JPS6190252U - - Google Patents

Info

Publication number
JPS6190252U
JPS6190252U JP17611084U JP17611084U JPS6190252U JP S6190252 U JPS6190252 U JP S6190252U JP 17611084 U JP17611084 U JP 17611084U JP 17611084 U JP17611084 U JP 17611084U JP S6190252 U JPS6190252 U JP S6190252U
Authority
JP
Japan
Prior art keywords
waterway
cooling
circuit board
printed circuit
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17611084U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17611084U priority Critical patent/JPS6190252U/ja
Publication of JPS6190252U publication Critical patent/JPS6190252U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による装置の一実施例を示す断
面図、第2図はクーリングヘツダの一部の平面図
、第3図は本考案の他の実施例の一部を示す断面
図である。 図中、1はプリント基板、2,2…はパツケー
ジ、3はクーリングヘツダ、4,4…は伝導端子
、5は水路、5a,5a…は端子連通用の孔、5
b,5b…は接続用の孔、6はベローズ、7は接
触片、8はノズル、をそれぞれ示す。
Fig. 1 is a sectional view showing one embodiment of the device according to the present invention, Fig. 2 is a plan view of a part of the cooling header, and Fig. 3 is a sectional view showing a part of another embodiment of the invention. be. In the figure, 1 is a printed circuit board, 2, 2... are a package, 3 is a cooling header, 4, 4... are conductive terminals, 5 is a water channel, 5a, 5a... are holes for terminal communication, 5
b, 5b, . . . indicate connection holes, 6 a bellows, 7 a contact piece, and 8 a nozzle, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板と対向配置されるクーリングヘツ
ダに冷却水路を構成し、該クーリングヘツダに上
記プリント基板のパツケージに接触するための伝
導端子を上記水路と連通して立設するものにおい
て、上記クーリングヘツダの水路を三角波の如く
構成し、上記伝導端子内部にノズルの一端を水路
入口に連通し他端を接触片に向けて設けたことを
特徴とする集積回路パツケージの伝導冷却装置。
A cooling waterway is formed in a cooling header disposed opposite to a printed circuit board, and a conductive terminal for contacting a package of the printed circuit board is provided upright in the cooling header in communication with the waterway. 1. A conduction cooling device for an integrated circuit package, characterized in that the waterway of the tube is configured like a triangular wave, and one end of a nozzle is provided inside the conduction terminal, one end of which communicates with the waterway inlet, and the other end of which faces the contact piece.
JP17611084U 1984-11-20 1984-11-20 Pending JPS6190252U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17611084U JPS6190252U (en) 1984-11-20 1984-11-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17611084U JPS6190252U (en) 1984-11-20 1984-11-20

Publications (1)

Publication Number Publication Date
JPS6190252U true JPS6190252U (en) 1986-06-12

Family

ID=30733707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17611084U Pending JPS6190252U (en) 1984-11-20 1984-11-20

Country Status (1)

Country Link
JP (1) JPS6190252U (en)

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