JPS6183078U - - Google Patents
Info
- Publication number
- JPS6183078U JPS6183078U JP1984169024U JP16902484U JPS6183078U JP S6183078 U JPS6183078 U JP S6183078U JP 1984169024 U JP1984169024 U JP 1984169024U JP 16902484 U JP16902484 U JP 16902484U JP S6183078 U JPS6183078 U JP S6183078U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- tape carrier
- functional elements
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Electronic Switches (AREA)
Description
第１図は一実施例を示す要部平面図、第２図は
本考案が対象とする長尺電子装置の一例としての
サーマルヘツドを示す要部概略平面図である。
２……セラミツク基板、４……発熱素子、１５
……ＩＣ、４０……テープキヤリア、４４……テ
ープキヤリアのリード端部、５０……プリント配
線板、５２……プリント配線板の導体パターン。
FIG. 1 is a plan view of a main part showing one embodiment, and FIG. 2 is a schematic plan view of a main part showing a thermal head as an example of a long electronic device to which the present invention is directed. 2...Ceramic substrate, 4...Heating element, 15
...IC, 40...tape carrier, 44...lead end of tape carrier, 50...printed wiring board, 52...conductor pattern of printed wiring board.
Claims (1)
、これらの機能素子の駆動回路を有する集積回路
素子がプリント配線板と前記機能素子との間にテ
ープキヤリアにより接続されているものにおいて
、 前記テープキヤリアとプリント配線板とのボン
デイング部分においてはプリント配線板の導体パ
ターンは前記機能素子配列方向に直交する方向に
形成され、かつ、そのボンデイング部分のテープ
キヤリアのリード幅がプリント配線板の導体パタ
ーン幅より狭く形成されていることを特徴とする
長尺電子装置。 (2) テープキヤリアの中間部のリード幅が前記
ボンデイング部分のリード幅よりも広く形成され
ている実用新案登録請求の範囲第１項に記載の長
尺電子装置。[Claims for Utility Model Registration] (1) A plurality of functional elements are arranged in a row on a substrate, and an integrated circuit element having a driving circuit for these functional elements is provided with a tape between a printed wiring board and the functional elements. In the case where the tape carrier and the printed wiring board are connected by a carrier, in the bonding part between the tape carrier and the printed wiring board, the conductive pattern of the printed wiring board is formed in a direction perpendicular to the functional element arrangement direction, and the tape carrier in the bonding part is 1. A long electronic device characterized in that the lead width is narrower than the conductor pattern width of a printed wiring board. (2) The elongated electronic device according to claim 1, wherein the lead width of the intermediate portion of the tape carrier is wider than the lead width of the bonding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169024U JPS6183078U (en) | 1984-11-06 | 1984-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169024U JPS6183078U (en) | 1984-11-06 | 1984-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183078U true JPS6183078U (en) | 1986-06-02 |
Family
ID=30726776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984169024U Pending JPS6183078U (en) | 1984-11-06 | 1984-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183078U (en) |
-
1984
- 1984-11-06 JP JP1984169024U patent/JPS6183078U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3234003B2 (en) | Thermal head | |
| JP3205100B2 (en) | Thermal print head | |
| JPH0180433U (en) | ||
| JPS59127252U (en) | surface light emitter | |
| JPH0712700B2 (en) | Thermal print head device | |
| JPS63309468A (en) | Wiring structure of thermal recording head | |
| JPS5837122U (en) | integrated electronic components | |
| JPH0295643U (en) | ||
| JPH0712701B2 (en) | Thermal print head device | |
| JPS60129049U (en) | Electrical equipment with operation display | |
| JPH01165247U (en) | ||
| JPS62162872U (en) | ||
| JPS6336077U (en) | ||
| JPH01174949U (en) | ||
| JPH0712698B2 (en) | Thermal print head device | |
| JPS60130048U (en) | thermal head | |
| JPS58191661U (en) | printed board | |
| JPS6127371U (en) | hybrid integrated circuit | |
| JPH02137069U (en) | ||
| JPS60169858U (en) | Chip mounting board | |
| JPS60157243U (en) | thermal head | |
| JPS63105354U (en) | ||
| JPS6226061U (en) | ||
| JPS60146379U (en) | Printed wiring board for mounting chip components | |
| JPH05177863A (en) | Thermal head |