CN218904218U (en) | Device for automatically assembling jig patches on chip | |
| CN218769430U (en) | Full-automatic production line for power modules | |
| EP0135117A3 (en) | Object transporter apparatus | |
| CN205798408U (en) | Line leveled automatically by blank | |
| CN115741160A (en) | Device for machining gearbox parts | |
| CN219874391U (en) | Data line soldering machine | |
| JPS5917534Y2 (en) | Sorting device for lead cut | |
| CN213558030U (en) | Electronic component shell paint dipping device convenient to clean | |
| CN207139055U (en) | Automatic welding resistance device | |
| CN223174499U (en) | Automatic line for substrate production | |
| CN217770522U (en) | Etching device with positioning deviation-preventing structure for manufacturing circuit board | |
| JPS6031007Y2 (en) | Transfer device for soldering | |
| KR0164163B1 (en) | Guide apparatus of supplying unworked drum and retrieving worked drum from lower drum working machine of vtr | |
| JPS6232718Y2 (en) | ||
| JPH0758829B2 (en) | Flux spraying method and device | |
| JPH0131416Y2 (en) | ||
| CN211726651U (en) | Online cleaning system for printed circuit board | |
| JPH0333459B2 (en) | ||
| JPS58130818A (en) | Automatic delivery equipment for trays | |
| GB2209981A (en) | Chip soldering apparatus | |
| JPH0735652Y2 (en) | Automatic lead frame soldering device for integrated circuits |