JPS6185181U - - Google Patents
Info
- Publication number
- JPS6185181U JPS6185181U JP1984170025U JP17002584U JPS6185181U JP S6185181 U JPS6185181 U JP S6185181U JP 1984170025 U JP1984170025 U JP 1984170025U JP 17002584 U JP17002584 U JP 17002584U JP S6185181 U JPS6185181 U JP S6185181U
- Authority
- JP
- Japan
- Prior art keywords
- electrode portion
- thick film
- external connection
- insulating layer
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図はこの考案に係る厚膜基板装置の一実施
例を示す構成図、第２図は同実施例の変形例を示
す構成図、第３図は従来の厚膜基板を示す構成図
である。
１１…絶縁基板、１２…導体層、１３…電極部
、１４…絶縁層、１５…ソケツト、１６…分割溝
。
FIG. 1 is a block diagram showing an embodiment of a thick film substrate device according to this invention, FIG. 2 is a block diagram showing a modification of the same embodiment, and FIG. 3 is a block diagram showing a conventional thick film substrate. be. DESCRIPTION OF SYMBOLS 11... Insulating substrate, 12... Conductor layer, 13... Electrode part, 14... Insulating layer, 15... Socket, 16... Division groove.
Claims (1)
成されるとともに、前記絶縁基板上が前記電極部
を露出させるように絶縁層で覆われてなる厚膜基
板装置において、前記絶縁層を前記外部接続用の
電極部の周囲を囲むように形成してなることを特
徴とする厚膜基板装置。 In a thick film substrate device in which an electrode portion for external connection is printed on an end portion of an insulating substrate, and the top of the insulating substrate is covered with an insulating layer so as to expose the electrode portion, the insulating layer is A thick film substrate device characterized by being formed so as to surround an electrode portion for external connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170025U JPS6185181U (en) | 1984-11-09 | 1984-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170025U JPS6185181U (en) | 1984-11-09 | 1984-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185181U true JPS6185181U (en) | 1986-06-04 |
Family
ID=30727734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984170025U Pending JPS6185181U (en) | 1984-11-09 | 1984-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185181U (en) |
-
1984
- 1984-11-09 JP JP1984170025U patent/JPS6185181U/ja active Pending
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