JPS6185162U - - Google Patents
Info
- Publication number
- JPS6185162U JPS6185162U JP17031984U JP17031984U JPS6185162U JP S6185162 U JPS6185162 U JP S6185162U JP 17031984 U JP17031984 U JP 17031984U JP 17031984 U JP17031984 U JP 17031984U JP S6185162 U JPS6185162 U JP S6185162U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- package body
- metal plate
- polymerized
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図〜第３図は何れもこの考案の一実施例を
示すもので、第１図は分解斜視図、第２図は組立
後の斜視図、第３図は側面図である。第４図〜第
６図は何れも従来のマイクロ波半導体素子用パツ
ケージを示すもので、第４図は分解斜視図、第５
図は組立後の斜視図、第６図は側面図である。
図において、１はセラミツクからなるパツケー
ジ本体、２，３は外部リード、７は上面メタライ
ズ、８は側面メタライズ、９はシール・リード金
属板、９ａはシール部、９ｂは連結部、９ｃはリ
ード部である。なお、図中同一符号は同一または
相当部分を示す。
1 to 3 show an embodiment of this invention, with FIG. 1 being an exploded perspective view, FIG. 2 being an assembled perspective view, and FIG. 3 being a side view. Figures 4 to 6 all show conventional packages for microwave semiconductor devices, with Figure 4 being an exploded perspective view and Figure 5 being an exploded perspective view.
The figure is a perspective view after assembly, and FIG. 6 is a side view. In the figure, 1 is a package body made of ceramic, 2 and 3 are external leads, 7 is a metallized top surface, 8 is a metallized side surface, 9 is a seal/lead metal plate, 9a is a seal portion, 9b is a connecting portion, and 9c is a lead portion. It is. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
着されるシール部と、このシール部とリード部と
を連結し、上記パツケージ本体の側面メタライズ
に重合接着される連結部とによつて一体に構成さ
れたシールド・リード金属板を有するマイクロ波
半導体素子用パツケージ。 (2) シールド・リード金属板は金・錫などのは
んだ材を介してパツケージ本体の上面メタライズ
と側面メタライズに接着されていることを特徴と
する実用新案登録請求の範囲第１項記載のマイク
ロ波半導体素子用パツケージ。[Claims for Utility Model Registration] (1) A sealing part that is polymerized and bonded to the metallized upper surface of the package body, a connecting part that connects this sealing part and the lead part, and that is polymerized and bonded to the metallized side surface of the package body; A microwave semiconductor device package having a shield/lead metal plate integrally constructed with. (2) The microwave according to claim 1 of the utility model registration claim, characterized in that the shield lead metal plate is bonded to the top metallization and side metallization of the package body through a solder material such as gold or tin. Packages for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17031984U JPS6185162U (en) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17031984U JPS6185162U (en) | 1984-11-12 | 1984-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185162U true JPS6185162U (en) | 1986-06-04 |
Family
ID=30728025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17031984U Pending JPS6185162U (en) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185162U (en) |
-
1984
- 1984-11-12 JP JP17031984U patent/JPS6185162U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0373444U (en) | ||
| JPS59164241U (en) | Ceramic package | |
| JPH0356144U (en) | ||
| JPS6334275Y2 (en) | ||
| JPH0279047U (en) | ||
| JPH0343738U (en) | ||
| JPH02131353U (en) | ||
| JPH0267649U (en) | ||
| JPS6138940U (en) | Package for microwave semiconductor devices | |
| JPH0178034U (en) | ||
| JPS587345U (en) | semiconductor equipment | |
| JPS5822749U (en) | Package for semiconductor devices | |
| JPH0179843U (en) | ||
| JPH0279046U (en) | ||
| JPH0310540U (en) | ||
| JPH03101524U (en) | ||
| JPH0167759U (en) | ||
| JPS60137439U (en) | Hermetically sealed package | |
| JPS587342U (en) | Packages for electronic device elements | |
| JPS61188360U (en) | ||
| JPH01171036U (en) | ||
| JPS5895050U (en) | Ceramic package type semiconductor device | |
| JPS594640U (en) | Resin-encapsulated semiconductor device | |
| JPH042030U (en) | ||
| JPH024261U (en) |