JPS6186948U - - Google Patents

Info

Publication number
JPS6186948U
JPS6186948U JP1984171692U JP17169284U JPS6186948U JP S6186948 U JPS6186948 U JP S6186948U JP 1984171692 U JP1984171692 U JP 1984171692U JP 17169284 U JP17169284 U JP 17169284U JP S6186948 U JPS6186948 U JP S6186948U
Authority
JP
Japan
Prior art keywords
lead frame
alloy
coating layer
semiconductor
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984171692U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984171692U priority Critical patent/JPS6186948U/ja
Publication of JPS6186948U publication Critical patent/JPS6186948U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ及び第１図ｂは本考案によるリードフ
レームの拡大断面図であり、第１図ｃは本考案に
よるリードフレームを使用したレジンモールドＤ
ＩＰ型パツケージの断面図である。第２図は従来
のリードフレームを用いた半導体レジンモールド
パツケージの平面を示した説明図であり、第３図
はその断面を示した説明図である。 １：タブ、２：インナーリード、３：アウター
リード、４：半導体素子、５：電極、６：接合剤
、７：ワイヤボンド細線、８：レジンモールド、
１０：リードフレーム基体、１１：Ｎｉ−ｆｅ合
金被覆層、１２：表層。 1a and 1b are enlarged sectional views of the lead frame according to the present invention, and FIG. 1c is a resin mold D using the lead frame according to the present invention.
FIG. 3 is a cross-sectional view of an IP type package. FIG. 2 is an explanatory diagram showing a plan view of a semiconductor resin mold package using a conventional lead frame, and FIG. 3 is an explanatory diagram showing a cross section thereof. 1: Tab, 2: Inner lead, 3: Outer lead, 4: Semiconductor element, 5: Electrode, 6: Bonding agent, 7: Wire bond thin wire, 8: Resin mold,
10: lead frame base, 11: Ni-fe alloy coating layer, 12: surface layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] Ｃｕ若しくはＣｕ合金又はＡｌ若しくはＡｌ合
金の板又は条より成型されたリードフレームにお
いて、リードフレーム基体の上方の少くも一部に
Ｆｅの１０〜４０重量％を含むＮｉ−Ｆｅ合金の
被覆層が設けられていることを特徴とする半導体
リードフレーム。 In a lead frame molded from a plate or strip of Cu or Cu alloy or Al or Al alloy, a coating layer of Ni-Fe alloy containing 10 to 40% by weight of Fe is provided at least in a part above the lead frame base. A semiconductor lead frame characterized by:
JP1984171692U 1984-11-14 1984-11-14 Pending JPS6186948U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984171692U JPS6186948U (en) 1984-11-14 1984-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984171692U JPS6186948U (en) 1984-11-14 1984-11-14

Publications (1)

Publication Number Publication Date
JPS6186948U true JPS6186948U (en) 1986-06-07

Family

ID=30729371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984171692U Pending JPS6186948U (en) 1984-11-14 1984-11-14

Country Status (1)

Country Link
JP (1) JPS6186948U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144160A (en) * 1983-02-07 1984-08-18 Sumitomo Electric Ind Ltd Plastic-sealed ic
JPS59161850A (en) * 1983-03-07 1984-09-12 Hitachi Ltd Resin sealed type semiconductor device and lead frame used therefor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144160A (en) * 1983-02-07 1984-08-18 Sumitomo Electric Ind Ltd Plastic-sealed ic
JPS59161850A (en) * 1983-03-07 1984-09-12 Hitachi Ltd Resin sealed type semiconductor device and lead frame used therefor

Similar Documents

Publication Publication Date Title
JPS6186948U (en)
JPS6169842U (en)
JPS6165757U (en)
JPS61109146U (en)
JPS6217152U (en)
JPS61190148U (en)
JPH0345641U (en)
JPH0189741U (en)
JPS63127127U (en)
JPS6439644U (en)
JPS61205144U (en)
JPH0392053U (en)
JPS6144849U (en) semiconductor lead frame
JPH0474453U (en)
JPH02146439U (en)
JPS63106133U (en)
JPH0215738U (en)
JPS63128740U (en)
JPH0328754U (en)
JPH0440545U (en)
JPH02132954U (en)
JPS61136554U (en)
JPH0373444U (en)
JPH0298635U (en)
JPH0260236U (en)